System and method for fluid cooling of electronic devices installed in an enclosure

ABSTRACT

A system and method for cooling electronic devices disposed within the inner volume of an enclosure. The inner volume of the enclosure contains one or more single phase or multi-phase thermally conductive fluids and may contain solid or sealed hollow structures that displace and direct thermally conductive fluids.

RELATED APPLICATION

This application is a continuation-in-part of U.S. patent applicationSer. No. 16/056,242, filed on Aug. 6, 2018 and entitled “SYSTEM ANDMETHOD FOR FLUID COOLING OF ELECTRONIC DEVICES INSTALLED IN A SEALEDENCLOSURE”, now issued as U.S. Pat. No. 10,398,063, issued on Aug. 27,2019, which is a continuation-in-part of U.S. patent application Ser.No. 15/640,520, filed on Jul. 1, 2017 and entitled “SYSTEM AND METHODFOR FLUID COOLING OF ELECTRONIC DEVICES INSTALLED IN A SEALEDENCLOSURE”, now issued as U.S. Pat. No. 10,045,467, issued on Aug. 7,2018, which is a continuation-in-part of U.S. patent application Ser.No. 15/400,946, filed on Jan. 6, 2017 and entitled “SYSTEM AND METHODFOR FLUID COOLING OF ELECTRONIC DEVICES INSTALLED IN A SEALEDENCLOSURE”, now issued as U.S. Pat. No. 9,699,939, issued on Jul. 4,2017, which is a continuation-in-part of U.S. patent application Ser.No. 15/225,787, filed on Aug. 1, 2016 and entitled “SYSTEM AND METHODFOR FLUID COOLING OF ELECTRONIC DEVICES INSTALLED IN A SEALEDENCLOSURE”, now issued as U.S. Pat. No. 9,560,789, issued on Jan. 31,2017, which is a continuation-in-part of U.S. patent application Ser.No. 14/986,786, filed on Jan. 4, 2016 and entitled “SYSTEM AND METHODFOR FLUID COOLING OF ELECTRONIC DEVICES INSTALLED IN A SEALEDENCLOSURE”, now issued as U.S. Pat. No. 9,408,332, issued on Aug. 2,2016, which is a continuation-in-part of U.S. patent application Ser.No. 14/749,615, filed on Jun. 24, 2015 and entitled “APPARATUS ANDMETHOD FOR FLUID COOLING OF ELECTRONIC DEVICES INSTALLED IN ANENCLOSURE”, now issued as U.S. Pat. No. 9,258,926, issued on Feb. 9,2016, which claims priority of U.S. Provisional 62/016,638, filed onJun. 24, 2014 and entitled “FLUID COOLING OF ELECTRONIC DEVICESINSTALLED IN A SEALED ENCLOSURE”, and U.S. Provisional 62/060,290, filedon Oct. 6, 2014 and entitled “SYSTEM AND METHOD FOR FLUID COOLING OFELECTRONIC DEVICES INSTALLED IN A SEALED ENCLOSURE”, all of which arehereby incorporated by reference in their entirety.

TECHNICAL FIELD

This disclosure relates to a system and method for cooling electronicdevices, including but not limited to computer systems, by installingthe electronic devices in a fluid-tight enclosure, said enclosureconstructed with various configurations of heat exchange and pressurecontrol mechanisms.

BACKGROUND

Electronic devices generate significant amounts of thermal energy duringoperation. The functional lifetime of electronic devices issignificantly diminished by excess heat buildup. Therefore, a number ofmethods have been presented to remove thermal energy from electronicdevices and reject it into an external environment. Since the beginningsof electronic devices, air movement over these devices has been theprimary means of heat removal. For example, in the early large-scalecomputing systems of the 1940s and 1950s, heat dissipation consistedprimarily of ventilation apertures in housings, followed by ambient-airfans and blowers which cooled by forced air convection. Even today,refined versions of these early air-based heat dissipation systems arethe most common means of electronic device and computer systems cooling.In air-based heat dissipation systems, air within a device enclosure isheated by the electronic device and internal fans expel heated air intothe immediate environment around the device. The environment around thedevice is typically maintained with regards to temperature, humidity,and particulate matter, by using compression-based heat exchange withthe outside environment. This process is effective and in common use fornon-stop electronic devices such as computer servers. Although thisprocess is effective, it is complex process with a number of systemsthat must be constantly maintained to produce the desired environmentthus having high construction and operational costs. For example,air-based cooling relies on a) the proper operation of fans to circulateair inside the device enclosure, in the server room, and in outsidecondensers, b) a very clean environment free of most dust andparticulates, c) proper humidity control, and d) costly “white space” inthe server room to allow human access to electronic devices for repairand maintenance. Air based cooling faces significant risks from a)internal fan and cooling failures, b) server room cooling failures andinconsistencies, c) fire control systems, d) unauthorized human access,e) maintenance failures and mistakes, and f) natural disasters. Takentogether, these factors typically require specialized and costlyinstallation space for electronic devices such as computer servers.Further, air-based cooling of electronic systems can double the totalamount of electrical energy required to operate these systems, resultingin a costly and wasteful means of operating such systems.

Noting the inefficiencies and problems with air-based heat dissipation,designs begin to arise in the 1960s and 1970s that took advantage of themuch higher thermal conductivity of liquids, which typically conductheat ten to one hundred times more rapidly than gases. Liquid vaporcooling of individual semiconductors and other solid state componentswas disclosed by Davis in U.S. Pat. No. 3,270,250, and in U.S. Pat. No.3,524,497, Chu et. al. disclose a double-walled container forcomponent-level electronics, with liquid flow in the space between thewalls. The predominance of such designs focused on component levelcooling of larger systems.

As individual CPU processing speed and power increased during the 1980s,inventors continued to disclose methods for additional coolingcapability in electronic assemblies. Many of these disclosures relatedto component level cooling, but a few began to focus on system levelliquid cooling. Cray, in U.S. Pat. No. 4,590,538 (1986), discloses ameans of immersing an entire electronic assembly in coolant liquid, andcirculating the liquid out of the assembly container for the purpose ofthermal energy removal. Numerous other methods of liquid cooling ofcomponents and component assemblies continued to be disclosed throughoutthe 1990s. In the late 2000s, the liquid cooling designs from the 1980sand 1990s were applied to individual servers and computing systems.These innovations were followed by modifications and improvements whichincorporated liquid cooling elements into the structural design ofcomputing systems rather than individual modules or computing units. Forexample, in U.S. Pat. No. 8,351,206, Campbell et. al. disclose aliquid-cooled electronics rack with immersion-cooled electronics and avertically mounted vapor condensation unit attached to or adjacent tothe electronics rack.

Olsen, et. al. describe in U.S. Pat. No. 8,416,572 a design for multipleelectronic devices connected in an array, thermally coupled to a flowingliquid. In U.S. Pat. No. 8,467,189 and related following patentsAttlesey discloses designs for an array of rack-mounted plurality ofcases for electronics systems; each case contains a dielectric fluid forheat conduction, and the rack system incorporates a manifold for liquidcirculation through the plurality of cases, with a pump and heatexchanger incorporated into the fluid circulation loop. Best et. al.disclose, in U.S. Patent Application 2011/0132579 a design in which aseries of horizontally oriented computer server racks are submerged in aliquid tank containing a dielectric cooling fluid that is circulatedfrom the tank to a remote heat exchanger and back into the tank.

One of the significant improvements of liquid cooling over air coolingis the ability to transport heat from the electronic device or systemdirectly to the heat rejection environment without significantlyaffecting the human inhabited space in the server room thus dramaticallyincreasing the heat transport efficiency while reducing the number ofcooling processes and preventing excess heat diffusion. However, theseprocesses have not seen widespread adoption for one or more possiblereasons. Component level liquid cooling designs tend to introducesignificant complexity to operations and maintenance while increasingserver room risks to coolant leaks and failures. System level liquidcooling designs reduce the overall number of cooling interconnects, buthave similar problems. To further complicate the liquid cooling serverroom installations, liquid cooled systems require new server roomprocedures, operations, and training and expose owner and operators toadditional liabilities from liquid damage. And notably, productionelectronic devices and servers are rarely available in liquid coolingconfigurations. Succinctly, the cost savings associated with currentliquid cooling designs are overshadowed by the increased costs ofpurchasing, constructing, and operating liquid cooled servers andsolutions.

Significantly, it is the widespread usage of virtualized computingresources that is allowing greater innovation and deployment of fluidcooled electronic devices and servers. Virtualization of data resourcesallows data to be stored on many redundant devices. Virtualization ofcompute resources allows the functional compute unit of a “server” tobecome a software unit that can be moved from one physical computer toanother. Individual electronic devices and servers may fail over time,but the virtualized nature of software based compute and storage unitsmean that an individual failures only slightly decreases the overallcapability of a collection of servers but in no way compromises the dataprocessing, storage, and communication functions as a whole. Therefore,since it is no longer necessary to maintain or repair a specificphysical server in order to maintain a given operation, fluid cooling ofelectronic devices in a sealed enclosure is enabling cost reductions,operational efficiencies, increased security, and extended longevity ofelectronic devices and servers.

The innovations as disclosed herein overcome problems inherent to bothtraditional air-cooled and liquid-cooled electronic devices and systems.Significant benefits comprise a) high efficiency cooling and heatexchange reducing overall energy usage by up to 50%, b) no maintenancerequired, c) devices and systems can be installed in almost anyenvironment such as a traditional data center, high rise office,industrial building, offshore installation, underground installation,and ambient air data center, d) increasing server density up to 3x thecurrent high-density server deployments thus reducing the amount ofserver room space required, e) improved physical security, f) improvedEMI/RFI security, g) decreased labor costs, h) more protection againstdisasters such as fire, hurricane, and earthquake, i) fewer maintenancefailures and mistakes, j) tamper-resistant to unauthorized human access,k) reduced or eliminated damage due to fire control systems, l) nearlysilent in operation, m) internal components have cooler averagetemperature that will increase the life of the system, and n) imperviousto environmental factors such as dust and humidity.

These and other benefits disclosed herein combine together to createentirely new classes of solutions. For example, innovation in the fluidcooling of electronic devices as disclosed herein, and innovations thatallow for a broader range of installation environments are disclosed bySmith in U.S. Patent Appl. No. 2015/0000319 (January 2015) arechallenging the assumptions and designs of data centers and serverrooms.

Unless specifically stated as such, the preceding is not admitted to beprior art and no statement appearing in this section should beinterpreted as a disclaimer of any features or improvements listed.

BRIEF DESCRIPTION OF THE INVENTION

Various embodiments of a system and method for fluid cooling ofelectronic devices installed in sealed enclosures are disclosed herein.

At least one embodiment described herein provides a cooling system forelectronic devices installed in a sealed enclosure. Such embodiments areoptimized for effective and efficient direct and indirect transfer ofthermal energy away from heat-generating electronics into thesurrounding environment. Designs embody enclosing structures comprisedof walls that enclose an interior sealed space containing heatgenerating components and a dielectric thermally conductive fluid(“primary dielectric thermally conductive fluid”). The enclosure may becomprised of single wall construction that enclose an inner volume ormay be comprised of inner, outer, and optional intermediate walls.Secondary thermally conductive fluids may be circulated within theenclosure walls and/or through an inner heat exchange mechanism to anexternal local or remote heat exchange loop. The inner volume of theenclosure may optionally contain a heat exchange mechanism though whicha secondary thermally conductive fluid is circulated to an externallocal or remote heat exchange loop. The sealed enclosure may be locatedin a variety of environments comprising raised or slab floordatacenters, commercial buildings, residential buildings, outdoorlocations, subsurface structures, and direct subsurface installation.The design leads to significant reductions in capital, infrastructure,power, cooling, maintenance, and operational costs associated withdeploying computing hardware. In addition, the design provides for ahigh degree of physical, electrical, and magnetic security for theenclosed electronics.

Electronic devices may be disposed within the interior of the sealedenclosure in a variety of configurations to facilitate thermal transferand best practice process efficiency. The enclosed electronic devicesdissipate internally generated heat into the inner volume, the primarydielectric thermally conductive fluid, optional inner heat exchanger,and the inner thermally conductive walls of the sealed enclosure. Thewalls of the enclosure may be thermally connected by mechanicalconnection or other means. Cooling fins may be affixed to any wallsurfaces to aid in heat transport and dissipation. Any wall surfaces mayhave surface features of various dimensionality to aid in heat transportand dissipation.

In embodiments with a plurality of enclosing walls, the sealed enclosurecomprises a unit with an inner volume formed by a plurality of wallswhich form one or more enclosing volumes within said walls. The innervolume contains a single phase or multi-phase primary dielectricthermally conductive fluid in which electronic devices to be cooled areimmersed and/or surrounded as well as an optional heat exchangemechanism through which is circulated a single phase or multi-phasesecondary thermally conductive fluid (“secondary thermally conductivefluid”). Optionally, located between any two surfaces of the enclosurewalls are structures that comprise one or more channels that contain asingle phase or multi-phase secondary thermally conductive fluid. Innerand intermediate walls are thermally conductive and are optimized bycomposition and construction to provide for optimal heat transfer awayfrom the inner volume. In embodiments in which the enclosure iscomprised of single wall construction that enclose an inner volume, theinner volume contains a single phase or multi-phase primary dielectricthermally conductive fluid in which electronic devices to be cooled areimmersed and/or surrounded as well as an optional heat exchangemechanism through which is circulated a single phase or multi-phasesecondary thermally conductive fluid.

Some embodiments may use multiple enclosed and segregated secondarythermally conductive fluids by using intermediate walls or heatexchangers in the inner volume for the purpose of optimizing the thermalrequirements. Secondary thermally conductive fluid(s) may be presentedto one or more heat exchange mechanisms for the purpose of removing heatfrom the fluid(s). Heat exchange may be accomplished by a variety ofmeans to one or more external heat sink systems that may be of varioustypes including ventilation, compression, evaporation, absorption, orgeothermal systems. The heat exchange system may reject heat directlyinto the immediate environment of the sealed enclosure via passive orforced circulation, or fluid may be circulated away from the sealedenclosure, cooled in a remote location, and then re-circulated back tothe sealed enclosure at a lower temperature. The outer exterior wallsmay be thermally conductive or thermally insulating. Various and diversethermally conductive fluids may be used to support the cooling ofelectronic devices within a sealed enclosure at a particularthermodynamic rate. For example, an embodiment could use a multi-phasethermally conductive fluid that allows rapid dissipation of the heatfrom high temperature electronic devices such as a computer with CPUswhile other embodiments could use a single phase thermally conductivefluid for general heat transfer of lower powered electronic devices.

The sealed enclosure has fluid-tight entrances from the outer surface tothe inner volume for power, networking, and other control and monitoringsignals and functions. In addition, the sealed enclosure may optionallycomprise fluid-tight entrances from the outer surface to the innervolume for gaseous fluid exchange with the inner volume for the purposeof pressure equalization, fluid maintenance, and/or supplying motiveforce to kinetic process components located in said inner volume.

The sealed enclosure may contain pressure balancing mechanisms for thepurpose of maintaining suitable pressures of gaseous fluids in a volumeof the sealed container. To enhance the security of the electronicdevices in the sealed enclosure, a functional “poison pill” system maybe implemented to provide an electrical, magnetic, chemical, and/ormechanical means of rendering the electronic devices and any contentstored on those devices to be inoperable, unusable, or unreadable.

Multiple configuration options are described to optimize installation ofsealed enclosures into a variety of environments, such as homes,offices, businesses, datacenters, and specialty computing installations.The installation can be in any orientation and can be located in surfaceor sub-surface environments. Sealed enclosures be installed asstandalone units or may be stacked or grouped together to form astructural unit of any dimensionality in a high-density configuration.

In general, the sealed enclosure described contains no user serviceableelectronic devices. The devices are typically used until they are nolonger useful at which point they are completely replaced. Typicallythese units are deployed in multiples and utilize system designs thatallow for redundant failover of non-functioning devices.

These and other aspects of the disclosed subject matter, as well asadditional novel features, will be apparent from the descriptionprovided herein. The intent of this summary is not to be a comprehensivedescription of the claimed subject matter, but rather to provide a shortoverview of some of the subject matter's functionality. Other systems,methods, features and advantages here provided will become apparent toone with skill in the art upon examination of the following FIGS anddetailed description. It is intended that all such additional systems,methods, features and advantages that are included within thisdescription, be within the scope of the claims.

BRIEF DESCRIPTION OF FIGURES

The features characteristic of the invention are set forth in theclaims. However, the invention itself and further objectives andadvantages thereof, will best be understood by reference to thefollowing detailed description when read in conjunction with theaccompanying drawings in which the left-most significant digit(s) in thereference numerals denote(s) the first figure in which the respectivereference numerals appear, wherein:

FIG. 1 shows a conceptual view of a sealed enclosure design comprisingouter and inner enclosure walls that enclose electronic devices, aprimary dielectric thermally conductive fluid, and optional heatexchange mechanism in the inner volume and a secondary thermallyconductive fluid within the walls according to an embodiment of thedisclosed subject matter.

FIG. 2 shows a conceptual view of a sealed enclosure design comprisingouter, intermediate, and inner enclosure walls that enclose electronicdevices, a primary dielectric thermally conductive fluid, and optionalheat exchange mechanism in the inner volume and one or more secondarythermally conductive fluids and optional heat exchange mechanism withinthe walls according to an embodiment of the disclosed subject matter.

FIG. 3 shows a conceptual view of a single port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure, optional heat exchange mechanisms, and optional primarydielectric thermally conductive fluid pump circulation mechanismsaccording to an embodiment of the disclosed subject matter.

FIG. 4 shows a conceptual view of a dual port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure, optional heat exchange mechanisms, and optional primarydielectric thermally conductive fluid pump circulation mechanismsaccording to an embodiment of the disclosed subject matter.

FIG. 5 shows a conceptual view of a dual port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure, optional heat exchange mechanisms, and optional pressurizedgaseous fluid driven primary dielectric thermally conductive fluid pumpand bubbler circulation mechanisms according to an embodiment of thedisclosed subject matter.

FIG. 6 shows a conceptual view of a pressure balancing mechanism withoptional dual port pressure balancing mechanism used to relieve positiveand negative pressures in a sealed enclosure, optional heat exchangemechanisms, and optional primary dielectric thermally conductive fluidpump circulation mechanisms according to an embodiment of the disclosedsubject matter.

FIG. 7 shows a conceptual view of a pressure balancing mechanism withdual port pressure balancing mechanism used to relieve positive andnegative pressures in a sealed enclosure, optional heat exchangemechanisms, and optional pressurized gaseous fluid driven primarydielectric thermally conductive fluid pump and bubbler circulationmechanisms according to an embodiment of the disclosed subject matter.

FIG. 8 shows a conceptual view of a dual port pressure balancingmechanism and/or a pressure balancing mechanism used to relieve positiveand negative pressures in the intermediate wall of a sealed enclosureand optional primary dielectric thermally conductive fluid pumpcirculation mechanisms according to an embodiment of the disclosedsubject matter.

FIG. 9 shows a conceptual view of a sealed enclosure design comprisingenclosure walls that enclose electronic devices, a primary dielectricthermally conductive fluid, and an optional heat exchange mechanism inthe inner volume that contains a secondary thermally conductive fluidaccording to an embodiment of the disclosed subject matter.

FIG. 10 shows a conceptual view of a single port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure and optional primary dielectric thermally conductive fluidpump circulation mechanisms according to an embodiment of the disclosedsubject matter.

FIG. 11 shows a conceptual view of a dual port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure and optional primary dielectric thermally conductive fluidpump circulation mechanisms according to an embodiment of the disclosedsubject matter.

FIG. 12 shows a conceptual view of a dual port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure and optional pressurized gaseous fluid driven primarydielectric thermally conductive fluid pump and bubbler circulationmechanisms according to an embodiment of the disclosed subject matter.

FIG. 13 shows a conceptual view of a pressure balancing mechanism withoptional dual port pressure balancing mechanism used to relieve positiveand negative pressures in a sealed enclosure and optional primarydielectric thermally conductive fluid pump circulation mechanismsaccording to an embodiment of the disclosed subject matter.

FIG. 14 shows a conceptual view of a pressure balancing mechanism withdual port pressure balancing mechanism used to relieve positive andnegative pressures in a sealed enclosure and optional pressurizedgaseous fluid driven primary dielectric thermally conductive fluid pumpand bubbler circulation mechanisms according to an embodiment of thedisclosed subject matter.

FIG. 15 shows a conceptual view of channels to direct the flow ofprimary dielectric thermally conductive fluid within an enclosureaccording to an embodiment of the disclosed subject matter.

FIG. 16 shows a conceptual view of channels to direct the flow ofprimary dielectric thermally conductive fluid within an enclosureaccording to an embodiment of the disclosed subject matter.

FIG. 17 shows a conceptual view of structures for the volumetricdisplacement of primary dielectric thermally conductive fluid within anenclosure according to an embodiment of the disclosed subject matter.

FIG. 18 shows a conceptual view of mechanisms that provide a means ofrendering a portion of the electronic devices with a sealed enclosureinoperable according to an embodiment of the disclosed subject matter.

FIG. 19 shows a conceptual view of an enclosure group comprised of morethan one sealed enclosure according to an embodiment of the disclosedsubject matter.

FIG. 20 shows a conceptual view of a sealed enclosure within anenclosure according to an embodiment of the disclosed subject matter.

FIG. 21 shows a conceptual view of a sealed enclosure combined with anenclosure according to an embodiment of the disclosed subject matter.

FIG. 22 shows an embodiment of a structure for the volumetricdisplacement of primary dielectric thermally conductive fluid within anenclosure according to an embodiment of the disclosed subject matter.

FIG. 23A shows a view of an embodiment of a structure for the volumetricdisplacement of primary dielectric thermally conductive fluid within anenclosure according to an embodiment of the disclosed subject matter.

FIG. 23B shows a view of an embodiment of a structure for the volumetricdisplacement of primary dielectric thermally conductive fluid within anenclosure according to an embodiment of the disclosed subject matter.

FIG. 23C shows a view of an embodiment of a structure for the volumetricdisplacement of primary dielectric thermally conductive fluid within anenclosure according to an embodiment of the disclosed subject matter.

DETAILED DESCRIPTION

Although described with reference to certain embodiments, those withskill in the art will recognize that the disclosed embodiments haverelevance to a wide variety of areas in addition to those specificexamples described below. Further, elements from one or more embodimentsmay be used in other embodiments and elements may be removed from anembodiment and remain within the scope of this disclosure.

All references, including publications, patent applications, andpatents, cited herein are hereby incorporated by reference to the sameextent as if each reference were individually and specifically indicatedto be incorporated by reference and were set forth in its entiretyherein; provided, however, to the extent there exists a conflict betweenthis disclosure and a document incorporated by reference, thisdisclosure shall control.

As referenced herein, the term “sealed” is the past tense of “seal”which means to close as to make predominately secure against ingress oregress.

As referenced herein, the terms “sealed enclosure” and “containmentvessel” are used interchangeably.

As referenced herein, an “enclosure group” is comprised of sealedenclosures that are grouped together to form a structural unit of anydimensionality.

As referenced herein, the terms “electronic device”, “electronicdevices”, “computer”, “computer systems”, “computer cluster”, “physicalcomputer”, “computer server”, and “server” are used interchangeably, andunless otherwise specified comprise any electronic components that areconfigured to function as one or more independent electronic systems.

As referenced herein, a single phase thermally conductive fluid isdefined as a liquid or a gas that remains in a single phase, eitherliquid or gas, across the entire range of operational temperatures andpressures of the electronic devices and/or systems disposed within thesealed enclosure.

As referenced herein, a multi-phase thermally conductive fluid isdefined as a fluid that changes phase from a liquid to a gas at atemperature and pressure within the range of operational temperaturesand pressures of the electronic devices and/or systems disposed withinthe sealed enclosure.

FIG. 1 shows a conceptual view of a sealed enclosure design comprisinginner enclosure wall 101 and outer enclosure wall 103 that encloseelectronic devices 104 and a primary dielectric thermally conductivefluid 106, 108 in the inner volume 150, a secondary thermally conductivefluid 120 within the volume between the inner enclosure wall 101 andouter enclosure wall 103, and optional heat exchange mechanisms 135, 145in the inner volume 150 that contain a secondary thermally conductivefluid 120, 148. The inner volume 150 contains a single phase ormulti-phase primary dielectric thermally conductive fluid 106, 108 inwhich electronic devices 104 to be cooled are immersed or surrounded.The single phase or multi-phase primary dielectric thermally conductivefluid 106, 108 may be in a predominately liquid phase, gaseous phase, orin a combination liquid phase and gaseous phase. In an embodiment thatcomprises a single phase primary dielectric thermally conductive fluid106 in the gaseous phase, said fluid will fill the entirety of innervolume 150. In an embodiment that comprises a single phase primarydielectric thermally conductive fluid 106 in the liquid phase, saidfluid may fill the entirety of inner volume 150 or may fill less thanthe entirety of inner volume 150 with the remaining volume filled by atleast one separate and distinct fluid in the gaseous phase 108. In anembodiment that comprises a multi-phase primary dielectric thermallyconductive fluid 106, said fluid may fill the entirety of inner volume150 with portions of said fluid existing in the liquid phase 106 andportions of said fluid existing in the gaseous phase 108 in varyingproportions relative to the temperature, pressure, and composition ofsaid multi-phase primary dielectric thermally conductive fluid 106 andif said multi-phase primary dielectric thermally conductive fluid 106,108 fills less than the entirety of inner volume 150, the remainingvolume may be filled by at least one separate and distinct fluid in thegaseous phase 108.

Embodiments of the disclosed sealed enclosure may be configured withsingle phase or multi-phase thermally conductive fluids. A single phasethermally conductive fluid will transfer heat using the principles ofconvection and conduction. A multi-phase thermally conductive fluid willtransfer heat using the principles of convection, conduction, and phasechange. As the multi-phase thermally conductive fluid in the liquidphase absorbs heat, a portion of said fluid is converted to the gaseousphase. Conversely, as the multi-phase thermally conductive fluid in thegaseous phase gives up heat by various heat exchange processes, aportion of said multi-phase thermally conductive fluid in the gaseousphase condenses back into multi-phase thermally conductive fluid in theliquid phase. If the amount of fluid in the gaseous phase 108 exceedsthe volume of space internal to the sealed enclosure that is unoccupiedby the multi-phase thermally conductive fluid in the liquid phase 106,said fluid in the gaseous phase 108 will exert a positive pressureinside the inner volume 150 of the sealed enclosure. Conversely, if theamount of fluid in the gaseous phase 108 is less than the volume ofspace internal to the sealed enclosure that is unoccupied by themulti-phase thermally conductive fluid in the liquid phase 106, saidfluid in the gaseous phase 108 will exert a negative pressure inside theinner volume 150 of the sealed enclosure. In addition, some amount ofmulti-phase thermally conductive fluid in the gaseous phase 108 andoptional other distinct and suitable compressible gaseous fluid mayexist in a space of the sealed enclosure for various purposes comprisingcushioning positive and negative pressures in the sealed enclosure,maintaining a headspace in a specified range of pressure as temperaturevaries, displacing thermally conductive fluid to allow weightadjustments to the overall sealed enclosure, and/or allowingaccumulation of gaseous fluid used to drive internal kinetic processesor gaseous based mixing functionality. A single phase thermallyconductive fluid may either completely or partially fill a space of thesealed enclosure and any space in the sealed enclosure that is notfilled by said single phase thermally conductive fluid may be filledwith a distinct and suitable compressible gaseous fluid for variouspurposes comprising cushioning positive and negative pressures in thesealed enclosure, maintaining a headspace in a specified range ofpressure as temperature varies, displacing thermally conductive fluid toallow weight adjustments to the overall sealed enclosure, and/orallowing accumulation of gaseous fluid used to drive internal kineticprocesses or gaseous based mixing functionality.

The walls of the sealed enclosure are constructed with inner enclosurewall 101 and outer enclosure wall 103 and connected to form channelsaround the inner enclosure walls 101 such that a secondary single phaseor multi-phase thermally conductive fluid 120 may be circulated withinthe volume contained between said enclosure walls to an external localor remote heat exchanger assembly 130 via connecting lines 132, 134. Inan another embodiment, the channels that are formed around the innerenclosure walls 101 may be constructed of conduit or piping that isthermally connected to the inner wall 101 in a path of optimal geometrysuch that a) a secondary single phase or multi-phase thermallyconductive fluid 120 may be circulated within the conduit to an externallocal or remote heat exchanger assembly 130 via connecting lines 132,134, and b) said conduit may be disposed between the inner enclosurewall 101 and outer enclosure wall 103 or said conduit is considered tobe the outer enclosure wall 103.

Secondary single phase or multi-phase thermally conductive fluids 120,148 may be in a predominately liquid phase, gaseous phase, or in acombination liquid phase and gaseous phase. In an embodiment thatcomprises a secondary single phase thermally conductive fluid 120 in thegaseous phase or the liquid phase, said fluid may fill the entirety ofthe space between the inner enclosure wall 101 and outer enclosure wall103. In an embodiment that comprises a secondary multi-phase thermallyconductive fluid 120, said fluid may partially or completely fill theentirety of the space between the inner enclosure wall 101 and outerenclosure wall 103 with portions of said fluid existing in the liquidphase and portions of said fluid existing in the gaseous phase invarying proportions relative to the temperature, pressure, andcomposition of said secondary multi-phase thermally conductive fluid120.

One or more optional heat exchange mechanisms 135 may be disposed withinthe inner volume 150 such that a secondary single phase or multi-phasethermally conductive fluid 120 is segregated from the primary dielectricthermally conductive fluid 106, 108 and may be circulated through heatexchange mechanism 135 to an external local or remote heat exchangerassembly 130 via connecting lines 132, 134. One or more optional heatexchange mechanisms 145 may be disposed within the inner volume 150 suchthat a secondary single phase or multi-phase thermally conductive fluid148 is segregated from the primary dielectric thermally conductive fluid106, 108 and may be circulated through heat exchange mechanism 145 to anexternal local or remote heat exchanger assembly 140 via connectinglines 142, 144.

Heat exchange mechanisms 135, 145 may be disposed within the primarydielectric thermally conductive fluid liquid phase 106 and/or thegaseous phase 108 as heat exchange mechanisms comprising concentrictube, shell and tube, plate, fin, plate-fin, tube-fin, condenser tubing,loops, and split-flow loops. Heat exchange mechanisms 135, 145 may bethermally and/or mechanically attached or isolated from enclosure walls101. Heat exchange mechanisms 135, 145 may be thermally and/ormechanically connected to portions of the enclosed electronic devices104.

Electronic devices 104 may be disposed within the inner volume 150 ofthe sealed enclosure in a variety of configurations to facilitatethermal transfer and best practice process efficiency. The enclosedelectronic devices 104 dissipate internally generated heat into theinner volume 150, the primary dielectric thermally conductive fluid 106,and the inner thermally conductive walls 101 of the sealed enclosure. Aportion of the heat is transported from the inner enclosure wall 101 ofthe sealed enclosure to one or more secondary thermally conductivefluids 120 within the walls 101, 103 of the enclosure. The secondarythermally conductive fluid 120 is circulated between the walls 101, 103where heat is transferred to the secondary thermally conductive fluid120 and the outer enclosure wall 103. The secondary thermally conductivefluid 120 may also be circulated through the optional heat exchangemechanism 135. The secondary thermally conductive fluid 120 iscirculated away from the sealed enclosure via a fluid-tight pipingconnection 132, is presented to one or more heat exchanger assemblies130 for the purpose of removing heat from the fluid, and returned to thesealed enclosure via a fluid-tight piping connection 134. The secondarythermally conductive fluid 120: a) is circulated within the walls 101,103 of the sealed enclosure where internal heat is absorbed; b) isremoved from within the walls 101, 103 of the sealed enclosure andcirculated through a heat exchange assembly 130 where a portion of theheat is removed from the thermally conductive fluid 120; and c) isreturned to within the walls 101, 103 of the sealed enclosure. Thesecondary thermally conductive fluid 120 is circulated in such a fashionas to provide appropriate heat removal from the sealed enclosure andheat exchange may be accomplished by a variety of means to one or moreexternal heat sink systems 130 that may be of various types includingventilation, compression, evaporation, and geothermal systems. The heatexchange system 130 may reject heat directly into the immediateenvironment via passive or forced circulation, or the fluid may becirculated away from the sealed enclosure, cooled in a remote location,and then re-circulated back to the sealed enclosure at a lowertemperature.

The optional secondary thermally conductive fluid 148: a) is circulatedwithin a heat exchanger mechanism 145 disposed in inner volume 150 whereinternal heat is absorbed from within inner volume 150; b) is removedfrom a heat exchange mechanism 145 and circulated through a heatexchange assembly 140 where a portion of the heat is removed from thethermally conductive fluid 148; and c) is returned to a heat exchangemechanism 145. The secondary thermally conductive fluid 148 iscirculated in such a fashion as to provide appropriate heat removal fromthe sealed enclosure and heat exchange may be accomplished by a varietyof means to one or more external heat sink systems 140 that may be ofvarious types including ventilation, compression, evaporation, andgeothermal systems. The heat exchange system 140 may reject heatdirectly into the immediate environment via passive or forcedcirculation, or the fluid may be circulated away from the sealedenclosure, cooled in a remote location, and then re-circulated back tothe sealed enclosure at a lower temperature.

The inner enclosure wall 101 is thermally conductive and is optimized bycomposition and construction to provide for optimal heat transfer awayfrom the inner volume 150. The outer enclosure wall 103 may thermallyconductive or thermally insulating. Portions of the enclosure walls 103may be optionally bonded to additional materials that facilitateenhanced thermal conduction or thermal insulation of the enclosure walls103. The walls 101, 103 of the enclosure may be thermally connected bymechanical connection or other means. Cooling fins may be affixed to thewall surfaces 101, 103 to aid in heat transport and dissipation. Wallsurfaces 101, 103 may have surface features of various dimensionality toaid in heat transport and dissipation. The sealed enclosure hasfluid-tight entrances 110 from the outer surface to the inner volume 150for power, networking, and other control and monitoring signals andfunctions which are appropriately connected to one or more electronic orother functional devices disposed in the inner volume 150 of the sealedenclosure.

The optional heat exchange circuit comprised of heat exchange assembly130, fluid-tight piping connection 132, 134, heat exchange mechanism135, and secondary thermally conductive fluid 120 is separate anddistinct from the optional heat exchange circuit comprised of heatexchange assembly 140, fluid-tight piping connection 142, 144, heatexchange mechanism 145, and secondary thermally conductive fluid 148.Each heat exchange circuit is configured to effect heat removal from theinner volume 150 by using predetermined optimal loop operatingtemperatures and conditions. Each heat exchange circuit is configuredwith a heat exchange mechanism 135, 145 that is configured to provideredundant, tiered, primary, and/or secondary heat removal from the innervolume 150.

The sealed enclosure may optionally comprise heat exchange, control,pressure balancing, fluid maintenance, and/or fluid circulationfunctionality as described in FIGS. 3, 4, 5, 6, 7. Embodiment variationsand details described herein apply equally to sealed enclosures with orwithout an interior 108 fluid head space. The sealed enclosure mayoptionally comprise one or more channels disposed in the inner volume150 as described in FIGS. 15, 16. The sealed enclosure may optionallycomprise one or more spacers disposed in the inner volume 150 of thesealed enclosure as described in FIG. 17. The sealed enclosure mayoptionally comprise one or more mechanisms in the inner volume 150 torender the electronic devices and any content stored on those devices tobe inoperable, unusable, or unreadable as described in FIG. 18.

The sealed enclosure may be located either adjacent to or remote fromany heat exchange assemblies 130, 140 and/or pressure balancing systemsand appropriate fluid transport channels between said locations areconfigured based optimal fluid flow and thermodynamic designs for theselected fluids. Further, any heat exchange assemblies 130, 140 and/orpressure balancing systems may perform their indicated functions for oneor more sealed enclosures.

Sealed enclosures can be installed in any orientation, placed asstandalone units or stacked or grouped together to form a structuralunit of any dimensionality in a high-density configuration. An enclosuregroup may be disposed within a sealed or unsealed enclosure and maycontain pressure balancing systems that are interior to such enclosureand exterior to sealed enclosures such that said pressure balancingsystems perform their indicated functions for one or more sealedenclosures. Sealed enclosures within an enclosure group may beconfigured such that any secondary thermally conductive fluid 120, 148is conducted through more than one sealed enclosure before the secondarythermally conductive fluid 120, 148 is circulated through a heatexchanger assembly 130, 140 where a portion of the heat is removed fromthe thermally conductive fluid 120, 148. Sealed enclosures within anenclosure group may be configured such that a pressure balancing systemfor a sealed enclosure within the enclosure group may be disposedinterior to another sealed enclosure within the enclosure group.

FIG. 2 shows a conceptual view of a sealed enclosure design comprisinginner enclosure wall 101, intermediate enclosure wall 202, and outerenclosure wall 103 that enclose electronic devices 104 and a primarydielectric thermally conductive fluid 106 in the inner volume 150, asecondary thermally conductive fluid 120 within the volume between theintermediate enclosure wall 202 and outer enclosure wall 103, one ormore secondary intermediate thermally conductive fluids 222 within thevolume between the inner enclosure wall 101 and intermediate enclosurewall 202, and optional heat exchange mechanisms 135, 145 in the innervolume 150 that contain a secondary thermally conductive fluid 222, 148.This embodiment is illustrated with a single intermediate enclosure wall202 and secondary intermediate thermally conductive fluid 222, but otherembodiments can contain multiple intermediate walls and fluids. Theinner volume 150 contains a single phase or multi-phase dielectricthermally conductive fluid 106, 108 in which electronic devices 104 tobe cooled are immersed or surrounded. The single phase or multi-phaseprimary dielectric thermally conductive fluid 106, 108 may be in apredominately liquid phase, gaseous phase, or in a combination liquidphase and gaseous phase. In an embodiment that comprises a single phaseprimary dielectric thermally conductive fluid 106 in the gaseous phase,said fluid will fill the entirety of inner volume 150. In an embodimentthat comprises a single phase primary dielectric thermally conductivefluid 106 in the liquid phase, said fluid may fill the entirety of innervolume 150 or may fill less than the entirety of inner volume 150 withthe remaining volume filled by at least one separate and distinct fluidin the gaseous phase 108. In an embodiment that comprises a multi-phaseprimary dielectric thermally conductive fluid 106, said fluid may fillthe entirety of inner volume 150 with portions of said fluid existing inthe liquid phase 106 and portions of said fluid existing in the gaseousphase 108 in varying proportions relative to the temperature, pressure,and composition of said multi-phase primary dielectric thermallyconductive fluid 106 and if said multi-phase primary dielectricthermally conductive fluid 106, 108 fills less than the entirety ofinner volume 150, the remaining volume may be filled by at least oneseparate and distinct fluid in the gaseous phase 108.

Embodiments of the disclosed sealed enclosure may be configured withsingle phase or multi-phase thermally conductive fluids. A single phasethermally conductive fluid will transfer heat using the principles ofconvection and conduction. A multi-phase thermally conductive fluid willtransfer heat using the principles of convection, conduction, and phasechange. As the multi-phase thermally conductive fluid in the liquidphase absorbs heat, a portion of said fluid is converted to the gaseousphase. Conversely, as the multi-phase thermally conductive fluid in thegaseous phase gives up heat by various heat exchange processes, aportion of said multi-phase thermally conductive fluid in the gaseousphase condenses back into multi-phase thermally conductive fluid in theliquid phase. If the amount of fluid in the gaseous phase 108 exceedsthe volume of space internal to the sealed enclosure that is unoccupiedby the multi-phase thermally conductive fluid in the liquid phase 106,said fluid in the gaseous phase 108 will exert a positive pressureinside the inner volume 150 of the sealed enclosure. Conversely, if theamount of fluid in the gaseous phase 108 is less than the volume ofspace internal to the sealed enclosure that is unoccupied by themulti-phase thermally conductive fluid in the liquid phase 106, saidfluid in the gaseous phase 108 will exert a negative pressure inside theinner volume 150 of the sealed enclosure. In addition, some amount ofmulti-phase thermally conductive fluid in the gaseous phase 108 andoptional other distinct and suitable compressible gaseous fluid mayexist in a space of the sealed enclosure for various purposes comprisingcushioning positive and negative pressures in the sealed enclosure,maintaining a headspace in a specified range of pressure as temperaturevaries, displacing thermally conductive fluid to allow weightadjustments to the overall sealed enclosure, and/or allowingaccumulation of gaseous fluid used to drive internal kinetic processesor gaseous based mixing functionality. A single phase thermallyconductive fluid may either completely or partially fill a space of thesealed enclosure and any space in the sealed enclosure that is notfilled by said single phase thermally conductive fluid may be filledwith a distinct and suitable compressible gaseous fluid for variouspurposes comprising cushioning positive and negative pressures in thesealed enclosure, maintaining a headspace in a specified range ofpressure as temperature varies, displacing thermally conductive fluid toallow weight adjustments to the overall sealed enclosure, and/orallowing accumulation of gaseous fluid used to drive internal kineticprocesses or gaseous based mixing functionality.

In one embodiment, the walls of the sealed enclosure are constructedwith inner enclosure wall 101, intermediate enclosure wall 202, andouter enclosure wall 103 and connected to form channels around the innerenclosure walls 101 such that additional and distinct thermallyconductive fluids 222, 120 may be circulated within the volume containedbetween said enclosure walls to an external local or remote heatexchanger assembly 130, 240 via connecting lines 132, 134, 242, 244. Inanother embodiment, remote heat exchanger assembly 240 is optionallyreplaced by an embodiment that is comprised of pressure balancing, fluidmaintenance, and/or fluid circulation functionality as described in FIG.8. In an another embodiment, the channels that are formed around theinner enclosure walls 101 may be constructed of conduit or piping thatis thermally connected to the inner wall 101 in a path of optimalgeometry such that a) a secondary single phase or multi-phase thermallyconductive fluid 222 may be circulated within the conduit to an externallocal or remote heat exchanger assembly 240 via connecting lines 242,244, and b) said conduit may be disposed between the inner enclosurewall 101 and intermediate enclosure wall 202 or said conduit isconsidered to be the intermediate enclosure wall 202. In an anotherembodiment, the channels that are formed around the intermediateenclosure wall 202 may be constructed of conduit or piping that isthermally connected to the intermediate enclosure wall 202 in a path ofoptimal geometry such that a) a secondary single phase or multi-phasethermally conductive fluid 120 may be circulated within the conduit toan external local or remote heat exchanger assembly 130 via connectinglines 132, 134, and b) said conduit may be disposed between theintermediate enclosure wall 202 and outer enclosure wall 103 or saidconduit is considered to be the outer enclosure wall 103.

The secondary intermediate single phase or multi-phase thermallyconductive fluid 222 may be in a predominately liquid phase, gaseousphase, or in a combination liquid phase and gaseous phase. In anembodiment that comprises a secondary intermediate single phasethermally conductive fluid 222 in the gaseous phase, said fluid willfill the entirety of the space between the inner enclosure wall 101 andintermediate enclosure wall 202. In an embodiment that comprises asecondary intermediate single phase thermally conductive fluid 222 inthe liquid phase, said fluid may fill the entirety of the space betweenthe inner enclosure wall 101 and the intermediate enclosure wall 202 ormay fill less than the entirety of the space between the inner enclosurewall 101 and intermediate enclosure wall 202 with the remaining volumefilled by at least one separate and distinct fluid in the gaseous phase224. In an embodiment that comprises a secondary intermediatemulti-phase thermally conductive fluid 222, said fluid may fill theentirety of the space between the inner enclosure wall 101 andintermediate enclosure wall 202 with portions of said fluid existing inthe liquid phase 222 and portions of said fluid existing in the gaseousphase 224 in varying proportions relative to the temperature, pressure,and composition of said secondary intermediate multi-phase thermallyconductive fluid 222. The secondary single phase or multi-phasethermally conductive fluid 120, 148 may be in a predominately liquidphase, gaseous phase, or in a combination liquid phase and gaseousphase. In an embodiment that comprises a secondary single phasethermally conductive fluid 120 in the gaseous phase or the liquid phase,said fluid may fill the entirety of the space between the intermediateenclosure wall 202 and outer enclosure wall 103. In an embodiment thatcomprises a secondary multi-phase thermally conductive fluid 120, saidfluid may fill the entirety of the space between the intermediateenclosure wall 202 and outer enclosure wall 103 with portions of saidfluid existing in the liquid phase and portions of said fluid existingin the gaseous phase in varying proportions relative to the temperature,pressure, and composition of said secondary multi-phase thermallyconductive fluid 120.

One or more optional heat exchange mechanisms 135 may be disposed withinthe inner volume 150 such that a secondary intermediate single phase ormulti-phase thermally conductive fluid 222 is segregated from theprimary dielectric thermally conductive fluid 106, 108 and may becirculated through heat exchange mechanism 135 to an external local orremote heat exchanger assembly 240 via connecting lines 242, 244. One ormore optional heat exchange mechanisms 145 may be disposed within theinner volume 150 such that a secondary single phase or multi-phasethermally conductive fluid 148 is segregated from the primary dielectricthermally conductive fluid 106, 108 and may be circulated through heatexchange mechanism 145 to an external local or remote heat exchangerassembly 140 via connecting lines 142, 144.

Heat exchange mechanisms 135, 145 may be disposed within the primarydielectric thermally conductive fluid liquid phase 106 and/or thegaseous phase 108 as heat exchange mechanisms comprising concentrictube, shell and tube, plate, fin, plate-fin, tube-fin, condenser tubing,loops, and split-flow loops. Heat exchange mechanisms 135, 145 may bethermally and/or mechanically attached or isolated from enclosure walls101. Heat exchange mechanisms 135, 145 may be thermally and/ormechanically connected to portions of the enclosed electronic devices104.

Electronic devices 104 may be disposed within the inner volume 150 ofthe sealed enclosure in a variety of configurations to facilitatethermal transfer and best practice process efficiency. The enclosedelectronic devices 104 dissipate internally generated heat into theinner volume 150, the primary dielectric thermally conductive fluid 106,and the inner thermally conductive walls 101 of the sealed enclosure. Aportion of the heat is transported from the inner enclosure wall 101 ofthe sealed enclosure to a secondary intermediate thermally conductivefluid 222 within the walls 101, 202 of the enclosure. The secondaryintermediate thermally conductive fluid 222 may optionally be circulatedbetween the walls 101, 202 where heat is transferred to secondaryintermediate thermally conductive fluids 222 and the intermediateenclosure wall 202. The secondary intermediate thermally conductivefluid 222 may also be circulated through the optional heat exchangemechanism 135. The secondary intermediate thermally conductive fluid 222may optionally be circulated away from the sealed enclosure via afluid-tight piping connection 242, is presented to one or more heatexchange assemblies 240 for the purpose of removing heat from the fluid,and returned to the sealed enclosure via a fluid-tight piping connection244. A portion of the heat is transported from the intermediateenclosure wall 202 of the sealed enclosure to the secondary thermallyconductive fluid 120 within the walls 202, 103 of the enclosure. Thesecondary thermally conductive fluid 120 is circulated between the walls202, 103 where heat is transferred to the secondary thermally conductivefluid 120 and the outer enclosure wall 103. The secondary thermallyconductive fluid 120 is circulated away from the sealed enclosure via afluid-tight piping connection 132, is presented to one or more heatexchange assemblies 130 for the purpose of removing heat from the fluid,and returned to the sealed enclosure via a fluid-tight piping connection134. The secondary thermally conductive fluid 120: a) is circulatedwithin the walls 103, 202 of the sealed enclosure where internal heat isabsorbed; b) is removed from within the walls 103, 202 of the sealedenclosure and circulated through a heat exchange assembly 130 where aportion of the heat is removed from the thermally conductive fluid 120;and c) is returned to within the walls 103, 202 of the sealed enclosure.The secondary thermally conductive fluid 120 is circulated in such afashion as to provide appropriate heat removal from the sealedenclosure. In the case of a sealed enclosure with one or moreintermediate enclosure walls 202, each secondary intermediate thermallyconductive fluid 222 may optionally be circulated from the sealedenclosure to an associated intermediate heat exchanger assembly 240.Further, if a sealed enclosure embodiment comprises both a secondarythermally conductive fluid 120 and one or more secondary intermediatethermally conductive fluids 222, then at least one of the said thermallyconductive fluids is removed from the sealed enclosure, circulatedthrough a heat exchanger assembly, and returned to the sealed enclosure.Heat exchange may be accomplished by a variety of means to one or moreexternal heat sink systems 130, 240 that may be of various typesincluding ventilation, compression, evaporation, absorption, andgeothermal systems. The heat exchange system 130, 240 may reject heatdirectly into the immediate environment of the sealed enclosure viapassive or forced circulation, or the fluid may be circulated away fromthe sealed enclosure, cooled in a remote location, and thenre-circulated back to the sealed enclosure at a lower temperature.

The optional secondary thermally conductive fluid 148: a) is circulatedwithin a heat exchanger mechanism 145 disposed in inner volume 150 whereinternal heat is absorbed from within inner volume 150; b) is removedfrom a heat exchange mechanism 145 and circulated through a heatexchange assembly 140 where a portion of the heat is removed from thethermally conductive fluid 148; and c) is returned to a heat exchangemechanism 145. The secondary thermally conductive fluid 148 iscirculated in such a fashion as to provide appropriate heat removal fromthe sealed enclosure and heat exchange may be accomplished by a varietyof means to one or more external heat sink systems 140 that may be ofvarious types including ventilation, compression, evaporation, andgeothermal systems. The heat exchange system 140 may reject heatdirectly into the immediate environment via passive or forcedcirculation, or the fluid may be circulated away from the sealedenclosure, cooled in a remote location, and then re-circulated back tothe sealed enclosure at a lower temperature.

The inner enclosure wall 101 and intermediate enclosure wall 202 arethermally conductive and are optimized by composition and constructionto provide for optimal heat transfer away from the inner volume 150. Theouter enclosure wall 103 may thermally conductive or thermallyinsulating. Portions of the enclosure walls 103 may be optionally bondedto additional materials that facilitate enhanced thermal conduction orthermal insulation of the enclosure walls 103. The walls 101, 202, 103of the enclosure may be thermally connected by mechanical connection orother means. Cooling fins may be affixed to the wall surfaces 101, 202,103 to aid in heat transport and dissipation. Wall surfaces 101, 102,103 may have surface features of various dimensionality to aid in heattransport and dissipation. The sealed enclosure has fluid-tightentrances 110 from the outer surface to the inner volume 150 for power,networking, and other control and monitoring signals and functions whichare appropriately connected to one or more electronic or otherfunctional devices disposed in the inner volume 150 of the sealedenclosure.

The optional heat exchange circuit comprised of heat exchange assembly240, fluid-tight piping connection 242, 244, heat exchange mechanism135, and secondary thermally conductive fluid 222 is separate anddistinct from the optional heat exchange circuit comprised of heatexchange assembly 140, fluid-tight piping connection 142, 144, heatexchange mechanism 145, and secondary thermally conductive fluid 148.Each heat exchange circuit is configured to effect heat removal from theinner volume 150 by using predetermined optimal loop operatingtemperatures and conditions. Each heat exchange circuit is configuredwith a heat exchange mechanism 135, 145 that is configured to provideredundant, tiered, primary, and/or secondary heat removal from the innervolume 150.

The multi-wall sealed enclosure described herein may optionally compriseheat exchange, control, pressure balancing, fluid maintenance, and/orfluid circulation functionality as described in FIGS. 3, 4, 5, 6, 7 inwhich the inner enclosure wall 101 and outer enclosure wall 103 describeoptional functionality without reference to the intermediate enclosurewall 202. Further, the multi-wall sealed enclosure described herein mayoptionally comprise heat exchange, control, pressure balancing, fluidmaintenance, and/or fluid circulation functionality as described in FIG.8. Embodiment variations and details described herein apply equally tosealed enclosures with or without intermediate enclosure walls 202 andsecondary intermediate thermally conductive fluids 222, and with orwithout an interior 108, 224 fluid head space. The sealed enclosure mayoptionally comprise one or more channels disposed in the inner volume150 as described in FIGS. 15, 16. The sealed enclosure may optionallycomprise one or more spacers disposed in the inner volume 150 of thesealed enclosure as described in FIG. 17. The sealed enclosure mayoptionally comprise one or more mechanisms in the inner volume 150 torender the electronic devices and any content stored on those devices tobe inoperable, unusable, or unreadable as described in FIG. 18.

The sealed enclosure may be located either adjacent to or remote fromany heat exchange assemblies 130, 140, 240 and/or pressure balancingsystems and appropriate fluid transport channels between said locationsare configured based optimal fluid flow and thermodynamic designs forthe selected fluids. Further, any heat exchange assemblies 130, 140, 240and/or pressure balancing systems may perform their indicated functionsfor one or more sealed enclosures.

Sealed enclosures can be installed in any orientation, placed asstandalone units or stacked or grouped together to form a structuralunit of any dimensionality in a high-density configuration. An enclosuregroup may be disposed within a sealed or unsealed enclosure and maycontain pressure balancing systems that are interior to such enclosureand exterior to sealed enclosures such that said pressure balancingsystems perform their indicated functions for one or more sealedenclosures. Sealed enclosures within an enclosure group may beconfigured such that any secondary thermally conductive fluid 120, 148,222 is conducted through more than one sealed enclosure before thesecondary thermally conductive fluid 120, 148, 222 is circulated througha heat exchanger assembly 130, 140, 240 where a portion of the heat isremoved from the thermally conductive fluid 120, 148, 222. Sealedenclosures within an enclosure group may be configured such that apressure balancing system for a sealed enclosure within the enclosuregroup may be disposed interior to another sealed enclosure within theenclosure group.

FIG. 3 shows a conceptual view of a single port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure, optional heat exchange mechanisms, and optional primarydielectric thermally conductive fluid pump circulation mechanisms. Thesealed enclosure shown in the figure is typical of the disclosuresdescribed in FIGS. 1, 2 and is illustrated by showing only a portion ofsuch sealed enclosure as a figure with an inner enclosure wall 101 andan outer enclosure wall 103, wherein the inner volume contains theprimary dielectric thermally conductive fluid 106, 108 that eithercompletely or partially fills the interior of the sealed enclosure asshown. The optional heat exchange circuit comprised of heat exchangeassembly 140, fluid-tight piping connection 142, 144, heat exchangemechanism 145, and secondary thermally conductive fluid 148 as disclosedin FIGS. 1, 2 are not shown in this conceptual view but may be includedherein as an additional and/or alternative means of heat removal.

The fluid exchange sealed entrance assembly 302 allows primarydielectric thermally conductive fluid 106, 108 fluid to be exchangedbetween the sealed enclosure and a pressure balancing system 304,maintaining a sealed enclosure environment and functioning for thepurpose of pressure equalization of the inner volume 150 of the sealedenclosure and providing optional fluid management. The fluid exchangesealed entrance assembly 302 and pressure balancing system 304 may beconfigured to function with any primary dielectric thermally conductivefluid, but is used advantageously in embodiments that contain a) asingle phase primary dielectric thermally conductive fluid 106 in theliquid phase, said fluid filling less than the entirety of inner volume150 with the remaining volume filled by at least one separate anddistinct fluid in the gaseous phase 108, b) a single phase thermallyconductive fluid 106 in the gaseous phase, said fluid filling theentirety of inner volume 150, or c) a multi-phase primary dielectricthermally conductive fluid 106, said fluid at least partially fillingthe inner volume 150 with portions of said fluid existing in the liquidphase 106 and portions of said fluid existing in the gaseous phase 108in varying proportions relative to the temperature, pressure, andcomposition of said multi-phase primary dielectric thermally conductivefluid 106 and if said multi-phase primary dielectric thermallyconductive fluid 106, 108 fills less than the entirety of inner volume150, the remaining volume may be filled by at least one separate anddistinct fluid in the gaseous phase 108.

The pressure balancing system 304 is a system that functions to maintaina suitably constant fluid presence and pressure to the fluid exchangesealed entrance assembly 302 for one or more sealed enclosures. Thepressure balancing system 304 may be located either adjacent to orremote from sealed enclosures. The pressure balancing system 304 iscapable of supplying pressure to or removing pressure from the sealedenclosure using a single fluid exchange sealed entrance assembly 302 viaconnecting lines.

An extended surface configuration of the fluid exchange sealed entranceassembly 302 may be positioned either inside or outside of the sealedenclosure and is comprised of thermally conductive materials configuredan extended surface area to effect supplement heat removal from theprimary dielectric thermally conductive fluid 106, 108 that istransported through the fluid exchange sealed entrance assembly 302.Such extended surface configuration of the fluid exchange sealedentrance assembly 302 is cooled by the secondary thermally conductivefluid 120 that is returned from the secondary fluid heat exchanger 130via connecting line 134 and flows over the extended surfaceconfiguration of the fluid exchange sealed entrance assembly 302. Theflow of cooled secondary thermally conductive fluid 120 over theextended surface configuration of the fluid exchange sealed entranceassembly 302 serves to remove heat from the primary dielectric thermallyconductive fluid 106, 108 that is transported through the fluid exchangesealed entrance assembly 302. This extended surface configuration of thefluid exchange sealed entrance assembly 302 may be utilized to condensethe multi-phase primary dielectric thermally conductive fluid from thegaseous phase 108 back into the liquid phase 106, with the result ofreturning the multi-phase primary dielectric thermally conductive fluid106 in the liquid phase back into the sealed enclosure by gravity flowor other mechanical means in order to maintain a proper amount ofprimary dielectric thermally conductive fluid 106 within the sealedenclosure.

One or more optional heat exchange mechanisms 135 may be disposed withinthe inner volume 150 such that a secondary single phase or multi-phasethermally conductive fluid 120 is segregated from the primary dielectricthermally conductive fluid 106, 108 and may be circulated through heatexchange mechanism 135 to an external local or remote heat exchangerassembly 130 via connecting lines 132, 134. One or more optional heatexchange mechanisms 145 may be disposed within the inner volume 150 suchthat a secondary single phase or multi-phase thermally conductive fluid148 is segregated from the primary dielectric thermally conductive fluid106, 108 and may be circulated through heat exchange mechanism 145 to anexternal local or remote heat exchanger assembly 140 via connectinglines 142, 144. Heat exchange mechanisms 135, 145 are disposed withinthe primary dielectric thermally conductive fluid liquid phase 106and/or the gaseous phase 108 as heat exchange mechanisms comprisingconcentric tube, shell and tube, plate, fin, plate-fin, tube-fin,condenser tubing, loops, and split-flow loops. Heat exchange mechanisms135, 145 may be thermally and/or mechanically attached or isolated fromthe inner enclosure wall 101. Heat exchange mechanisms 135, 145 may bethermally and/or mechanically connected to portions of the enclosedelectronic devices 104.

Optional mechanisms may be additionally configured in the inner volume150 of the sealed enclosure in order to effect the circulation of theprimary dielectric thermally conductive fluid 106 for the purpose of a)circulating the primary dielectric thermally conductive fluid 106 inorder to more effectively transfer thermal energy from the enclosedelectronic devices 104 to the primary dielectric thermally conductivefluid 106 and the inner enclosure wall 101, and b) to circulate theprimary dielectric thermally conductive fluid 106 through at least onefilter to trap impurities and particulates, embodiments of suchmechanisms comprise a) a mechanism comprised of a fluid pump 310, a pumpintake 312, and a pump discharge 314, or b) a mechanism comprised of animpeller, fan, turbine, or propeller that rotates under motive force.

FIG. 4 shows a conceptual view of a dual port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure, optional heat exchange mechanisms, and optional primarydielectric thermally conductive fluid pump circulation mechanisms. Thesealed enclosure shown in the figure is typical of the disclosuresdescribed in FIGS. 1, 2 and is illustrated by showing only a portion ofsuch sealed enclosure as a figure with an inner enclosure wall 101 andan outer enclosure wall 103, wherein the inner volume contains theprimary dielectric thermally conductive fluid 106, 108 that eithercompletely or partially fills the interior of the sealed enclosure asshown. The optional heat exchange circuit comprised of heat exchangeassembly 140, fluid-tight piping connection 142, 144, heat exchangemechanism 145, and secondary thermally conductive fluid 148 as disclosedin FIGS. 1, 2 are not shown in this conceptual view but may be includedherein as an additional and/or alternative means of heat removal.

The fluid exchange sealed entrance assembly 408 and fluid exchangesealed exhaust assembly 406 work in concert to allow primary dielectricthermally conductive fluid 106, 108 fluid to be exchanged between thesealed enclosure and a pressure balancing system 304, maintaining asealed enclosure environment and functioning for the purpose of pressureequalization of the inner volume 150 of the sealed enclosure andproviding optional fluid management. The fluid exchange sealed entranceassembly 408, fluid exchange sealed exhaust assembly 406, and pressurebalancing system 304 may be configured to function with any primarydielectric thermally conductive fluid, but is used advantageously in theembodiments that contain a) a single phase primary dielectric thermallyconductive fluid 106 in the liquid phase, said fluid filling less thanthe entirety of inner volume 150 with the remaining volume filled by atleast one separate and distinct fluid in the gaseous phase 108, b) asingle phase thermally conductive fluid 106 in the gaseous phase, saidfluid filling the entirety of inner volume 150, or c) a multi-phaseprimary dielectric thermally conductive fluid 106, said fluid at leastpartially filling the inner volume 150 with portions of said fluidexisting in the liquid phase 106 and portions of said fluid existing inthe gaseous phase 108 in varying proportions relative to thetemperature, pressure, and composition of said multi-phase primarydielectric thermally conductive fluid 106 and if said multi-phaseprimary dielectric thermally conductive fluid 106, 108 fills less thanthe entirety of inner volume 150, the remaining volume may be filled byat least one separate and distinct fluid in the gaseous phase 108.

The pressure balancing system 304 is closed loop system that functionsto maintain an appropriate fluid presence and pressure at the fluidexchange sealed entrance assembly 408 and the fluid exchange sealedexhaust assembly 406 for one or more sealed enclosures via connectinglines. The pressure balancing system 304 may be located either adjacentto or remote from sealed enclosures. The pressure balancing system 304is capable of supplying fluid pressure to the inner volume 150 of thesealed enclosure using the fluid exchange sealed entrance assembly 408via connecting lines. The fluid exchange sealed entrance assembly 408may be configured with a pressure relief valve assembly that allowsfluid pressure to be released from the pressure balancing system 304into the inner volume 150 of the sealed enclosure when the fluidpressure in the inner volume 150 of the sealed enclosure falls below aspecified value thereby raising the fluid pressure in the inner volume150 of the sealed enclosure. The fluid exchange sealed entrance assembly408 may be optionally configured with a pressure regulator allowing thepressure balancing system 304 to distribute a high fluid pressure tosaid pressure regulator which reduces the fluid pressure to appropriatefluid pressure level for proper pressure relief valve operation. Thefluid exchange sealed entrance assembly 408 may be located either insideor outside the sealed enclosure.

The pressure balancing system 304 is capable of removing fluid pressurefrom the inner volume 150 of the sealed enclosure using the fluidexchange sealed exhaust assembly 406 via connecting lines. The fluidexchange sealed exhaust assembly 406 may be configured with a pressurerelief valve assembly that allows fluid pressure to be released frominner volume 150 of the sealed enclosure into the fluid pressurecollection functionality of the pressure balancing system 304 when thefluid pressure in the inner volume 150 of the sealed enclosure risesabove a specified value thereby lowering the fluid pressure in the innervolume 150 of the sealed enclosure. The fluid exchange sealed exhaustassembly 406 may be located either inside or outside the sealedenclosure.

An extended surface configuration of the fluid exchange sealed exhaustassembly 406 may be positioned either inside or outside of the sealedenclosure and is comprised of thermally conductive materials configuredan extended surface area to effect supplement heat removal from theprimary dielectric thermally conductive fluid 106, 108 that istransported through the fluid exchange sealed exhaust assembly 406. Suchextended surface configuration of the fluid exchange sealed exhaustassembly 406 is cooled by the secondary thermally conductive fluid 120that is returned from the secondary fluid heat exchanger 130 viaconnecting line 134 and flows over the extended surface configuration ofthe fluid exchange sealed exhaust assembly 406. The flow of cooledsecondary thermally conductive fluid 120 over the extended surfaceconfiguration of the fluid exchange sealed exhaust assembly 406 servesto remove heat from the primary dielectric thermally conductive fluid106, 108 that is transported through the fluid exchange sealed exhaustassembly 406. This extended surface configuration of the fluid exchangesealed exhaust assembly 406 may be utilized to condense multi-phaseprimary dielectric thermally conductive fluid from the gaseous phase 108back into the liquid phase 106, with the result of returning suchmulti-phase primary dielectric thermally conductive fluid 106 in theliquid phase back into the sealed enclosure by gravity flow or othermechanical means in order to maintain a proper amount of primarydielectric thermally conductive fluid 106 within the sealed enclosure.

One or more optional heat exchange mechanisms 135 may be disposed withinthe inner volume 150 such that a secondary single phase or multi-phasethermally conductive fluid 120 is segregated from the primary dielectricthermally conductive fluid 106, 108 and may be circulated through heatexchange mechanism 135 to an external local or remote heat exchangerassembly 130 via connecting lines 132, 134. One or more optional heatexchange mechanisms 145 may be disposed within the inner volume 150 suchthat a secondary single phase or multi-phase thermally conductive fluid148 is segregated from the primary dielectric thermally conductive fluid106, 108 and may be circulated through heat exchange mechanism 145 to anexternal local or remote heat exchanger assembly 140 via connectinglines 142, 144. Heat exchange mechanisms 135, 145 are disposed withinthe primary dielectric thermally conductive fluid liquid phase 106and/or the gaseous phase 108 as heat exchange mechanisms comprisingconcentric tube, shell and tube, plate, fin, plate-fin, tube-fin,condenser tubing, loops, and split-flow loops. Heat exchange mechanisms135, 145 may be thermally and/or mechanically attached or isolated fromthe inner enclosure wall 101. Heat exchange mechanisms 135, 145 may bethermally and/or mechanically connected to portions of the enclosedelectronic devices 104.

Optional mechanisms may be additionally configured in the inner volume150 of the sealed enclosure in order to effect the circulation of theprimary dielectric thermally conductive fluid 106 for the purpose of a)circulating the primary dielectric thermally conductive fluid 106 inorder to more effectively transfer thermal energy from the enclosedelectronic devices 104 to the primary dielectric thermally conductivefluid 106 and the inner enclosure wall 101, and b) to circulate theprimary dielectric thermally conductive fluid 106 through at least onefilter to trap impurities and particulates, embodiments of suchmechanisms comprise a) a mechanism comprised of a fluid pump 310, a pumpintake 312, and a pump discharge 314, or b) a mechanism comprised of animpeller, fan, turbine, or propeller that rotates under motive force.

FIG. 5 shows a conceptual view of a dual port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure, optional heat exchange mechanisms, and optional pressurizedgaseous fluid driven primary dielectric thermally conductive fluid pumpand bubbler circulation mechanisms. The sealed enclosure shown in thefigure is typical of the disclosures described in FIGS. 1, 2 and isillustrated by showing only a portion of such sealed enclosure as afigure with an inner enclosure wall 101 and an outer enclosure wall 103,wherein the inner volume contains the primary dielectric thermallyconductive fluid 106, 108 that either completely or partially fills theinterior of the sealed enclosure as shown. The optional heat exchangecircuit comprised of heat exchange assembly 140, fluid-tight pipingconnection 142, 144, heat exchange mechanism 145, and secondarythermally conductive fluid 148 as disclosed in FIGS. 1, 2 are not shownin this conceptual view but may be included herein as an additionaland/or alternative means of heat removal.

The fluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 work in concert to allow primary dielectricthermally conductive fluid 106, 108 fluid to be exchanged between thesealed enclosure and a pressure balancing system 304, maintaining asealed enclosure environment and functioning for the purpose of pressureequalization of the inner volume 150 of the sealed enclosure, providingoptional fluid management, and providing optional motive force tokinetic processes located in the inner volume 150 of the sealedenclosure. The fluid exchange sealed entrance assembly 408, fluidexchange sealed exhaust assembly 406, and pressure balancing system 304may be configured to function with any primary dielectric thermallyconductive fluid, but is used advantageously in the embodiments thatcontain a) a single phase primary dielectric thermally conductive fluid106 in the liquid phase, said fluid filling less than the entirety ofinner volume 150 with the remaining volume filled by at least oneseparate and distinct fluid in the gaseous phase 108, b) a single phasethermally conductive fluid 106 in the gaseous phase, said fluid fillingthe entirety of inner volume 150, or c) a multi-phase primary dielectricthermally conductive fluid 106, said fluid at least partially fillingthe inner volume 150 with portions of said fluid existing in the liquidphase 106 and portions of said fluid existing in the gaseous phase 108in varying proportions relative to the temperature, pressure, andcomposition of said multi-phase primary dielectric thermally conductivefluid 106 and if said multi-phase primary dielectric thermallyconductive fluid 106, 108 fills less than the entirety of inner volume150, the remaining volume may be filled by at least one separate anddistinct fluid in the gaseous phase 108.

The pressure balancing system 304 is closed loop system that functionsto maintain an appropriate fluid presence and pressure at the fluidexchange sealed entrance assembly 408 and the fluid exchange sealedexhaust assembly 406 for one or more sealed enclosures via connectinglines. The pressure balancing system 304 may be located either adjacentto or remote from sealed enclosures. The pressure balancing system 304is capable of supplying fluid pressure to the inner volume 150 of thesealed enclosure using the fluid exchange sealed entrance assembly 408via connecting lines. The fluid exchange sealed entrance assembly 408may be configured with a pressure relief valve assembly that allowsfluid pressure to be released from the pressure balancing system 304into the inner volume 150 of the sealed enclosure when the fluidpressure in the inner volume 150 of the sealed enclosure falls below aspecified value thereby raising the fluid pressure in the inner volume150 of the sealed enclosure. The fluid exchange sealed entrance assembly408 may be optionally configured with a pressure regulator allowing thepressure balancing system 304 to distribute a high fluid pressure tosaid pressure regulator which reduces the fluid pressure to appropriatefluid pressure level for proper pressure relief valve operation. Thefluid exchange sealed entrance assembly 408 may be located either insideor outside the sealed enclosure.

The pressure balancing system 304 is capable of removing fluid pressurefrom the inner volume 150 of the sealed enclosure using the fluidexchange sealed exhaust assembly 406 via connecting lines. The fluidexchange sealed exhaust assembly 406 may be configured with a pressurerelief valve assembly that allows fluid pressure to be released frominner volume 150 of the sealed enclosure into the fluid pressurecollection functionality of the pressure balancing system 304 when thefluid pressure in the inner volume 150 of the sealed enclosure risesabove a specified value thereby lowering the fluid pressure in the innervolume 150 of the sealed enclosure. The fluid exchange sealed exhaustassembly 406 may be located either inside or outside the sealedenclosure.

An extended surface configuration of the fluid exchange sealed exhaustassembly 406 may be positioned either inside or outside of the sealedenclosure and is comprised of thermally conductive materials configuredan extended surface area to effect supplement heat removal from theprimary dielectric thermally conductive fluid 106, 108 that istransported through the fluid exchange sealed exhaust assembly 406. Suchextended surface configuration of the fluid exchange sealed exhaustassembly 406 is cooled by the secondary thermally conductive fluid 120that is returned from the secondary fluid heat exchanger 130 viaconnecting line 134 and flows over the extended surface configuration ofthe fluid exchange sealed exhaust assembly 406. The flow of cooledsecondary thermally conductive fluid 120 over the extended surfaceconfiguration of the fluid exchange sealed exhaust assembly 406 servesto remove heat from the primary dielectric thermally conductive fluid106, 108 that is transported through the fluid exchange sealed exhaustassembly 406. This extended surface configuration of the fluid exchangesealed exhaust assembly 406 may be utilized to condense multi-phaseprimary dielectric thermally conductive fluid from the gaseous phase 108back into the liquid phase 106, with the result of returning suchmulti-phase primary dielectric thermally conductive fluid 106 in theliquid phase back into the sealed enclosure by gravity flow or othermechanical means in order to maintain a proper amount of primarydielectric thermally conductive fluid 106 within the sealed enclosure.

One or more optional heat exchange mechanisms 135 may be disposed withinthe inner volume 150 such that a secondary single phase or multi-phasethermally conductive fluid 120 is segregated from the primary dielectricthermally conductive fluid 106, 108 and may be circulated through heatexchange mechanism 135 to an external local or remote heat exchangerassembly 130 via connecting lines 132, 134. One or more optional heatexchange mechanisms 145 may be disposed within the inner volume 150 suchthat a secondary single phase or multi-phase thermally conductive fluid148 is segregated from the primary dielectric thermally conductive fluid106, 108 and may be circulated through heat exchange mechanism 145 to anexternal local or remote heat exchanger assembly 140 via connectinglines 142, 144. Heat exchange mechanisms 135, 145 are disposed withinthe primary dielectric thermally conductive fluid liquid phase 106and/or the gaseous phase 108 as heat exchange mechanisms comprisingconcentric tube, shell and tube, plate, fin, plate-fin, tube-fin,condenser tubing, loops, and split-flow loops. Heat exchange mechanisms135, 145 may be thermally and/or mechanically attached or isolated fromthe inner enclosure wall 101. Heat exchange mechanisms 135, 145 may bethermally and/or mechanically connected to portions of the enclosedelectronic devices 104.

An optional mechanism may be additionally configured in the inner volume150 of the sealed enclosure in order to effect the circulation of theprimary dielectric thermally conductive fluid 106 by using fluidpressure to supply the motive force for optional kinetic processes thatinclude a) fluid circulation by means of a fluid pressure driven pump502, b) fluid circulation by means of a bubbler 506, c) fluidcirculation by means of both a fluid pressure driven pump 502 and abubbler 506, or d) other fluid circulation mechanisms. These optionalmotive force mechanisms are driven by pressured fluid supplied by thepressure balancing system 304 to the motive force sealed entranceassembly 504 via connecting lines. The motive force sealed entranceassembly 504 may be optionally configured with a pressure regulatorallowing the motive force fluid pressure source to supply a highpressure fluid to said pressure regulator which reduces the fluidpressure to appropriate fluid pressure level for the proper operation ofthe fluid pressure driven kinetic processes. The motive force sealedentrance assembly 504 may be configured with a pressure control valveassembly that allows fluid pressure from the pressure balancing system304 to be turned on or off, thereby supplying fluid pressure from thepressure balancing system 304 to kinetic processes such as the fluidpressure driven pump 502 and/or the bubbler 506 for the purpose of a)circulating the primary dielectric thermally conductive fluid 106 inorder to more effectively transfer thermal energy from the enclosedelectronic devices 104 to the primary dielectric thermally conductivefluid 106 and the inner enclosure wall 101, and b) to circulate theprimary dielectric thermally conductive fluid 106 through at least onefilter to trap impurities and particulates. Fluid pressure supplied bythe pressure balancing system 304 into the inner volume 150 of thesealed enclosure via the exhaust of the fluid pressure driven pump 502and/or the bubbler 506 is returned to the pressure balancing system 304through the fluid exchange sealed exhaust assembly 406. Embodiments thatcirculate the primary dielectric thermally conductive fluid 106 via apumping action are comprised of a fluid pressure driven pump 502connected to the motive force sealed entrance assembly 504, a pumpintake 312, and a pump discharge 314. Embodiments that circulate theprimary dielectric thermally conductive fluid 106 via a bubbling actionare comprised of a bubbler 506 connected to the motive force sealedentrance assembly 504, and a bubbler connecting line 508, said bubbler506 located in the lower part of the inner volume 150 of the sealedenclosure and comprising a mechanical means of releasing a pressuredfluid in a predominately gaseous phase via a number of bubbler pores ofvarious sizes. If the bubbler 506 and the fluid pressure driven pump 502are both configured in an embodiment, the fluid pressure utilized todrive the bubbler 506 is supplied by the discharge fluid pressure of thefluid pressure driven pump 502 via connection lines 508. The motiveforce sealed entrance assembly 504 may be located either inside oroutside the sealed enclosure.

FIG. 6 shows a conceptual view of a pressure balancing mechanism withoptional dual port pressure balancing mechanism used to relieve positiveand negative pressures in a sealed enclosure, optional heat exchangemechanisms, and optional primary dielectric thermally conductive fluidpump circulation mechanisms. The sealed enclosure shown in the figure istypical of the disclosures described herein FIGS. 1, 2 and isillustrated by showing only a portion of such sealed enclosure as afigure with an inner enclosure wall 101 and an outer enclosure wall 103,wherein the inner volume contains the primary dielectric thermallyconductive fluid 106, 108 that either completely or partially fills theinterior of the sealed enclosure as shown. The optional heat exchangecircuit comprised of heat exchange assembly 140, fluid-tight pipingconnection 142, 144, heat exchange mechanism 145, and secondarythermally conductive fluid 148 as disclosed in FIGS. 1, 2 are not shownin this conceptual view but may be included herein as an additionaland/or alternative means of heat removal.

Pressure equalization of the inner volume 150 of the sealed enclosure aswell as optional fluid management is provided by a) one or more firstmechanisms disclosed as a pressure balancing mechanism that may include,but are not limited to a gaseous fluid compressor 602, pressurizedgaseous fluid storage 604, gaseous fluid entrance assembly 606, gaseousand condensed fluid exhaust assembly 608, and associated connectinglines, valves, sensors, controls, wiring, power, enclosures, andregulators, and b) an optional second mechanism comprised of fluidexchange sealed entrance assembly 408, fluid exchange sealed exhaustassembly 406, pressure balancing system 304, and associated connectinglines, valves, sensors, controls, wiring, power, enclosures, andregulators such that if said first mechanisms and said second mechanismare present in an embodiment, one of the said mechanisms may bedesignated as the primary functional mechanism while the remaining saidmechanisms are designated as secondary functional mechanisms, or all ofthe said mechanisms may be designated as the primary functionalmechanisms. The gaseous fluid compressor 602, pressurized gaseous fluidstorage 604, gaseous fluid entrance assembly 606, gaseous and condensedfluid exhaust assembly 608, and/or fluid exchange sealed entranceassembly 408, fluid exchange sealed exhaust assembly 406, and pressurebalancing system 304 may be configured to function with any primarydielectric thermally conductive fluid, but is used advantageously in theembodiments that contain a) single phase primary dielectric thermallyconductive fluid 106 in the liquid phase, said fluid filling less thanthe entirety of inner volume 150 with the remaining volume filled by atleast one separate and distinct fluid in the gaseous phase 108, b)single phase thermally conductive fluid 106 in the gaseous phase, saidfluid filling the entirety of inner volume 150, or c) multi-phaseprimary dielectric thermally conductive fluid 106, said fluid at leastpartially filling the inner volume 150 with portions of said fluidexisting in the liquid phase 106 and portions of said fluid existing inthe gaseous phase 108 in varying proportions relative to thetemperature, pressure, and composition of said multi-phase primarydielectric thermally conductive fluid 106 and if said multi-phaseprimary dielectric thermally conductive fluid 106, 108 fills less thanthe entirety of inner volume 150, the remaining volume may be filled byat least one separate and distinct fluid in the gaseous phase 108.

The gaseous fluid compressor 602, pressurized gaseous fluid storage 604,gaseous fluid entrance assembly 606, and/or gaseous and condensed fluidexhaust assembly 608 work in concert to allow gaseous fluid that ispresent in the inner volume 150 of the sealed enclosure to be compressedand stored for release back into the inner volume 150 of the sealedenclosure as necessary to maintain a specified range of fluid pressurewithin the inner volume 150 of the sealed enclosure. The gaseous fluidentrance assembly 606 may comprise a a) check valve that allows onlyfluid in the gaseous phase to flow into the intake of the gaseous fluidcompressor 602, or b) pressure relief valve that allows pressure to be aspecified amount greater in inner volume 150 than the pressure in theintake of the gaseous fluid compressor 602. When the fluid pressure inthe inner volume 150 of the sealed enclosure rises above a specifiedvalue, the gaseous fluid compressor 602 is activated and gaseous fluid108 flows through the gaseous fluid entrance assembly 606 into theintake of the gaseous fluid compressor 602 where such gaseous fluid iscompressed by the gaseous fluid compressor 602 and stored in pressurizedgaseous fluid storage 604 thereby lowering the fluid pressure in theinner volume 150 of the sealed enclosure.

The pressurized gaseous fluid storage 604 may be comprised of thermallyconductive materials configured to effect supplemental heat removal fromthe compressed gaseous fluid 108 by configurations comprisingconstruction methodology or optional heat exchanger 610. In embodimentswith multi-phase thermally conductive fluid, as heat is removed from themulti-phase thermally conductive fluid 108 disposed inside thepressurized gaseous fluid storage 604, at least a portion of themulti-phase thermally conductive fluid 108 in the gaseous phasecondenses to liquid phase 106 and flows as a liquid to the lower part ofpressurized gaseous fluid storage 604 thereby functioning as acompressor by reducing the pressure inside the pressurized gaseous fluidstorage 604 as an effect of said phase change of the multi-phasethermally conductive fluid from the gaseous phase 108 to the liquidphase 106.

The gaseous and condensed fluid exhaust assembly 608 is comprised of atleast one of a pressure regulator or a pressure relief valve as to allowfluid 106, 108 in gaseous and/or liquid phase that is disposed in thepressurized gaseous fluid storage 604 to be discharged into the innervolume 150 when conditions exist such as a) a specific command to act isissued by control systems, b) pressure in inner volume 150 falls below aspecified value, c) a sensor internal to the pressurized gaseous fluidstorage 604 detects a liquid condensation level above specified value,d) a required operation prior to the operation of the gaseous fluidcompressor 602, e) after powering up or before powering down the systemof electronic devices 104, or f) other conditions as required by safetyor operational status with said discharge action continuing until suchtime as a) a sensor internal to the pressurized gaseous fluid storage604 detects a liquid condensation level below specified value, b)pressure in the inner volume 150 rise above a specified value, or c)other conditions as required by safety or operational status.

An optional heat exchanger 610 comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger removes heatfrom pressurized gaseous fluid storage 604. The pressurized gaseousfluid storage 604 may be comprised of thermally conductive materialsconfigured to effect supplemental heat removal from the fluid 108, 106that is disposed internally to the pressurized gaseous fluid storage604. The heat exchanger 610 may be positioned partially or completelyinside or outside of the sealed enclosure. The pressurized gaseous fluidstorage 604 is cooled by the secondary thermally conductive fluid 120that is returned from the secondary fluid heat exchanger 130 viaconnecting line 134 and flows through the heat exchanger 610. In anotherembodiment the pressurized gaseous fluid storage 604 is cooled by thesecondary thermally conductive fluid 148 that is returned from thesecondary fluid heat exchanger 140 via connecting line 144 and flowsthrough the heat exchanger 610. In embodiments with multi-phasethermally conductive fluid, the cooled pressurized gaseous fluid storage604 serves to remove heat from the multi-phase thermally conductivefluid 108 that is confined in the pressurized gaseous fluid storage 604which may further serve to condense multi-phase thermally conductivefluid from the gaseous phase 108 into the liquid phase 106 of saidfluid, thereby functioning as a compressor by reducing the pressureinside the pressurized gaseous fluid storage 604 as an effect of saidphase change of the multi-phase thermally conductive fluid from thegaseous phase 108 to the liquid phase 106. The optional heat exchanger610 or other heat exchanger comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger may be extendedand further configured to directly or indirectly remove heat fromsources such as electronic devices, batteries, motors, valves, fluidlines, or pumps.

The fluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 work in concert to allow primary dielectricthermally conductive fluid 106, 108 fluid to be exchanged between thesealed enclosure and a pressure balancing system 304, maintaining asealed enclosure environment. The pressure balancing system 304 isclosed loop system that functions to maintain an appropriate fluidpresence and pressure at the fluid exchange sealed entrance assembly 408and the fluid exchange sealed exhaust assembly 406 for one or moresealed enclosures via connecting lines. The pressure balancing system304 may be located either adjacent to or remote from sealed enclosures.The pressure balancing system 304 is capable of supplying fluid pressureto the inner volume 150 of the sealed enclosure using the fluid exchangesealed entrance assembly 408 via connecting lines. The fluid exchangesealed entrance assembly 408 may be configured with a pressure reliefvalve assembly that allows fluid pressure to be released from thepressure balancing system 304 into the inner volume 150 of the sealedenclosure when the fluid pressure in the inner volume 150 of the sealedenclosure falls below a specified value thereby raising the fluidpressure in the inner volume 150 of the sealed enclosure. The fluidexchange sealed entrance assembly 408 may be optionally configured witha pressure regulator allowing the pressure balancing system 304 todistribute a high fluid pressure to said pressure regulator whichreduces the fluid pressure to appropriate fluid pressure level forproper pressure relief valve operation. The fluid exchange sealedentrance assembly 408 may be located either inside or outside the sealedenclosure.

The pressure balancing system 304 is capable of removing fluid pressurefrom the inner volume 150 of the sealed enclosure using the fluidexchange sealed exhaust assembly 406 via connecting lines. The fluidexchange sealed exhaust assembly 406 may be configured with a pressurerelief valve assembly that allows fluid pressure to be released frominner volume 150 of the sealed enclosure into the fluid pressurecollection functionality of the pressure balancing system 304 when thefluid pressure in the inner volume 150 of the sealed enclosure risesabove a specified value thereby lowering the fluid pressure in the innervolume 150 of the sealed enclosure. The fluid exchange sealed exhaustassembly 406 may be located either inside or outside the sealedenclosure.

An extended surface configuration of the fluid exchange sealed exhaustassembly 406 may be positioned either inside or outside of the sealedenclosure and is comprised of thermally conductive materials configuredan extended surface area to effect supplement heat removal from theprimary dielectric thermally conductive fluid 106, 108 that istransported through the fluid exchange sealed exhaust assembly 406. Suchextended surface configuration of the fluid exchange sealed exhaustassembly 406 is cooled by the secondary thermally conductive fluid 120that is returned from the secondary fluid heat exchanger 130 viaconnecting line 134 and flows over the extended surface configuration ofthe fluid exchange sealed exhaust assembly 406. The flow of cooledsecondary thermally conductive fluid 120 over the extended surfaceconfiguration of the fluid exchange sealed exhaust assembly 406 servesto remove heat from the primary dielectric thermally conductive fluid106, 108 that is transported through the fluid exchange sealed exhaustassembly 406. This extended surface configuration of the fluid exchangesealed exhaust assembly 406 may be utilized to condense multi-phaseprimary dielectric thermally conductive fluid from the gaseous phase 108back into the liquid phase 106, with the result of returning suchmulti-phase primary dielectric thermally conductive fluid 106 in theliquid phase back into the sealed enclosure by gravity flow or othermechanical means in order to maintain a proper amount of primarydielectric thermally conductive fluid 106 within the sealed enclosure.

One or more optional heat exchange mechanisms 135 may be disposed withinthe inner volume 150 such that a secondary single phase or multi-phasethermally conductive fluid 120 is segregated from the primary dielectricthermally conductive fluid 106, 108 and may be circulated through heatexchange mechanism 135 to an external local or remote heat exchangerassembly 130 via connecting lines 132, 134. One or more optional heatexchange mechanisms 145 may be disposed within the inner volume 150 suchthat a secondary single phase or multi-phase thermally conductive fluid148 is segregated from the primary dielectric thermally conductive fluid106, 108 and may be circulated through heat exchange mechanism 145 to anexternal local or remote heat exchanger assembly 140 via connectinglines 142, 144. Heat exchange mechanisms 135, 145 are disposed withinthe primary dielectric thermally conductive fluid liquid phase 106and/or the gaseous phase 108 as heat exchange mechanisms comprisingconcentric tube, shell and tube, plate, fin, plate-fin, tube-fin,condenser tubing, loops, and split-flow loops. Heat exchange mechanisms135, 145 may be thermally and/or mechanically attached or isolated fromthe inner enclosure wall 101. Heat exchange mechanisms 135, 145 may bethermally and/or mechanically connected to portions of the enclosedelectronic devices 104.

Optional mechanisms may be additionally configured in the inner volume150 of the sealed enclosure in order to effect the circulation of theprimary dielectric thermally conductive fluid 106 for the purpose of a)circulating the primary dielectric thermally conductive fluid 106 inorder to more effectively transfer thermal energy from the enclosedelectronic devices 104 to the primary dielectric thermally conductivefluid 106 and the inner enclosure wall 101, and b) to circulate theprimary dielectric thermally conductive fluid 106 through at least onefilter to trap impurities and particulates, embodiments of suchmechanisms comprise a) a mechanism comprised of a fluid pump 310, a pumpintake 312, and a pump discharge 314, or b) a mechanism comprised of animpeller, fan, turbine, or propeller that rotates under motive force.

FIG. 7 shows a conceptual view of a pressure balancing mechanism withdual port pressure balancing mechanism used to relieve positive andnegative pressures in a sealed enclosure, optional heat exchangemechanisms, and optional pressurized gaseous fluid driven primarydielectric thermally conductive fluid pump and bubbler circulationmechanisms. The sealed enclosure shown in the figure is typical of thedisclosures described herein FIGS. 1, 2 and is illustrated by showingonly a portion of such sealed enclosure as a figure with an innerenclosure wall 101 and an outer enclosure wall 103, wherein the innervolume contains the primary dielectric thermally conductive fluid 106,108 that either completely or partially fills the interior of the sealedenclosure as shown. The optional heat exchange circuit comprised of heatexchange assembly 140, fluid-tight piping connection 142, 144, heatexchange mechanism 145, and secondary thermally conductive fluid 148 asdisclosed in FIGS. 1, 2 are not shown in this conceptual view but may beincluded herein as an additional and/or alternative means of heatremoval.

Pressure equalization of the inner volume 150 of the sealed enclosure aswell as optional fluid management is provided by a) one or more firstmechanisms disclosed as a pressure balancing mechanism that may include,but are not limited to a gaseous fluid compressor 602, pressurizedgaseous fluid storage 604, gaseous fluid entrance assembly 606, gaseousand condensed fluid exhaust assembly 608, and associated connectinglines, valves, sensors, controls, wiring, power, enclosures, andregulators, and b) an optional second mechanism comprised of fluidexchange sealed entrance assembly 408, fluid exchange sealed exhaustassembly 406, pressure balancing system 304, and associated connectinglines, valves, sensors, controls, wiring, power, enclosures, andregulators such that if said first mechanisms and said second mechanismare present in an embodiment, one of the said mechanisms may bedesignated as the primary functional mechanism while the remaining saidmechanisms are designated as secondary functional mechanisms, or all ofthe said mechanisms may be designated as the primary functionalmechanisms. The gaseous fluid compressor 602, pressurized gaseous fluidstorage 604, gaseous fluid entrance assembly 606, gaseous and condensedfluid exhaust assembly 608, and/or fluid exchange sealed entranceassembly 408, fluid exchange sealed exhaust assembly 406, and pressurebalancing system 304 may be configured to function with any primarydielectric thermally conductive fluid, but is used advantageously in theembodiments that contain a) single phase primary dielectric thermallyconductive fluid 106 in the liquid phase, said fluid filling less thanthe entirety of inner volume 150 with the remaining volume filled by atleast one separate and distinct fluid in the gaseous phase 108, b)single phase thermally conductive fluid 106 in the gaseous phase, saidfluid filling the entirety of inner volume 150, or c) multi-phaseprimary dielectric thermally conductive fluid 106, said fluid at leastpartially filling the inner volume 150 with portions of said fluidexisting in the liquid phase 106 and portions of said fluid existing inthe gaseous phase 108 in varying proportions relative to thetemperature, pressure, and composition of said multi-phase primarydielectric thermally conductive fluid 106 and if said multi-phaseprimary dielectric thermally conductive fluid 106, 108 fills less thanthe entirety of inner volume 150, the remaining volume may be filled byat least one separate and distinct fluid in the gaseous phase 108.

The gaseous fluid compressor 602, pressurized gaseous fluid storage 604,gaseous fluid entrance assembly 606, and/or gaseous and condensed fluidexhaust assembly 608 work in concert to allow gaseous fluid that ispresent in the inner volume 150 of the sealed enclosure to be compressedand stored for release back into the inner volume 150 of the sealedenclosure as necessary to maintain a specified range of fluid pressurewithin the inner volume 150 of the sealed enclosure. The gaseous fluidentrance assembly 606 may comprise a a) check valve that allows onlyfluid in the gaseous phase to flow into the intake of the gaseous fluidcompressor 602, or b) a pressure relief valve that allows pressure to bea specified amount greater in inner volume 150 than the pressure in theintake of the gaseous fluid compressor 602. When the fluid pressure inthe inner volume 150 of the sealed enclosure rises above a specifiedvalue, the gaseous fluid compressor 602 is activated and gaseous fluid108 flows through the gaseous fluid entrance assembly 606 into theintake of the gaseous fluid compressor 602 where such gaseous fluid iscompressed by the gaseous fluid compressor 602 and stored in pressurizedgaseous fluid storage 604 thereby lowering the fluid pressure in theinner volume 150 of the sealed enclosure.

The pressurized gaseous fluid storage 604 may be comprised of thermallyconductive materials configured to effect supplemental heat removal fromthe compressed gaseous fluid 108 by configurations comprisingconstruction methodology or optional heat exchanger 610. In embodimentswith multi-phase thermally conductive fluid, as heat is removed from themulti-phase thermally conductive fluid 108 disposed inside thepressurized gaseous fluid storage 604, at least a portion of themulti-phase thermally conductive fluid 108 in the gaseous phasecondenses to liquid phase 106 and flows as a liquid to the lower part ofpressurized gaseous fluid storage 604 thereby functioning as acompressor by reducing the pressure inside the pressurized gaseous fluidstorage 604 as an effect of said phase change of the multi-phasethermally conductive fluid from the gaseous phase 108 to the liquidphase 106.

The gaseous and condensed fluid exhaust assembly 608 is comprised of atleast one of a pressure regulator or a pressure relief valve as to allowfluid 106, 108 in gaseous and/or liquid phase that is disposed in thepressurized gaseous fluid storage 604 to be discharged into the innervolume 150 when conditions exist such as a) a specific command to act isissued by control systems, b) pressure in inner volume 150 falls below aspecified value, c) a sensor internal to the pressurized gaseous fluidstorage 604 detects a liquid condensation level above specified value,d) a required operation prior to the operation of the gaseous fluidcompressor 602, e) after powering up or before powering down the systemof electronic devices 104, or f) other conditions as required by safetyor operational status with said discharge action continuing until suchtime as a) a sensor internal to the pressurized gaseous fluid storage604 detects a liquid condensation level below specified value, b)pressure in the inner volume 150 rise above a specified value, or c)other conditions as required by safety or operational status.

An optional heat exchanger 610 comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger removes heatfrom pressurized gaseous fluid storage 604. The pressurized gaseousfluid storage 604 may be comprised of thermally conductive materialsconfigured to effect supplemental heat removal from the fluid 108, 106that is disposed internally to the pressurized gaseous fluid storage604. The heat exchanger 610 may be positioned partially or completelyinside or outside of the sealed enclosure. The pressurized gaseous fluidstorage 604 is cooled by the secondary thermally conductive fluid 120that is returned from the secondary fluid heat exchanger 130 viaconnecting line 134 and flows through the heat exchanger 610. In anotherembodiment the pressurized gaseous fluid storage 604 is cooled by thesecondary thermally conductive fluid 148 that is returned from thesecondary fluid heat exchanger 140 via connecting line 144 and flowsthrough the heat exchanger 610. In embodiments with multi-phasethermally conductive fluid, the cooled pressurized gaseous fluid storage604 serves to remove heat from the multi-phase thermally conductivefluid 108 that is confined in the pressurized gaseous fluid storage 604which may further serve to condense multi-phase thermally conductivefluid from the gaseous phase 108 into the liquid phase 106 of saidfluid, thereby functioning as a compressor by reducing the pressureinside the pressurized gaseous fluid storage 604 as an effect of saidphase change of the multi-phase thermally conductive fluid from thegaseous phase 108 to the liquid phase 106. The optional heat exchanger610 or other heat exchanger comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger may be extendedand further configured to directly or indirectly remove heat fromsources such as electronic devices, batteries, motors, valves, fluidlines, or pumps.

The fluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 work in concert to allow primary dielectricthermally conductive fluid 106, 108 fluid to be exchanged between thesealed enclosure and a pressure balancing system 304, maintaining asealed enclosure environment. The pressure balancing system 304 isclosed loop system that functions to maintain an appropriate fluidpresence and pressure at the fluid exchange sealed entrance assembly 408and the fluid exchange sealed exhaust assembly 406 for one or moresealed enclosures via connecting lines. The pressure balancing system304 may be located either adjacent to or remote from sealed enclosures.The pressure balancing system 304 is capable of supplying fluid pressureto the inner volume 150 of the sealed enclosure using the fluid exchangesealed entrance assembly 408 via connecting lines. The fluid exchangesealed entrance assembly 408 may be configured with a pressure reliefvalve assembly that allows fluid pressure to be released from thepressure balancing system 304 into the inner volume 150 of the sealedenclosure when the fluid pressure in the inner volume 150 of the sealedenclosure falls below a specified value thereby raising the fluidpressure in the inner volume 150 of the sealed enclosure. The fluidexchange sealed entrance assembly 408 may be optionally configured witha pressure regulator allowing the pressure balancing system 304 todistribute a high fluid pressure to said pressure regulator whichreduces the fluid pressure to appropriate fluid pressure level forproper pressure relief valve operation. The fluid exchange sealedentrance assembly 408 may be located either inside or outside the sealedenclosure. The pressure balancing system 304 is capable of removingfluid pressure from the inner volume 150 of the sealed enclosure usingthe fluid exchange sealed exhaust assembly 406 via connecting lines. Thefluid exchange sealed exhaust assembly 406 may be configured with apressure relief valve assembly that allows fluid pressure to be releasedfrom inner volume 150 of the sealed enclosure into the fluid pressurecollection functionality of the pressure balancing system 304 when thefluid pressure in the inner volume 150 of the sealed enclosure risesabove a specified value thereby lowering the fluid pressure in the innervolume 150 of the sealed enclosure. The fluid exchange sealed exhaustassembly 406 may be located either inside or outside the sealedenclosure.

An extended surface configuration of the fluid exchange sealed exhaustassembly 406 may be positioned either inside or outside of the sealedenclosure and is comprised of thermally conductive materials configuredan extended surface area to effect supplement heat removal from theprimary dielectric thermally conductive fluid 106, 108 that istransported through the fluid exchange sealed exhaust assembly 406. Suchextended surface configuration of the fluid exchange sealed exhaustassembly 406 is cooled by the secondary thermally conductive fluid 120that is returned from the secondary fluid heat exchanger 130 viaconnecting line 134 and flows over the extended surface configuration ofthe fluid exchange sealed exhaust assembly 406. The flow of cooledsecondary thermally conductive fluid 120 over the extended surfaceconfiguration of the fluid exchange sealed exhaust assembly 406 servesto remove heat from the primary dielectric thermally conductive fluid106, 108 that is transported through the fluid exchange sealed exhaustassembly 406. This extended surface configuration of the fluid exchangesealed exhaust assembly 406 may be utilized to condense multi-phaseprimary dielectric thermally conductive fluid from the gaseous phase 108back into the liquid phase 106, with the result of returning suchmulti-phase primary dielectric thermally conductive fluid 106 in theliquid phase back into the sealed enclosure by gravity flow or othermechanical means in order to maintain a proper amount of primarydielectric thermally conductive fluid 106 within the sealed enclosure.

One or more optional heat exchange mechanisms 135 may be disposed withinthe inner volume 150 such that a secondary single phase or multi-phasethermally conductive fluid 120 is segregated from the primary dielectricthermally conductive fluid 106, 108 and may be circulated through heatexchange mechanism 135 to an external local or remote heat exchangerassembly 130 via connecting lines 132, 134. One or more optional heatexchange mechanisms 145 may be disposed within the inner volume 150 suchthat a secondary single phase or multi-phase thermally conductive fluid148 is segregated from the primary dielectric thermally conductive fluid106, 108 and may be circulated through heat exchange mechanism 145 to anexternal local or remote heat exchanger assembly 140 via connectinglines 142, 144. Heat exchange mechanisms 135, 145 are disposed withinthe primary dielectric thermally conductive fluid liquid phase 106and/or the gaseous phase 108 as heat exchange mechanisms comprisingconcentric tube, shell and tube, plate, fin, plate-fin, tube-fin,condenser tubing, loops, and split-flow loops. Heat exchange mechanisms135, 145 may be thermally and/or mechanically attached or isolated fromthe inner enclosure wall 101. Heat exchange mechanisms 135, 145 may bethermally and/or mechanically connected to portions of the enclosedelectronic devices 104.

An optional mechanism may be additionally configured in the inner volume150 of the sealed enclosure in order to effect the circulation of theprimary dielectric thermally conductive fluid 106 by using fluidpressure to supply the motive force for optional kinetic processes thatcomprise a) fluid circulation by means of a fluid pressure driven pump502, b) fluid circulation by means of a bubbler 506, c) fluidcirculation by means of both a fluid pressure driven pump 502 and abubbler 506, or d) other fluid circulation mechanisms. These optionalmotive force mechanisms are driven by pressured fluid supplied by a)pressurized gaseous fluid storage 604, and/or b) the pressure balancingsystem 304 to the motive force sealed entrance assembly 504 viaconnecting lines. The motive force sealed entrance assembly 504 may beoptionally configured with a pressure regulator allowing the motiveforce fluid pressure source to supply a high pressure fluid to saidpressure regulator which reduces the fluid pressure to appropriate fluidpressure level for the proper operation of the fluid pressure drivenkinetic processes. The motive force sealed entrance assembly 504 may beconfigured with a pressure control valve assembly that allows fluidpressure from the motive force fluid pressure source to be turned on oroff, thereby supplying fluid pressure from the motive force fluidpressure source to kinetic processes such as the fluid pressure drivenpump 502 and/or the bubbler 506 for the purpose of a) circulating theprimary dielectric thermally conductive fluid 106 in order to moreeffectively transfer thermal energy from the enclosed electronic devices104 to the primary dielectric thermally conductive fluid 106 and theinner enclosure wall 101, and b) to circulate the primary dielectricthermally conductive fluid 106 through at least one filter to trapimpurities and particulates. Fluid pressure supplied by the motive forcefluid pressure source into the inner volume 150 of the sealed enclosurevia the exhaust of the fluid pressure driven pump 502 and/or the bubbler506 is managed by the designated pressure balancing system. Embodimentsthat circulate the primary dielectric thermally conductive fluid 106 viaa pumping action are comprised of a fluid pressure driven pump 502connected to the motive force sealed entrance assembly 504, a pumpintake 312, and a pump discharge 314. Embodiments that circulate theprimary dielectric thermally conductive fluid 106 via a bubbling actionare comprised of a bubbler 506 connected to the motive force sealedentrance assembly 504, and a bubbler connecting line 508, said bubbler506 located in the lower part of the inner volume 150 of the sealedenclosure and comprising a mechanical means of releasing a pressuredfluid in a predominately gaseous phase via a number of bubbler pores ofvarious sizes. If the bubbler 506 and the fluid pressure driven pump 502are both configured in an embodiment, the fluid pressure utilized todrive the bubbler 506 is supplied by the discharge fluid pressure of thefluid pressure driven pump 502 via connection lines 508. The motiveforce sealed entrance assembly 504 may be located either inside oroutside the sealed enclosure.

FIG. 8 shows a conceptual view of a dual port pressure balancingmechanism and/or a pressure balancing mechanism used to relieve positiveand negative pressures in the intermediate wall of a sealed enclosure,optional heat exchange mechanisms, and optional primary dielectricthermally conductive fluid pump circulation mechanisms. The sealedenclosure shown in the figure is typical of the disclosure described inFIG. 2 and is illustrated by showing only a portion of such sealedenclosure as a figure with an inner enclosure wall 101, intermediateenclosure wall 202, and an outer enclosure wall 103, wherein the innervolume 150 contains the primary dielectric thermally conductive fluid106, 108 that either completely or partially fills the inner volume 150of the sealed enclosure and wherein the intermediate volume 251 containsthe secondary intermediate thermally conductive fluid 222, 224 thateither completely or partially fills the intermediate volume 251 of thesealed enclosure. The optional heat exchange circuit comprised of heatexchange assembly 140, fluid-tight piping connection 142, 144, heatexchange mechanism 145, and secondary thermally conductive fluid 148 asdisclosed in FIG. 2 are not shown in this conceptual view but may beincluded herein as an additional and/or alternative means of heatremoval. This embodiment is illustrated to disclosure various aspects ofembodiments of pressure balancing, fluid management, and fluidcirculation mechanisms configured for multiple wall sealed enclosures asshown in FIG. 2. One skilled in the art, using this disclosure, coulddevelop additional embodiments applying the disclosures in FIGS. 3, 4,5, 6, 7 to sealed enclosures as described in FIG. 2.

Pressure equalization of the intermediate volume 251 of the sealedenclosure as well as optional fluid management is provided by a) anoptional one or more first mechanisms disclosed as a pressure balancingmechanism that may include, but are not limited to a gaseous fluidcompressor 602, pressurized gaseous fluid storage 604, gaseous fluidentrance assembly 606, gaseous and condensed fluid exhaust assembly 608,and associated connecting lines, valves, sensors, controls, wiring,power, enclosures, and regulators, or b) an optional second mechanismcomprised of fluid exchange sealed entrance assembly 408, fluid exchangesealed exhaust assembly 406, a pressure balancing system 304, andassociated connecting lines, valves, sensors, controls, wiring, power,enclosures, and regulators such that if said first mechanisms and saidsecond mechanism are present in an embodiment, one of the saidmechanisms may be designated as the primary functional mechanism whilethe remaining said mechanisms are designated as secondary functionalmechanisms, or all of the said mechanisms may be designated as theprimary functional mechanisms. The gaseous fluid compressor 602,pressurized gaseous fluid storage 604, gaseous fluid entrance assembly606, gaseous and condensed fluid exhaust assembly 608, and/or fluidexchange sealed entrance assembly 408, fluid exchange sealed exhaustassembly 406, and pressure balancing system 304 may be configured tofunction with any secondary thermally conductive fluid, but is usedadvantageously in the embodiments that contain a) secondary intermediatesingle phase thermally conductive fluid 222 in the liquid phase, saidfluid filling less than the entirety of intermediate volume 251 with theremaining volume filled by at least one separate and distinct fluid inthe gaseous phase 224, b) secondary intermediate single phase thermallyconductive fluid 222 in the gaseous phase, said fluid filling theentirety of intermediate volume 251, or c) secondary intermediatemulti-phase phase thermally conductive fluid 222, said fluid at leastpartially filling the entirety of intermediate volume 251 with portionsof said fluid existing in the liquid phase 222 and portions of saidfluid existing in the gaseous phase 224 in varying proportions relativeto the temperature, pressure, and composition of said secondaryintermediate multi-phase phase thermally conductive fluid 222 and ifsaid secondary intermediate multi-phase phase thermally conductive fluid222 fills less than the entirety of intermediate volume 251, theremaining volume may be filled by at least one separate and distinctfluid in the gaseous phase 224.

The gaseous fluid compressor 602, pressurized gaseous fluid storage 604,gaseous fluid entrance assembly 606, and/or gaseous and condensed fluidexhaust assembly 608 work in concert to allow gaseous fluid that ispresent in the intermediate volume 251 of the sealed enclosure to becompressed and stored for release back into the intermediate volume 251of the sealed enclosure as necessary to maintain a specified range offluid pressure within the intermediate volume 251 of the sealedenclosure. The gaseous fluid entrance assembly 606 may comprise a a)check valve that allows only fluid in the gaseous phase to flow into theintake of the gaseous fluid compressor 602, or b) a pressure reliefvalve that allows pressure to be a specified amount greater inintermediate volume 251 than the pressure in the intake of the gaseousfluid compressor 602. When the fluid pressure in the intermediate volume251 of the sealed enclosure rises above a specified value, the gaseousfluid compressor 602 is activated and gaseous fluid 224 flows throughthe gaseous fluid entrance assembly 606 into the intake of the gaseousfluid compressor 602 where such gaseous fluid is compressed by thegaseous fluid compressor 602 and stored in pressurized gaseous fluidstorage 604 thereby lowering the fluid pressure in the intermediatevolume 251 of the sealed enclosure.

The pressurized gaseous fluid storage 604 may be comprised of thermallyconductive materials configured to effect supplemental heat removal fromthe compressed gaseous fluid 108 by configurations comprisingconstruction methodology or optional heat exchanger 610. In embodimentswith multi-phase thermally conductive fluid, as heat is removed from themulti-phase thermally conductive fluid 224 disposed inside thepressurized gaseous fluid storage 604, at least a portion of themulti-phase thermally conductive fluid 224 in the gaseous phasecondenses to liquid phase 222 and flows as a liquid to the lower part ofpressurized gaseous fluid storage 604 thereby functioning as acompressor by reducing the pressure inside the pressurized gaseous fluidstorage 604 as an effect of said phase change of the multi-phasethermally conductive fluid from the gaseous phase 224 to the liquidphase 222.

The gaseous and condensed fluid exhaust assembly 608 is comprised of atleast one of a pressure regulator or a pressure relief valve as to allowfluid 222, 224 in gaseous and/or liquid phase that is disposed in thepressurized gaseous fluid storage 604 to be discharged into theintermediate volume 251 when conditions exist such as a) a specificcommand to act is issued by control systems, b) pressure in intermediatevolume 251 falls below a specified value, c) a sensor internal to thepressurized gaseous fluid storage 604 detects a liquid condensationlevel above specified value, d) a required operation prior to theoperation of the gaseous fluid compressor 602, e) after powering up orbefore powering down the system of electronic devices 104, or f) otherconditions as required by safety or operational status with saiddischarge action continuing until such time as a) a sensor internal tothe pressurized gaseous fluid storage 604 detects a liquid condensationlevel below specified value, b) pressure in the intermediate volume 251rise above a specified value, or c) other conditions as required bysafety or operational status.

An optional heat exchanger 610 comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger removes heatfrom pressurized gaseous fluid storage 604. The pressurized gaseousfluid storage 604 may be comprised of thermally conductive materialsconfigured to effect supplemental heat removal from the fluid 108 thatis disposed internally to the pressurized gaseous fluid storage 604. Theheat exchanger 610 may be positioned partially or completely inside oroutside of the sealed enclosure. The pressurized gaseous fluid storage604 is cooled by the secondary thermally conductive fluid 120 that isreturned from the secondary fluid heat exchanger 130 via connecting line134 and flows through the heat exchanger 610. In another embodiment thepressurized gaseous fluid storage 604 is cooled by the secondarythermally conductive fluid 148 that is returned from the secondary fluidheat exchanger 140 via connecting line 144 and flows through the heatexchanger 610. In embodiments with multi-phase thermally conductivefluid, the cooled pressurized gaseous fluid storage 604 serves to removeheat from the multi-phase thermally conductive fluid 224 that isconfined in the pressurized gaseous fluid storage 604 which may furtherserve to condense multi-phase thermally conductive fluid from thegaseous phase 224 into the liquid phase 222 of said fluid, therebyfunctioning as a compressor by reducing the pressure inside thepressurized gaseous fluid storage 604 as an effect of said phase changeof the multi-phase thermally conductive fluid from the gaseous phase 224to the liquid phase 222. The optional heat exchanger 610 or other heatexchanger comprising a concentric tube, shell and tube, plate, fin,plate-fin, or tube-fin heat exchanger may be extended and furtherconfigured to directly or indirectly remove heat from sources such aselectronic devices, batteries, motors, valves, fluid lines, or pumps.

The fluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 work in concert to allow secondaryintermediate thermally conductive fluid 222, 224 fluid to be exchangedbetween the sealed enclosure and a pressure balancing system 304,maintaining a sealed enclosure environment. The pressure balancingsystem 304 is closed loop system that functions to maintain anappropriate fluid presence and pressure at the fluid exchange sealedentrance assembly 408 and the fluid exchange sealed exhaust assembly 406for one or more sealed enclosures via connecting lines. The pressurebalancing system 304 may be located either adjacent to or remote fromsealed enclosures. The pressure balancing system 304 is capable ofsupplying fluid pressure to the intermediate volume 251 of the sealedenclosure using the fluid exchange sealed entrance assembly 408 viaconnecting lines. The fluid exchange sealed entrance assembly 408 may beconfigured with a pressure relief valve assembly that allows fluidpressure to be released from the pressure balancing system 304 into theintermediate volume 251 of the sealed enclosure when the fluid pressurein the intermediate volume 251 of the sealed enclosure falls below aspecified value thereby raising the fluid pressure in the intermediatevolume 251 of the sealed enclosure. The fluid exchange sealed entranceassembly 408 may be optionally configured with a pressure regulatorallowing the pressure balancing system 304 to distribute a high fluidpressure to said pressure regulator which reduces the fluid pressure toappropriate fluid pressure level for proper pressure relief valveoperation. The fluid exchange sealed entrance assembly 408 may belocated either inside or outside the sealed enclosure.

The pressure balancing system 304 is capable of removing fluid pressurefrom the intermediate volume 251 of the sealed enclosure using the fluidexchange sealed exhaust assembly 406 via connecting lines. The fluidexchange sealed exhaust assembly 406 may be configured with a pressurerelief valve assembly that allows fluid pressure to be released fromintermediate volume 251 of the sealed enclosure into the fluid pressurecollection functionality of the pressure balancing system 304 when thefluid pressure in the intermediate volume 251 of the sealed enclosurerises above a specified value thereby lowering the fluid pressure in theintermediate volume 251 of the sealed enclosure. The fluid exchangesealed exhaust assembly 406 may be located either inside or outside thesealed enclosure.

An extended surface configuration of the fluid exchange sealed exhaustassembly 406 may be positioned either inside or outside of the sealedenclosure and is comprised of thermally conductive materials configuredan extended surface area to effect supplement heat removal from thesecondary intermediate thermally conductive fluid 222, 224 that istransported through the fluid exchange sealed exhaust assembly 406. Suchextended surface configuration of the fluid exchange sealed exhaustassembly 406 is cooled by the secondary thermally conductive fluid 120that is returned from the secondary fluid heat exchanger 130 viaconnecting line 134 and flows over the extended surface configuration ofthe fluid exchange sealed exhaust assembly 406. The flow of cooledsecondary thermally conductive fluid 120 over the extended surfaceconfiguration of the fluid exchange sealed exhaust assembly 406 servesto remove heat from the secondary thermally conductive fluid 222, 224that is transported through the fluid exchange sealed exhaust assembly406. This extended surface configuration of the fluid exchange sealedexhaust assembly 406 may be utilized to condense multi-phase primarydielectric thermally conductive fluid from the gaseous phase 224 backinto the liquid phase 222, with the result of returning such secondaryintermediate thermally conductive fluid 222 in the liquid phase backinto the sealed enclosure by gravity flow or other mechanical means inorder to maintain a proper amount of secondary intermediate thermallyconductive fluid 222 within the sealed enclosure.

One or more optional heat exchange mechanisms 135 may be disposed withinthe intermediate volume 251 such that a secondary single phase ormulti-phase thermally conductive fluid 120 is segregated from thesecondary thermally conductive fluid 222, 224 and may be circulatedthrough heat exchange mechanism 135 to an external local or remote heatexchanger assembly 130 via connecting lines 132, 134. Heat exchangemechanisms 135 are disposed within the secondary thermally conductivefluid liquid phase 222 and/or the gaseous phase 224 as heat exchangemechanisms comprising concentric tube, shell and tube, plate, fin,plate-fin, tube-fin, condenser tubing, loops, and split-flow loops. Heatexchange mechanisms 135 may be thermally and/or mechanically attached orisolated from the enclosure wall 101, 202.

One or more optional heat exchange mechanisms 145 may be disposed withinthe inner volume 150 such that a secondary single phase or multi-phasethermally conductive fluid 148 is segregated from the primary dielectricthermally conductive fluid 106, 108 and may be circulated through heatexchange mechanism 145 to an external local or remote heat exchangerassembly 140 via connecting lines 142, 144. Heat exchange mechanism 145is disposed within the primary dielectric thermally conductive fluidliquid phase 106 and/or the gaseous phase 108 as heat exchangemechanisms comprising concentric tube, shell and tube, plate, fin,plate-fin, tube-fin, condenser tubing, loops, and split-flow loops. Heatexchange mechanism 145 may be thermally and/or mechanically attached orisolated from the inner enclosure wall 101. Heat exchange mechanism 145may be thermally and/or mechanically connected to portions of theenclosed electronic devices 104.

Heat exchange, control, pressure balancing, fluid maintenance, and/orfluid circulation functionality of the inner volume 150 of the sealedenclosure may be provided for by applying any of the disclosures inFIGS. 3, 4, 5, 6, 7 to inner volume 150 of the sealed enclosure.Optional mechanisms may be additionally configured in the inner volume150 of the sealed enclosure in order to effect the circulation of theprimary dielectric thermally conductive fluid 106 for the purpose of a)circulating the primary dielectric thermally conductive fluid 106 inorder to more effectively transfer thermal energy from the enclosedelectronic devices 104 to the primary dielectric thermally conductivefluid 106 and the inner enclosure wall 101, and b) to circulate theprimary dielectric thermally conductive fluid 106 through at least onefilter to trap impurities and particulates, embodiments of suchmechanisms comprise a) a mechanism comprised of a fluid pump 310, a pumpintake 312, and a pump discharge 314, or b) a mechanism comprised of animpeller, fan, turbine, or propeller that rotates under motive force.

FIG. 9 shows a conceptual view of a sealed enclosure design comprisingan enclosure wall 901 that enclose electronic devices 104 and a primarydielectric thermally conductive fluid 106, 108 in the inner volume 150and optional heat exchange mechanisms 935, 945 in the inner volume 150that contain a secondary thermally conductive fluid 120, 148. The innervolume 150 contains a single phase or multi-phase primary dielectricthermally conductive fluid 106, 108 in which electronic devices 104 tobe cooled are immersed or surrounded. The single phase or multi-phaseprimary dielectric thermally conductive fluid 106, 108 may be in apredominately liquid phase, gaseous phase, or in a combination liquidphase and gaseous phase. In an embodiment that comprises a single phaseprimary dielectric thermally conductive fluid 106 in the gaseous phase,said fluid will fill the entirety of inner volume 150. In an embodimentthat comprises a single phase primary dielectric thermally conductivefluid 106 in the liquid phase, said fluid may fill the entirety of innervolume 150 or may fill less than the entirety of inner volume 150 withthe remaining volume filled by at least one separate and distinct fluidin the gaseous phase 108. In an embodiment that comprises a multi-phaseprimary dielectric thermally conductive fluid 106, said fluid may fillthe entirety of inner volume 150 with portions of said fluid existing inthe liquid phase 106 and portions of said fluid existing in the gaseousphase 108 in varying proportions relative to the temperature, pressure,and composition of said multi-phase primary dielectric thermallyconductive fluid 106 and if said multi-phase primary dielectricthermally conductive fluid 106, 108 fills less than the entirety ofinner volume 150, the remaining volume may be filled by at least oneseparate and distinct fluid in the gaseous phase 108.

Embodiments of the disclosed sealed enclosure may be configured withsingle phase or multi-phase thermally conductive fluids. A single phasethermally conductive fluid will transfer heat using the principles ofconvection and conduction. A multi-phase thermally conductive fluid willtransfer heat using the principles of convection, conduction, and phasechange. As the multi-phase thermally conductive fluid in the liquidphase absorbs heat, a portion of said fluid is converted to the gaseousphase. Conversely, as the multi-phase thermally conductive fluid in thegaseous phase gives up heat by various heat exchange processes, aportion of said multi-phase thermally conductive fluid in the gaseousphase condenses back into multi-phase thermally conductive fluid in theliquid phase. If the amount of fluid in the gaseous phase 108 exceedsthe volume of space internal to the sealed enclosure that is unoccupiedby the multi-phase thermally conductive fluid in the liquid phase 106,said fluid in the gaseous phase 108 will exert a positive pressureinside the inner volume 150 of the sealed enclosure. Conversely, if theamount of fluid in the gaseous phase 108 is less than the volume ofspace internal to the sealed enclosure that is unoccupied by themulti-phase thermally conductive fluid in the liquid phase 106, saidfluid in the gaseous phase 108 will exert a negative pressure inside theinner volume 150 of the sealed enclosure. In addition, some amount ofmulti-phase thermally conductive fluid in the gaseous phase 108 andoptional other distinct and suitable compressible gaseous fluid mayexist in a space of the sealed enclosure for various purposes comprisingcushioning positive and negative pressures in the sealed enclosure,maintaining a headspace in a specified range of pressure as temperaturevaries, displacing thermally conductive fluid to allow weightadjustments to the overall sealed enclosure, and/or allowingaccumulation of gaseous fluid used to drive internal kinetic processesor gaseous based mixing functionality. A single phase thermallyconductive fluid may either completely or partially fill a space of thesealed enclosure and any space in the sealed enclosure that is notfilled by said single phase thermally conductive fluid may be filledwith a distinct and suitable compressible gaseous fluid for variouspurposes comprising cushioning positive and negative pressures in thesealed enclosure, maintaining a headspace in a specified range ofpressure as temperature varies, displacing thermally conductive fluid toallow weight adjustments to the overall sealed enclosure, and/orallowing accumulation of gaseous fluid used to drive internal kineticprocesses or gaseous based mixing functionality.

Electronic devices 104 may be disposed within the inner volume 150 ofthe sealed enclosure in a variety of configurations to facilitatethermal transfer and best practice process efficiency. The enclosedelectronic devices 104 dissipate internally generated heat into theinner volume 150, the primary dielectric thermally conductive fluid 106,and the enclosure walls 901 of the sealed enclosure. One or moreoptional heat exchange mechanisms 935 may be disposed within the innervolume 150 such that a secondary single phase or multi-phase thermallyconductive fluid 120 is segregated from the primary dielectric thermallyconductive fluid 106, 108 and may be circulated through heat exchangemechanism 935 to an external local or remote heat exchanger assembly 130via connecting lines 132, 134. One or more optional heat exchangemechanisms 945 may be disposed within the inner volume 150 such that asecondary single phase or multi-phase thermally conductive fluid 148 issegregated from the primary dielectric thermally conductive fluid 106,108 and may be circulated through heat exchange mechanism 945 to anexternal local or remote heat exchanger assembly 140 via connectinglines 142, 144.

Heat exchange mechanisms 935, 945 may be disposed within the primarydielectric thermally conductive fluid liquid phase 106 and/or thegaseous phase 108 as heat exchange mechanisms comprising concentrictube, shell and tube, plate, fin, plate-fin, tube-fin, condenser tubing,loops, and split-flow loops. Heat exchange mechanisms 935, 945 may bethermally and/or mechanically attached or isolated from enclosure walls901. Heat exchange mechanisms 935, 945 may be thermally and/ormechanically connected to portions of the enclosed electronic devices104.

The secondary single phase or multi-phase thermally conductive fluid120, 148 may be in a predominately liquid phase, gaseous phase, or in acombination liquid phase and gaseous phase. The secondary thermallyconductive fluid 120 is circulated away from the sealed enclosure via afluid-tight piping connection 132, is presented to one or more heatexchanger assemblies 130 for the purpose of removing heat from thefluid, and returned to the sealed enclosure via a fluid-tight pipingconnection 134. The secondary thermally conductive fluid 120: a) iscirculated within a heat exchanger mechanism 935 disposed in innervolume 150 where internal heat is absorbed from within inner volume 150;b) is removed from a heat exchange mechanism 935 and circulated througha heat exchange assembly 130 where a portion of the heat is removed fromthe thermally conductive fluid 120; and c) is returned to a heatexchange mechanism 935. The secondary thermally conductive fluid 120 iscirculated in such a fashion as to provide appropriate heat removal fromthe sealed enclosure and heat exchange may be accomplished by a varietyof means to one or more external heat sink systems 130 that may be ofvarious types including ventilation, compression, evaporation, andgeothermal systems. The heat exchange system 130 may reject heatdirectly into the immediate environment via passive or forcedcirculation, or the fluid may be circulated away from the sealedenclosure, cooled in a remote location, and then re-circulated back tothe sealed enclosure at a lower temperature.

The secondary thermally conductive fluid 148: a) is circulated within aheat exchanger mechanism 945 disposed in inner volume 150 where internalheat is absorbed from within inner volume 150; b) is removed from a heatexchange mechanism 945 and circulated through a heat exchange assembly140 where a portion of the heat is removed from the thermally conductivefluid 148; and c) is returned to a heat exchange mechanism 945. Thesecondary thermally conductive fluid 148 is circulated in such a fashionas to provide appropriate heat removal from the sealed enclosure andheat exchange may be accomplished by a variety of means to one or moreexternal heat sink systems 140 that may be of various types includingventilation, compression, evaporation, and geothermal systems. The heatexchange system 140 may reject heat directly into the immediateenvironment via passive or forced circulation, or the fluid may becirculated away from the sealed enclosure, cooled in a remote location,and then re-circulated back to the sealed enclosure at a lowertemperature. The enclosure wall 901 may thermally conductive to functionas a heat exchanger or thermally insulating.

The enclosure walls 901 may be thermally connected by mechanicalconnection or other means. Portions of the enclosure walls 901 may beoptionally bonded to additional materials that facilitate enhancedthermal conduction or thermal insulation of the enclosure walls 901. Theouter surface of enclosure walls 901 may reject heat into objects andthe environment that surround the sealed enclosure. Cooling fins may beaffixed to the wall surfaces 901 to aid in heat transport anddissipation. Wall surfaces 901 may have surface features of variousdimensionality to aid in heat transport and dissipation. The sealedenclosure has fluid-tight entrances 110 from the outer surface to theinner volume 150 for power, networking, and other control and monitoringsignals and functions which are appropriately connected to one or moreelectronic or other functional devices disposed in the inner volume 150of the sealed enclosure.

The optional heat exchange circuit comprised of heat exchange assembly130, fluid-tight piping connection 132, 134, heat exchange mechanism935, and secondary thermally conductive fluid 120 is separate anddistinct from the optional heat exchange circuit comprised of heatexchange assembly 140, fluid-tight piping connection 142, 144, heatexchange mechanism 945, and secondary thermally conductive fluid 148.Each heat exchange circuit is configured to effect heat removal from theinner volume 150 by using predetermined optimal loop operatingtemperatures and conditions. Each heat exchange circuit is configuredwith a heat exchange mechanism 935, 945 that is configured to provideredundant, tiered, primary, and/or secondary heat removal from the innervolume 150.

The sealed enclosure may optionally comprise heat exchange, control,pressure balancing, fluid maintenance, and/or fluid circulationfunctionality as described in FIGS. 10, 11, 12, 13, 14. Embodimentvariations and details described herein apply equally to sealedenclosures with or without an interior 108 fluid head space. The sealedenclosure may optionally comprise one or more channels disposed in theinner volume 150 as described in FIGS. 15, 16. The sealed enclosure mayoptionally comprise one or more spacers disposed in the inner volume 150of the sealed enclosure as described in FIG. 17. The sealed enclosuremay optionally comprise one or more mechanisms in the inner volume 150to render the electronic devices and any content stored on those devicesto be inoperable, unusable, or unreadable as described in FIG. 18.

The sealed enclosure may be located either adjacent to or remote fromany heat exchange assemblies 130, 140 and/or pressure balancing systemsand appropriate fluid transport channels between said locations areconfigured based optimal fluid flow and thermodynamic designs for theselected fluids. Further, any heat exchange assemblies 130, 140 and/orpressure balancing systems may perform their indicated functions for oneor more sealed enclosures.

Sealed enclosures can be installed in any orientation, placed asstandalone units or stacked or grouped together to form a structuralunit of any dimensionality in a high-density configuration. An enclosuregroup may be disposed within a sealed or unsealed enclosure and maycontain pressure balancing systems that are interior to such enclosureand exterior to sealed enclosures such that said pressure balancingsystems perform their indicated functions for one or more sealedenclosures. Sealed enclosures within an enclosure group may beconfigured such that any secondary thermally conductive fluid 120, 148is conducted through more than one sealed enclosure before the secondarythermally conductive fluid 120, 148 is circulated through a heatexchanger assembly 130, 140 where a portion of the heat is removed fromthe thermally conductive fluid 120, 148. Sealed enclosures within anenclosure group may be configured such that a pressure balancing systemfor a sealed enclosure within the enclosure group may be disposedinterior to another sealed enclosure within the enclosure group.

FIG. 10 shows a conceptual view of a single port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure and optional primary dielectric thermally conductive fluidpump circulation mechanisms. The sealed enclosure shown in the figure istypical of the disclosures described in FIG. 9 and is illustrated byshowing only a portion of such sealed enclosure as a figure with anenclosure wall 901, wherein the inner volume 150 contains a primarydielectric thermally conductive fluid 106, 108 that either completely orpartially fills the interior of the sealed enclosure as shown. Theoptional heat exchange circuit comprised of heat exchange assembly 140,fluid-tight piping connection 142, 144, heat exchange mechanism 945, andsecondary thermally conductive fluid 148 as disclosed in FIG. 9 are notshown in this conceptual view but may be included herein as anadditional and/or alternative means of heat removal.

The fluid exchange sealed entrance assembly 302 allows primarydielectric thermally conductive fluid 106, 108 fluid to be exchangedbetween the sealed enclosure and a pressure balancing system 304,maintaining a sealed enclosure environment and functioning for thepurpose of pressure equalization of the inner volume 150 of the sealedenclosure and providing optional fluid management. The fluid exchangesealed entrance assembly 302 and pressure balancing system 304 may beconfigured to function with any primary dielectric thermally conductivefluid, but is used advantageously in embodiments that contain a) asingle phase primary dielectric thermally conductive fluid 106 in theliquid phase, said fluid filling less than the entirety of inner volume150 with the remaining volume filled by at least one separate anddistinct fluid in the gaseous phase 108, b) a single phase thermallyconductive fluid 106 in the gaseous phase, said fluid filling theentirety of inner volume 150, or c) a multi-phase primary dielectricthermally conductive fluid 106, said fluid at least partially fillingthe inner volume 150 with portions of said fluid existing in the liquidphase 106 and portions of said fluid existing in the gaseous phase 108in varying proportions relative to the temperature, pressure, andcomposition of said multi-phase primary dielectric thermally conductivefluid 106 and if said multi-phase primary dielectric thermallyconductive fluid 106, 108 fills less than the entirety of inner volume150, the remaining volume may be filled by at least one separate anddistinct fluid in the gaseous phase 108.

The pressure balancing system 304 is a system that functions to maintaina suitably constant fluid presence and pressure to the fluid exchangesealed entrance assembly 302 for one or more sealed enclosures. Thepressure balancing system 304 may be located either adjacent to orremote from sealed enclosures. The pressure balancing system 304 iscapable of supplying pressure to or removing pressure from the sealedenclosure using a single fluid exchange sealed entrance assembly 302 viaconnecting lines.

An optional heat exchanger 1001 may wrap around the fluid exchangesealed entrance assembly 302 positioned either inside or outside of thesealed enclosure in which the fluid exchange sealed entrance assembly302 includes a heat exchanger comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger and isconfigured to effect supplemental heat removal from the primarydielectric thermally conductive fluid 106, 108 that is transportedthrough the fluid exchange sealed entrance assembly 302. Suchconfiguration of the fluid exchange sealed entrance assembly 302 iscooled by the secondary thermally conductive fluid 120 that is returnedfrom the secondary fluid heat exchanger 130 via connecting line 134 andflows through the heat exchanger 1001 and around a portion of the fluidexchange sealed entrance assembly 302. The cooled fluid exchange sealedentrance assembly 302 serves to remove heat from the primary dielectricthermally conductive fluid 106, 108 that is transported through thefluid exchange sealed entrance assembly 302 which may further serve tocondense multi-phase primary dielectric thermally conductive fluid fromthe gaseous phase 108 into the liquid phase 106 of said fluid, with theresult of returning the multi-phase primary dielectric thermallyconductive fluid 106 in the liquid phase back into the sealed enclosureby gravity flow or other mechanical means in order to maintain a properamount of primary dielectric thermally conductive fluid 106 within thesealed enclosure.

Optional mechanisms may be additionally configured in the inner volume150 of the sealed enclosure in order to effect the circulation of theprimary dielectric thermally conductive fluid 106 for the purpose of a)circulating the primary dielectric thermally conductive fluid 106 inorder to more effectively transfer thermal energy from the enclosedelectronic devices 104 to the primary dielectric thermally conductivefluid 106 and the enclosure wall 901, and b) to circulate the primarydielectric thermally conductive fluid 106 through at least one filter totrap impurities and particulates, embodiments of such mechanismscomprise a) a mechanism comprised of a fluid pump 310, a pump intake312, and a pump discharge 314, or b) a mechanism comprised of animpeller, fan, turbine, or propeller that rotates under motive force.

FIG. 11 shows a conceptual view of a dual port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure and optional primary dielectric thermally conductive fluidpump circulation mechanisms. The sealed enclosure shown in the figure istypical of the disclosures described in FIG. 9 and is illustrated byshowing only a portion of such sealed enclosure as a figure with anenclosure wall 901, wherein the inner volume 150 contains a primarydielectric thermally conductive fluid 106, 108 that either completely orpartially fills the interior of the sealed enclosure as shown. Theoptional heat exchange circuit comprised of heat exchange assembly 140,fluid-tight piping connection 142, 144, heat exchange mechanism 945, andsecondary thermally conductive fluid 148 as disclosed in FIG. 9 are notshown in this conceptual view but may be included herein as anadditional and/or alternative means of heat removal.

The fluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 work in concert to allow primary dielectricthermally conductive fluid 106, 108 fluid to be exchanged between thesealed enclosure and a pressure balancing system 304, maintaining asealed enclosure environment and functioning for the purpose of pressureequalization of the inner volume 150 of the sealed enclosure andproviding optional fluid management. The fluid exchange sealed entranceassembly 408, the fluid exchange sealed exhaust assembly 406, and thepressure balancing system 304 may be configured to function with anyprimary dielectric thermally conductive fluid, but is usedadvantageously in the embodiments that contain a) a single phase primarydielectric thermally conductive fluid 106 in the liquid phase, saidfluid filling less than the entirety of inner volume 150 with theremaining volume filled by at least one separate and distinct fluid inthe gaseous phase 108, b) a single phase thermally conductive fluid 106in the gaseous phase, said fluid filling the entirety of inner volume150, or c) a multi-phase primary dielectric thermally conductive fluid106, said fluid at least partially filling the inner volume 150 withportions of said fluid existing in the liquid phase 106 and portions ofsaid fluid existing in the gaseous phase 108 in varying proportionsrelative to the temperature, pressure, and composition of saidmulti-phase primary dielectric thermally conductive fluid 106 and ifsaid multi-phase primary dielectric thermally conductive fluid 106, 108fills less than the entirety of inner volume 150, the remaining volumemay be filled by at least one separate and distinct fluid in the gaseousphase 108.

The pressure balancing system 304 is closed loop system that functionsto maintain an appropriate fluid presence and pressure at the fluidexchange sealed entrance assembly 408 and the fluid exchange sealedexhaust assembly 406 for one or more sealed enclosures via connectinglines. The pressure balancing system 304 is capable of supplying fluidpressure to the inner volume 150 of the sealed enclosure using the fluidexchange sealed entrance assembly 408 via connecting lines. The fluidexchange sealed entrance assembly 408 may be configured with a pressurerelief valve assembly that allows fluid pressure to be released from thepressure balancing system 304 into the inner volume 150 of the sealedenclosure when the fluid pressure in the inner volume 150 of the sealedenclosure falls below a specified value thereby raising the fluidpressure in the inner volume 150 of the sealed enclosure. The fluidexchange sealed entrance assembly 408 may be optionally configured witha pressure regulator allowing the pressure balancing system 304 todistribute a high fluid pressure to said pressure regulator whichreduces the fluid pressure to appropriate fluid pressure level forproper pressure relief valve operation. The fluid exchange sealedentrance assembly 408 may be located either inside or outside the sealedenclosure.

The pressure balancing system 304 is capable of removing fluid pressurefrom the inner volume 150 of the sealed enclosure using the fluidexchange sealed exhaust assembly 406 via connecting lines. The fluidexchange sealed exhaust assembly 406 may be configured with a pressurerelief valve assembly that allows fluid pressure to be released frominner volume 150 of the sealed enclosure into the fluid pressurecollection functionality of the pressure balancing system 304 when thefluid pressure in the inner volume 150 of the sealed enclosure risesabove a specified value thereby lowering the fluid pressure in the innervolume 150 of the sealed enclosure. The fluid exchange sealed exhaustassembly 406 may be located either inside or outside the sealedenclosure.

An optional heat exchanger 1101 may wrap around the fluid exchangesealed exhaust assembly 406 positioned either inside or outside of thesealed enclosure in which the fluid exchange sealed exhaust assembly 406includes a heat exchanger comprising a concentric tube, shell and tube,plate, fin, plate-fin, or tube-fin heat exchanger and is configured toeffect supplemental heat removal from the primary dielectric thermallyconductive fluid 106, 108 that is transported through the fluid exchangesealed exhaust assembly 406. Such configuration of the fluid exchangesealed exhaust assembly 406 is cooled by the secondary thermallyconductive fluid 120 that is returned from the secondary fluid heatexchanger 130 via connecting line 134 and flows through the heatexchanger 1101 and around a portion of the fluid exchange sealed exhaustassembly 406. The cooled fluid exchange sealed exhaust assembly 406serves to remove heat from the primary dielectric thermally conductivefluid 106, 108 that is transported through the fluid exchange sealedexhaust assembly 406 which may further serve to condense multi-phaseprimary dielectric thermally conductive fluid from the gaseous phase 108into the liquid phase 106 of said fluid, with the result of returningthe multi-phase primary dielectric thermally conductive fluid 106 in theliquid phase back into the sealed enclosure by gravity flow or othermechanical means in order to maintain a proper amount of primarydielectric thermally conductive fluid 106 within the sealed enclosure.

Optional mechanisms may be additionally configured in the inner volume150 of the sealed enclosure in order to effect the circulation of theprimary dielectric thermally conductive fluid 106 for the purpose of a)circulating the primary dielectric thermally conductive fluid 106 inorder to more effectively transfer thermal energy from the enclosedelectronic devices 104 to the primary dielectric thermally conductivefluid 106 and the enclosure wall 901, and b) to circulate the primarydielectric thermally conductive fluid 106 through at least one filter totrap impurities and particulates, embodiments of such mechanismscomprise a) a mechanism comprised of a fluid pump 310, a pump intake312, and a pump discharge 314, or b) a mechanism comprised of animpeller, fan, turbine, or propeller that rotates under motive force.

FIG. 12 shows a conceptual view of a dual port pressure balancingmechanism used to relieve positive and negative pressures in a sealedenclosure and optional pressurized gaseous fluid driven primarydielectric thermally conductive fluid pump and bubbler circulationmechanisms. The sealed enclosure shown in the figure is typical of thedisclosures described in FIG. 9 and is illustrated by showing only aportion of such sealed enclosure as a figure with an enclosure wall 901,wherein the inner volume 150 contains a primary dielectric thermallyconductive fluid 106, 108 that either completely or partially fills theinterior of the sealed enclosure as shown. The optional heat exchangecircuit comprised of heat exchange assembly 140, fluid-tight pipingconnection 142, 144, heat exchange mechanism 945, and secondarythermally conductive fluid 148 as disclosed in FIG. 9 are not shown inthis conceptual view but may be included herein as an additional and/oralternative means of heat removal.

The fluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 work in concert to allow primary dielectricthermally conductive fluid 106, 108 fluid to be exchanged between thesealed enclosure and a pressure balancing system 304, maintaining asealed enclosure environment and functioning for the purpose of pressureequalization of the inner volume 150 of the sealed enclosure, providingoptional fluid management, and providing optional motive force tokinetic processes located in the inner volume 150 of the sealedenclosure. The fluid exchange sealed entrance assembly 408, the fluidexchange sealed exhaust assembly 406, and the pressure balancing system304 may be configured to function with any primary dielectric thermallyconductive fluid, but is used advantageously in the embodiments thatcontain a) a single phase primary dielectric thermally conductive fluid106 in the liquid phase, said fluid filling less than the entirety ofinner volume 150 with the remaining volume filled by at least oneseparate and distinct fluid in the gaseous phase 108, b) a single phasethermally conductive fluid 106 in the gaseous phase, said fluid fillingthe entirety of inner volume 150, or c) a multi-phase primary dielectricthermally conductive fluid 106, said fluid at least partially fillingthe inner volume 150 with portions of said fluid existing in the liquidphase 106 and portions of said fluid existing in the gaseous phase 108in varying proportions relative to the temperature, pressure, andcomposition of said multi-phase primary dielectric thermally conductivefluid 106 and if said multi-phase primary dielectric thermallyconductive fluid 106, 108 fills less than the entirety of inner volume150, the remaining volume may be filled by at least one separate anddistinct fluid in the gaseous phase 108.

The pressure balancing system 304 is closed loop system that functionsto maintain an appropriate fluid presence and pressure at the fluidexchange sealed entrance assembly 408 and the fluid exchange sealedexhaust assembly 406 for one or more sealed enclosures via connectinglines. The pressure balancing system 304 may be located either adjacentto or remote from sealed enclosures. The pressure balancing system 304is capable of supplying fluid pressure to the inner volume 150 of thesealed enclosure using the fluid exchange sealed entrance assembly 408via connecting lines. The fluid exchange sealed entrance assembly 408may be configured with a pressure relief valve assembly that allowsfluid pressure to be released from the pressure balancing system 304into the inner volume 150 of the sealed enclosure when the fluidpressure in the inner volume 150 of the sealed enclosure falls below aspecified value thereby raising the fluid pressure in the inner volume150 of the sealed enclosure. The fluid exchange sealed entrance assembly408 may be optionally configured with a pressure regulator allowing thepressure balancing system 304 to distribute a high fluid pressure tosaid pressure regulator which reduces the fluid pressure to appropriatefluid pressure level for proper pressure relief valve operation. Thefluid exchange sealed entrance assembly 408 may be located either insideor outside the sealed enclosure.

The pressure balancing system 304 is capable of removing fluid pressurefrom the inner volume 150 of the sealed enclosure using the fluidexchange sealed exhaust assembly 406 via connecting lines. The fluidexchange sealed exhaust assembly 406 may be configured with a pressurerelief valve assembly that allows fluid pressure to be released frominner volume 150 of the sealed enclosure into the fluid pressurecollection functionality of the pressure balancing system 304 when thefluid pressure in the inner volume 150 of the sealed enclosure risesabove a specified value thereby lowering the fluid pressure in the innervolume 150 of the sealed enclosure. The fluid exchange sealed exhaustassembly 406 may be located either inside or outside the sealedenclosure.

An optional heat exchanger 1101 may wrap around the fluid exchangesealed exhaust assembly 406 positioned either inside or outside of thesealed enclosure in which the fluid exchange sealed exhaust assembly 406includes a heat exchanger comprising a concentric tube, shell and tube,plate, fin, plate-fin, or tube-fin heat exchanger and is configured toeffect supplemental heat removal from the primary dielectric thermallyconductive fluid 106, 108 that is transported through the fluid exchangesealed exhaust assembly 406. Such configuration of the fluid exchangesealed exhaust assembly 406 is cooled by the secondary thermallyconductive fluid 120 that is returned from the secondary fluid heatexchanger 130 via connecting line 134 and flows through the heatexchanger 1101 and around a portion of the fluid exchange sealed exhaustassembly 406. The cooled fluid exchange sealed exhaust assembly 406serves to remove heat from the primary dielectric thermally conductivefluid 106, 108 that is transported through the fluid exchange sealedexhaust assembly 406 which may further serve to condense multi-phaseprimary dielectric thermally conductive fluid from the gaseous phase 108into the liquid phase 106 of said fluid, with the result of returningthe multi-phase primary dielectric thermally conductive fluid 106 in theliquid phase back into the sealed enclosure by gravity flow or othermechanical means in order to maintain a proper amount of primarydielectric thermally conductive fluid 106 within the sealed enclosure.

An optional mechanism may be additionally configured in the inner volume150 of the sealed enclosure in order to effect the circulation of theprimary dielectric thermally conductive fluid 106 by using fluidpressure to supply the motive force for optional kinetic processes thatinclude a) fluid circulation by means of a fluid pressure driven pump502, b) fluid circulation by means of a bubbler 506, c) fluidcirculation by means of both a fluid pressure driven pump 502 and abubbler 506, or d) other fluid circulation mechanisms. These optionalmotive force mechanisms are driven by pressured fluid supplied by thepressure balancing system 304 to the motive force sealed entranceassembly 504 via connecting lines. The motive force sealed entranceassembly 504 may be optionally configured with a pressure regulatorallowing the motive force fluid pressure source to supply a highpressure fluid to said pressure regulator which reduces the fluidpressure to appropriate fluid pressure level for the proper operation ofthe fluid pressure driven kinetic processes. The motive force sealedentrance assembly 504 may be configured with a pressure control valveassembly that allows fluid pressure from the pressure balancing system304 to be turned on or off, thereby supplying fluid pressure from thepressure balancing system 304 to kinetic processes such as the fluidpressure driven pump 502 and/or the bubbler 506 for the purpose of a)circulating the primary dielectric thermally conductive fluid 106 inorder to more effectively transfer thermal energy from the enclosedelectronic devices 104 to the primary dielectric thermally conductivefluid 106 and the enclosure wall 901, and b) to circulate the primarydielectric thermally conductive fluid 106 through at least one filter totrap impurities and particulates. Fluid pressure supplied by thepressure balancing system 304 into the inner volume 150 of the sealedenclosure via the exhaust of the fluid pressure driven pump 502 and/orthe bubbler 506 is returned to the pressure balancing system 304 throughthe fluid exchange sealed exhaust assembly 406. Embodiments thatcirculate the primary dielectric thermally conductive fluid 106 via apumping action are comprised of a fluid pressure driven pump 502connected to the motive force sealed entrance assembly 504, a pumpintake 312, and a pump discharge 314. Embodiments that circulate theprimary dielectric thermally conductive fluid 106 via a bubbling actionare comprised of a bubbler 506 connected to the motive force sealedentrance assembly 504, and a bubbler connecting line 508, said bubbler506 located in the lower part of the inner volume 150 of the sealedenclosure and comprising a mechanical means of releasing a pressuredfluid in a predominately gaseous phase via a number of bubbler pores ofvarious sizes. If the bubbler 506 and the fluid pressure driven pump 502are both configured in an embodiment, the fluid pressure utilized todrive the bubbler 506 is supplied by the discharge fluid pressure of thefluid pressure driven pump 502 via connection lines 508. The motiveforce sealed entrance assembly 504 may be located either inside oroutside the sealed enclosure.

FIG. 13 shows a conceptual view of a pressure balancing mechanism withoptional dual port pressure balancing mechanism used to relieve positiveand negative pressures in a sealed enclosure and optional primarydielectric thermally conductive fluid pump circulation mechanisms. Thesealed enclosure shown in the figure is typical of the disclosuresdescribed in FIG. 9 and is illustrated by showing only a portion of suchsealed enclosure as a figure with an enclosure wall 901, wherein theinner volume 150 contains a primary dielectric thermally conductivefluid 106, 108 that either completely or partially fills the interior ofthe sealed enclosure as shown. The optional heat exchange circuitcomprised of heat exchange assembly 140, fluid-tight piping connection142, 144, heat exchange mechanism 945, and secondary thermallyconductive fluid 148 as disclosed in FIG. 9 are not shown in thisconceptual view but may be included herein as an additional and/oralternative means of heat removal.

Pressure equalization of the inner volume 150 of the sealed enclosure aswell as optional fluid management is provided by a) one or more firstmechanisms disclosed as a pressure balancing mechanism that may include,but are not limited to a gaseous fluid compressor 602, pressurizedgaseous fluid storage 604, gaseous fluid entrance assembly 606, gaseousand condensed fluid exhaust assembly 608, and associated connectinglines, valves, sensors, controls, wiring, power, enclosures, andregulators, and b) an optional second mechanism comprised of a fluidexchange sealed entrance assembly 408, fluid exchange sealed exhaustassembly 406, pressure balancing system 304, and associated connectinglines, valves, sensors, controls, wiring, power, enclosures, andregulators such that if said first mechanisms and said second mechanismare present in an embodiment, one of the said mechanisms may bedesignated as the primary functional mechanism while the remaining saidmechanisms are designated as secondary functional mechanisms, or all ofthe said mechanisms may be designated as the primary functionalmechanisms. The gaseous fluid compressor 602, pressurized gaseous fluidstorage 604, gaseous fluid entrance assembly 606, gaseous and condensedfluid exhaust assembly 608, and/or fluid exchange sealed entranceassembly 408, fluid exchange sealed exhaust assembly 406, and pressurebalancing system 304 may be configured to function with any primarydielectric thermally conductive fluid, but is used advantageously in theembodiments that contain a) single phase primary dielectric thermallyconductive fluid 106 in the liquid phase, said fluid filling less thanthe entirety of inner volume 150 with the remaining volume filled by atleast one separate and distinct fluid in the gaseous phase 108, b)single phase thermally conductive fluid 106 in the gaseous phase, saidfluid filling the entirety of inner volume 150, or c) multi-phaseprimary dielectric thermally conductive fluid 106, said fluid at leastpartially filling the inner volume 150 with portions of said fluidexisting in the liquid phase 106 and portions of said fluid existing inthe gaseous phase 108 in varying proportions relative to thetemperature, pressure, and composition of said multi-phase primarydielectric thermally conductive fluid 106 and if said multi-phaseprimary dielectric thermally conductive fluid 106, 108 fills less thanthe entirety of inner volume 150, the remaining volume may be filled byat least one separate and distinct fluid in the gaseous phase 108.

The gaseous fluid compressor 602, pressurized gaseous fluid storage 604,gaseous fluid entrance assembly 606, and/or gaseous and condensed fluidexhaust assembly 608 work in concert to allow gaseous fluid that ispresent in the inner volume 150 of the sealed enclosure to be compressedand stored for release back into the inner volume 150 of the sealedenclosure as necessary to maintain a specified range of fluid pressurewithin the inner volume 150 of the sealed enclosure. The gaseous fluidentrance assembly 606 may comprise a a) check valve that allows onlyfluid in the gaseous phase to flow into the intake of the gaseous fluidcompressor 602, or b) a pressure relief valve that allows pressure to bea specified amount greater in inner volume 150 than the pressure in theintake of the gaseous fluid compressor 602. When the fluid pressure inthe inner volume 150 of the sealed enclosure rises above a specifiedvalue, the gaseous fluid compressor 602 is activated and gaseous fluid108 flows through the gaseous fluid entrance assembly 606 into theintake of the gaseous fluid compressor 602 where such gaseous fluid iscompressed by the gaseous fluid compressor 602 and stored in pressurizedgaseous fluid storage 604 thereby lowering the fluid pressure in theinner volume 150 of the sealed enclosure.

The pressurized gaseous fluid storage 604 may be comprised of thermallyconductive materials configured to effect supplemental heat removal fromthe compressed gaseous fluid 108 by configurations comprisingconstruction methodology or optional heat exchanger 1310. In embodimentswith multi-phase thermally conductive fluid, as heat is removed from themulti-phase thermally conductive fluid 108 disposed inside thepressurized gaseous fluid storage 604, at least a portion of themulti-phase thermally conductive fluid 108 in the gaseous phasecondenses to liquid phase 106 and flows as a liquid to the lower part ofpressurized gaseous fluid storage 604 thereby functioning as acompressor by reducing the pressure inside the pressurized gaseous fluidstorage 604 as an effect of said phase change of the multi-phasethermally conductive fluid from the gaseous phase 108 to the liquidphase 106.

The gaseous and condensed fluid exhaust assembly 608 is comprised of atleast one of a pressure regulator or a pressure relief valve as to allowfluid 106, 108 in gaseous and/or liquid phase that is disposed in thepressurized gaseous fluid storage 604 to be discharged into the innervolume 150 when conditions exist such as a) a specific command to act isissued by control systems, b) pressure in inner volume 150 falls below aspecified value, c) a sensor internal to the pressurized gaseous fluidstorage 604 detects a liquid condensation level above specified value,d) a required operation prior to the operation of the gaseous fluidcompressor 602, e) after powering up or before powering down the systemof electronic devices 104, or f) other conditions as required by safetyor operational status with said discharge action continuing until suchtime as a) a sensor internal to the pressurized gaseous fluid storage604 detects a liquid condensation level below specified value, b)pressure in the inner volume 150 rise above a specified value, or c)other conditions as required by safety or operational status.

An optional heat exchanger 1310 comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger removes heatfrom pressurized gaseous fluid storage 604. The pressurized gaseousfluid storage 604 may be comprised of thermally conductive materialsconfigured to effect supplemental heat removal from the fluid 108 thatis disposed internally to the pressurized gaseous fluid storage 604. Theheat exchanger 1310 may be positioned partially or completely inside oroutside of the sealed enclosure. The pressurized gaseous fluid storage604 is cooled by the secondary thermally conductive fluid 120 that isreturned from the secondary fluid heat exchanger 130 via connecting line134 and flows through the heat exchanger 1310. In another embodiment thepressurized gaseous fluid storage 604 is cooled by the secondarythermally conductive fluid 148 that is returned from the secondary fluidheat exchanger 140 via connecting line 144 and flows through the heatexchanger 1310. In embodiments with multi-phase thermally conductivefluid, the cooled pressurized gaseous fluid storage 604 serves to removeheat from the multi-phase thermally conductive fluid 108 that isconfined in the pressurized gaseous fluid storage 604 which may furtherserve to condense multi-phase thermally conductive fluid from thegaseous phase 108 into the liquid phase 106 of said fluid, therebyfunctioning as a compressor by reducing the pressure inside thepressurized gaseous fluid storage 604 as an effect of said phase changeof the multi-phase thermally conductive fluid from the gaseous phase 108to the liquid phase 106. The optional heat exchanger 1310 or other heatexchanger comprising a concentric tube, shell and tube, plate, fin,plate-fin, or tube-fin heat exchanger may be extended and furtherconfigured to directly or indirectly remove heat from sources such aselectronic devices, batteries, motors, valves, fluid lines, or pumps.

The fluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 work in concert to allow primary dielectricthermally conductive fluid 106, 108 fluid to be exchanged between thesealed enclosure and a pressure balancing system 304, maintaining asealed enclosure environment. The pressure balancing system 304 isclosed loop system that functions to maintain an appropriate fluidpresence and pressure at the fluid exchange sealed entrance assembly 408and the fluid exchange sealed exhaust assembly 406 for one or moresealed enclosures via connecting lines. The pressure balancing system304 may be located either adjacent to or remote from sealed enclosures.The pressure balancing system 304 is capable of supplying fluid pressureto the inner volume 150 of the sealed enclosure using the fluid exchangesealed entrance assembly 408 via connecting lines. The fluid exchangesealed entrance assembly 408 may be configured with a pressure reliefvalve assembly that allows fluid pressure to be released from thepressure balancing system 304 into the inner volume 150 of the sealedenclosure when the fluid pressure in the inner volume 150 of the sealedenclosure falls below a specified value thereby raising the fluidpressure in the inner volume 150 of the sealed enclosure. The fluidexchange sealed entrance assembly 408 may be optionally configured witha pressure regulator allowing the pressure balancing system 304 todistribute a high fluid pressure to said pressure regulator whichreduces the fluid pressure to appropriate fluid pressure level forproper pressure relief valve operation. The fluid exchange sealedentrance assembly 408 may be located either inside or outside the sealedenclosure. The pressure balancing system 304 is capable of removingfluid pressure from the inner volume 150 of the sealed enclosure usingthe fluid exchange sealed exhaust assembly 406 via connecting lines. Thefluid exchange sealed exhaust assembly 406 may be configured with apressure relief valve assembly that allows fluid pressure to be releasedfrom inner volume 150 of the sealed enclosure into the fluid pressurecollection functionality of the pressure balancing system 304 when thefluid pressure in the inner volume 150 of the sealed enclosure risesabove a specified value thereby lowering the fluid pressure in the innervolume 150 of the sealed enclosure. The fluid exchange sealed exhaustassembly 406 may be located either inside or outside the sealedenclosure.

An optional heat exchanger 1101 may wrap around the fluid exchangesealed exhaust assembly 406 positioned either inside or outside of thesealed enclosure in which the fluid exchange sealed exhaust assembly 406includes a heat exchanger comprising a concentric tube, shell and tube,plate, fin, plate-fin, or tube-fin heat exchanger and is configured toeffect supplemental heat removal from the primary dielectric thermallyconductive fluid 106, 108 that is transported through the fluid exchangesealed exhaust assembly 406. Such configuration of the fluid exchangesealed exhaust assembly 406 is cooled by the secondary thermallyconductive fluid 120 that is returned from the secondary fluid heatexchanger 130 via connecting line 134 and flows through the heatexchanger 1101 and around a portion of the fluid exchange sealed exhaustassembly 406. The cooled fluid exchange sealed exhaust assembly 406serves to remove heat from the primary dielectric thermally conductivefluid 106, 108 that is transported through the fluid exchange sealedexhaust assembly 406 which may further serve to condense multi-phaseprimary dielectric thermally conductive fluid from the gaseous phase 108into the liquid phase 106 of said fluid, with the result of returningthe multi-phase primary dielectric thermally conductive fluid 106 in theliquid phase back into the sealed enclosure by gravity flow or othermechanical means in order to maintain a proper amount of primarydielectric thermally conductive fluid 106 within the sealed enclosure.

Optional mechanisms may be additionally configured in the inner volume150 of the sealed enclosure in order to effect the circulation of theprimary dielectric thermally conductive fluid 106 for the purpose of a)circulating the primary dielectric thermally conductive fluid 106 inorder to more effectively transfer thermal energy from the enclosedelectronic devices 104 to the primary dielectric thermally conductivefluid 106 and the enclosure wall 901, and b) to circulate the primarydielectric thermally conductive fluid 106 through at least one filter totrap impurities and particulates, embodiments of such mechanismscomprise a) a mechanism comprised of a fluid pump 310, a pump intake312, and a pump discharge 314, or b) a mechanism comprised of animpeller, fan, turbine, or propeller that rotates under motive force.

FIG. 14 shows a conceptual view of a pressure balancing mechanism withdual port pressure balancing mechanism used to relieve positive andnegative pressures in a sealed enclosure and optional pressurizedgaseous fluid driven primary dielectric thermally conductive fluid pumpand bubbler circulation mechanisms. The sealed enclosure shown in thefigure is typical of the disclosures described in FIG. 9 and isillustrated by showing only a portion of such sealed enclosure as afigure with an enclosure wall 901, wherein the inner volume 150 containsa primary dielectric thermally conductive fluid 106, 108 that eithercompletely or partially fills the interior of the sealed enclosure asshown. The optional heat exchange circuit comprised of heat exchangeassembly 140, fluid-tight piping connection 142, 144, heat exchangemechanism 945, and secondary thermally conductive fluid 148 as disclosedin FIG. 9 are not shown in this conceptual view but may be includedherein as an additional and/or alternative means of heat removal.

Pressure equalization of the inner volume 150 of the sealed enclosure aswell as optional fluid management is provided by a) one or more firstmechanisms disclosed as a pressure balancing mechanism that may include,but are not limited to a gaseous fluid compressor 602, pressurizedgaseous fluid storage 604, gaseous fluid entrance assembly 606, gaseousand condensed fluid exhaust assembly 608, and associated connectinglines, valves, sensors, controls, wiring, power, enclosures, andregulators, and b) an optional second mechanism comprised of fluidexchange sealed entrance assembly 408, fluid exchange sealed exhaustassembly 406, pressure balancing system 304, and associated connectinglines, valves, sensors, controls, wiring, power, enclosures, andregulators such that if said first mechanisms and said second mechanismare present in an embodiment, one of the said mechanisms may bedesignated as the primary functional mechanism while the remaining saidmechanisms are designated as secondary functional mechanisms, or all ofthe said mechanisms may be designated as the primary functionalmechanisms. The gaseous fluid compressor 602, pressurized gaseous fluidstorage 604, gaseous fluid entrance assembly 606, gaseous and condensedfluid exhaust assembly 608, and/or fluid exchange sealed entranceassembly 408, fluid exchange sealed exhaust assembly 406, and pressurebalancing system 304 may be configured to function with any primarydielectric thermally conductive fluid, but is used advantageously in theembodiments that contain a) single phase primary dielectric thermallyconductive fluid 106 in the liquid phase, said fluid filling less thanthe entirety of inner volume 150 with the remaining volume filled by atleast one separate and distinct fluid in the gaseous phase 108, b)single phase thermally conductive fluid 106 in the gaseous phase, saidfluid filling the entirety of inner volume 150, or c) multi-phaseprimary dielectric thermally conductive fluid 106, said fluid at leastpartially filling the inner volume 150 with portions of said fluidexisting in the liquid phase 106 and portions of said fluid existing inthe gaseous phase 108 in varying proportions relative to thetemperature, pressure, and composition of said multi-phase primarydielectric thermally conductive fluid 106 and if said multi-phaseprimary dielectric thermally conductive fluid 106, 108 fills less thanthe entirety of inner volume 150, the remaining volume may be filled byat least one separate and distinct fluid in the gaseous phase 108.

The gaseous fluid compressor 602, pressurized gaseous fluid storage 604,gaseous fluid entrance assembly 606, and/or gaseous and condensed fluidexhaust assembly 608 work in concert to allow gaseous fluid that ispresent in the inner volume 150 of the sealed enclosure to be compressedand stored for release back into the inner volume 150 of the sealedenclosure as necessary to maintain a specified range of fluid pressurewithin the inner volume 150 of the sealed enclosure. The gaseous fluidentrance assembly 606 may comprise a a) check valve that allows onlyfluid in the gaseous phase to flow into the intake of the gaseous fluidcompressor 602, or b) a pressure relief valve that allows pressure to bea specified amount greater in inner volume 150 than the pressure in theintake of the gaseous fluid compressor 602. When the fluid pressure inthe inner volume 150 of the sealed enclosure rises above a specifiedvalue, the gaseous fluid compressor 602 is activated and gaseous fluid108 flows through the gaseous fluid entrance assembly 606 into theintake of the gaseous fluid compressor 602 where such gaseous fluid iscompressed by the gaseous fluid compressor 602 and stored in pressurizedgaseous fluid storage 604 thereby lowering the fluid pressure in theinner volume 150 of the sealed enclosure.

The pressurized gaseous fluid storage 604 may be comprised of thermallyconductive materials configured to effect supplemental heat removal fromthe compressed gaseous fluid 108 by configurations comprisingconstruction methodology or optional heat exchanger 1310. In embodimentswith multi-phase thermally conductive fluid, as heat is removed from themulti-phase thermally conductive fluid 108 disposed inside thepressurized gaseous fluid storage 604, at least a portion of themulti-phase thermally conductive fluid 108 in the gaseous phasecondenses to liquid phase 106 and flows as a liquid to the lower part ofpressurized gaseous fluid storage 604 thereby functioning as acompressor by reducing the pressure inside the pressurized gaseous fluidstorage 604 as an effect of said phase change of the multi-phasethermally conductive fluid from the gaseous phase 108 to the liquidphase 106.

The gaseous and condensed fluid exhaust assembly 608 is comprised of atleast one of a pressure regulator or a pressure relief valve as to allowfluid 106, 108 in gaseous and/or liquid phase that is disposed in thepressurized gaseous fluid storage 604 to be discharged into the innervolume 150 when conditions exist such as a) a specific command to act isissued by control systems, b) pressure in inner volume 150 falls below aspecified value, c) a sensor internal to the pressurized gaseous fluidstorage 604 detects a liquid condensation level above specified value,d) a required operation prior to the operation of the gaseous fluidcompressor 602, e) after powering up or before powering down the systemof electronic devices 104, or f) other conditions as required by safetyor operational status with said discharge action continuing until suchtime as a) a sensor internal to the pressurized gaseous fluid storage604 detects a liquid condensation level below specified value, b)pressure in the inner volume 150 rise above a specified value, or c)other conditions as required by safety or operational status.

An optional heat exchanger 1310 comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger removes heatfrom pressurized gaseous fluid storage 604. The pressurized gaseousfluid storage 604 may be comprised of thermally conductive materialsconfigured to effect supplemental heat removal from the fluid 108 thatis disposed internally to the pressurized gaseous fluid storage 604. Theheat exchanger 1310 may be positioned partially or completely inside oroutside of the sealed enclosure. The pressurized gaseous fluid storage604 is cooled by the secondary thermally conductive fluid 120 that isreturned from the secondary fluid heat exchanger 130 via connecting line134 and flows through the heat exchanger 1310. In another embodiment thepressurized gaseous fluid storage 604 is cooled by the secondarythermally conductive fluid 148 that is returned from the secondary fluidheat exchanger 140 via connecting line 144 and flows through the heatexchanger 1310. In embodiments with multi-phase thermally conductivefluid, the cooled pressurized gaseous fluid storage 604 serves to removeheat from the multi-phase thermally conductive fluid 108 that isconfined in the pressurized gaseous fluid storage 604 which may furtherserve to condense multi-phase thermally conductive fluid from thegaseous phase 108 into the liquid phase 106 of said fluid, therebyfunctioning as a compressor by reducing the pressure inside thepressurized gaseous fluid storage 604 as an effect of said phase changeof the multi-phase thermally conductive fluid from the gaseous phase 108to the liquid phase 106. The optional heat exchanger 1310 or other heatexchanger comprising a concentric tube, shell and tube, plate, fin,plate-fin, or tube-fin heat exchanger may be extended and furtherconfigured to directly or indirectly remove heat from sources such aselectronic devices, batteries, motors, valves, fluid lines, or pumps.

The fluid exchange sealed entrance assembly 408 and the fluid exchangesealed exhaust assembly 406 work in concert to allow primary dielectricthermally conductive fluid 106, 108 fluid to be exchanged between thesealed enclosure and a pressure balancing system 304, maintaining asealed enclosure environment. The pressure balancing system 304 isclosed loop system that functions to maintain an appropriate fluidpresence and pressure at the fluid exchange sealed entrance assembly 408and the fluid exchange sealed exhaust assembly 406 for one or moresealed enclosures via connecting lines. The pressure balancing system304 may be located either adjacent to or remote from sealed enclosures.The pressure balancing system 304 is capable of supplying fluid pressureto the inner volume 150 of the sealed enclosure using the fluid exchangesealed entrance assembly 408 via connecting lines. The fluid exchangesealed entrance assembly 408 may be configured with a pressure reliefvalve assembly that allows fluid pressure to be released from thepressure balancing system 304 into the inner volume 150 of the sealedenclosure when the fluid pressure in the inner volume 150 of the sealedenclosure falls below a specified value thereby raising the fluidpressure in the inner volume 150 of the sealed enclosure. The fluidexchange sealed entrance assembly 408 may be optionally configured witha pressure regulator allowing the pressure balancing system 304 todistribute a high fluid pressure to said pressure regulator whichreduces the fluid pressure to appropriate fluid pressure level forproper pressure relief valve operation. The fluid exchange sealedentrance assembly 408 may be located either inside or outside the sealedenclosure. The pressure balancing system 304 is capable of removingfluid pressure from the inner volume 150 of the sealed enclosure usingthe fluid exchange sealed exhaust assembly 406 via connecting lines. Thefluid exchange sealed exhaust assembly 406 may be configured with apressure relief valve assembly that allows fluid pressure to be releasedfrom inner volume 150 of the sealed enclosure into the fluid pressurecollection functionality of the pressure balancing system 304 when thefluid pressure in the inner volume 150 of the sealed enclosure risesabove a specified value thereby lowering the fluid pressure in the innervolume 150 of the sealed enclosure. The fluid exchange sealed exhaustassembly 406 may be located either inside or outside the sealedenclosure.

An optional heat exchanger 1101 may wrap around the fluid exchangesealed exhaust assembly 406 positioned either inside or outside of thesealed enclosure in which the fluid exchange sealed exhaust assembly 406includes a heat exchanger comprising a concentric tube, shell and tube,plate, fin, plate-fin, or tube-fin heat exchanger and is configured toeffect supplemental heat removal from the primary dielectric thermallyconductive fluid 106, 108 that is transported through the fluid exchangesealed exhaust assembly 406. Such configuration of the fluid exchangesealed exhaust assembly 406 is cooled by the secondary thermallyconductive fluid 120 that is returned from the secondary fluid heatexchanger 130 via connecting line 134 and flows through the heatexchanger 1101 and around a portion of the fluid exchange sealed exhaustassembly 406. The cooled fluid exchange sealed exhaust assembly 406serves to remove heat from the primary dielectric thermally conductivefluid 106, 108 that is transported through the fluid exchange sealedexhaust assembly 406 which may further serve to condense multi-phaseprimary dielectric thermally conductive fluid from the gaseous phase 108into the liquid phase 106 of said fluid, with the result of returningthe multi-phase primary dielectric thermally conductive fluid 106 in theliquid phase back into the sealed enclosure by gravity flow or othermechanical means in order to maintain a proper amount of primarydielectric thermally conductive fluid 106 within the sealed enclosure.

An optional mechanism may be additionally configured in the inner volume150 of the sealed enclosure in order to effect the circulation of theprimary dielectric thermally conductive fluid 106 by using fluidpressure to supply the motive force for optional kinetic processes thatcomprise a) fluid circulation by means of a fluid pressure driven pump502, b) fluid circulation by means of a bubbler 506, c) fluidcirculation by means of both a fluid pressure driven pump 502 and abubbler 506, or d) other fluid circulation mechanisms. These optionalmotive force mechanisms are driven by pressured fluid supplied by a)pressurized gaseous fluid storage 604, and/or b) the pressure balancingsystem 304 to the motive force sealed entrance assembly 504 viaconnecting lines. The motive force sealed entrance assembly 504 may beoptionally configured with a pressure regulator allowing the motiveforce fluid pressure source to supply a high pressure fluid to saidpressure regulator which reduces the fluid pressure to appropriate fluidpressure level for the proper operation of the fluid pressure drivenkinetic processes. The motive force sealed entrance assembly 504 may beconfigured with a pressure control valve assembly that allows fluidpressure from the motive force fluid pressure source to be turned on oroff, thereby supplying fluid pressure from the motive force fluidpressure source to kinetic processes such as the fluid pressure drivenpump 502 and/or the bubbler 506 for the purpose of a) circulating theprimary dielectric thermally conductive fluid 106 in order to moreeffectively transfer thermal energy from the enclosed electronic devices104 to the primary dielectric thermally conductive fluid 106 and theenclosure wall 901, and b) to circulate the primary dielectric thermallyconductive fluid 106 through at least one filter to trap impurities andparticulates. Fluid pressure supplied by the motive force fluid pressuresource into the inner volume 150 of the sealed enclosure via the exhaustof the fluid pressure driven pump 502 and/or the bubbler 506 is managedby the designated pressure balancing system. Embodiments that circulatethe primary dielectric thermally conductive fluid 106 via a pumpingaction are comprised of a fluid pressure driven pump 502 connected tothe motive force sealed entrance assembly 504, a pump intake 312, and apump discharge 314. Embodiments that circulate the primary dielectricthermally conductive fluid 106 via a bubbling action are comprised of abubbler 506 connected to the motive force sealed entrance assembly 504,and a bubbler connecting line 508, said bubbler 506 located in the lowerpart of the inner volume 150 of the sealed enclosure and comprising amechanical means of releasing a pressured fluid in a predominatelygaseous phase via a number of bubbler pores of various sizes. If thebubbler 506 and the fluid pressure driven pump 502 are both configuredin an embodiment, the fluid pressure utilized to drive the bubbler 506is supplied by the discharge fluid pressure of the fluid pressure drivenpump 502 via connection lines 508. The motive force sealed entranceassembly 504 may be located either inside or outside the sealedenclosure.

FIG. 15 shows a conceptual view of channels to direct the flow ofprimary dielectric thermally conductive fluid within an enclosure. Theenclosure shown in the figure may be a sealed enclosure typical of thedisclosures described in FIGS. 1, 2, 9 or may be an unsealed enclosureof any dimensionality. An embodiment of a sealed enclosure shown in thefigure is typical of the disclosures described in FIGS. 1, 2, 9 and isillustrated by showing only a portion of such sealed enclosures as afigure with an enclosure wall 1501, wherein the inner volume 150contains a primary dielectric thermally conductive fluid 106, 108 thateither completely or partially fills the interior of the sealedenclosure as shown. The enclosure wall 1501 is the inner enclosure wall101 in FIGS. 1, 2 and the enclosure wall 901 in FIG. 9. An embodiment ofan unsealed enclosure shown in the figure is illustrated by showing onlya portion of such unsealed enclosure as a figure with an enclosure wall1501, wherein the inner volume 150 contains a primary dielectricthermally conductive fluid 106, 108 that either completely or partiallyfills the interior of the unsealed enclosure as shown.

The inner volume 150 contains a single phase or multi-phase primarydielectric thermally conductive fluid 106, 108 in which electronicdevices 104 to be cooled are immersed or surrounded. The single phase ormulti-phase primary dielectric thermally conductive fluid 106, 108 maybe in a predominately liquid phase, gaseous phase, or in a combinationliquid phase and gaseous phase.

The enclosure may optionally comprise one or more channels 1511, 1512disposed in the inner volume 150 for the purpose of providing forincreased and directed convective circulation of the of single phase ormulti-phase primary dielectric thermally conductive fluid 106, 108within the inner volume 150 of the enclosure. Channels 1511, 1512disposed in the inner volume 150 of the enclosure encourage convectiveand/or phase separation of the warmer single phase or multi-phaseprimary dielectric thermally conductive fluid 106, 108 that tends toflow upward in the inner volume 150 of the enclosure from the coolersingle phase or multi-phase primary dielectric thermally conductivefluid 106, 108 that tends to flow downward in the inner volume 150 ofthe enclosure.

Embodiments with a single phase primary dielectric thermally conductivefluid 106 will absorb heat from electronic devices 104 with the resultthat the portion of said single phase primary dielectric thermallyconductive 106 with a higher heat content will move convectively towardthe top of the inner volume 150. Embodiments with a multi-phase primarydielectric thermally conductive fluid 106 will absorb heat fromelectronic devices 104 with the result that a portion of saidmulti-phase primary dielectric thermally conductive fluid 106 isconverted to the gaseous phase 108. The portion of the multi-phaseprimary dielectric thermally conductive fluid 106 that remains in theliquid phase 106 and contains a higher heat content will moveconvectively toward the top of the inner volume 150. The portion of themulti-phase primary dielectric thermally conductive fluid 106 that isconverted to the gaseous phase 108 will have a lower density than thesurrounding fluid and will thus rise toward the top of the inner volume150.

A least one channel 1512 directs rising primary dielectric thermallyconductive fluid in the liquid phase 106 and/or primary dielectricthermally conductive fluid in the gaseous phase 108 toward a verticalriser channel 1511. A least one vertical riser channel 1511 directsrising primary dielectric thermally conductive fluid in the liquid phase106 and/or primary dielectric thermally conductive fluid in the gaseousphase 108 toward the upper portion of the inner volume 150. Channels1511, 1512 may be configured as heat exchange mechanisms in order toremove a portion of the heat contained in said rising primary dielectricthermally conductive fluid 106, 108. Channels 1511, 1512 may havevarious configurations that are adapted to specific electronic devices104 within the enclosure. Channels 1511, 1512 may serve to direct theprimary dielectric thermally conductive fluid 106, 108 surroundingindividual electronic devices 104 or an aggregate of electronic devices104. Channels 1511, 1512 are comprised of structures that may be closelyconnected in order to specifically control the fluid flow or looselyassociated in order to generally control the flow of the primarydielectric thermally conductive fluid 106, 108. Channels 1511, 1512 maybe adapted to function within a enclosure that is installed in variousorientations.

FIG. 16 shows a conceptual view of channels to direct the flow ofprimary dielectric thermally conductive fluid within an enclosure. Theenclosure shown in the figure may be a sealed enclosure typical of thedisclosures described in FIGS. 1, 2, 9 or may be an unsealed enclosureof any dimensionality. An embodiment of a sealed enclosure shown in thefigure is typical of the disclosures described in FIGS. 1, 2, 9 and isillustrated by showing only a portion of such sealed enclosures as afigure with an enclosure wall 1501, wherein the inner volume 150contains a primary dielectric thermally conductive fluid 106, 108 thateither completely or partially fills the interior of the sealedenclosure as shown. The enclosure wall 1501 is the inner enclosure wall101 in FIGS. 1, 2 and the enclosure wall 901 in FIG. 9. An embodiment ofan unsealed enclosure shown in the figure is illustrated by showing onlya portion of such unsealed enclosure as a figure with an enclosure wall1501, wherein the inner volume 150 contains a primary dielectricthermally conductive fluid 106, 108 that either completely or partiallyfills the interior of the unsealed enclosure as shown.

The inner volume 150 contains a single phase or multi-phase primarydielectric thermally conductive fluid 106, 108 in which electronicdevices 104 to be cooled are immersed or surrounded. The single phase ormulti-phase primary dielectric thermally conductive fluid 106, 108 maybe in a predominately liquid phase, gaseous phase, or in a combinationliquid phase and gaseous phase.

The enclosure may optionally comprise one or more channels 1611, 1612disposed in the inner volume 150 for the purpose of providing forincreased and directed convective circulation of the of single phase ormulti-phase primary dielectric thermally conductive fluid 106, 108within the inner volume 150 of the enclosure. Channels 1611, 1612disposed in the inner volume 150 of the enclosure encourage convectiveand/or phase separation of the warmer single phase or multi-phaseprimary dielectric thermally conductive fluid 106, 108 that tends toflow upward in the inner volume 150 of the enclosure from the coolersingle phase or multi-phase primary dielectric thermally conductivefluid 106, 108 that tends to flow downward in the inner volume 150 ofthe enclosure.

Embodiments with a single phase primary dielectric thermally conductivefluid 106 will absorb heat from electronic devices 104 with the resultthat the portion of said single phase primary dielectric thermallyconductive 106 with a higher heat content will move convectively towardthe top of the inner volume 150. Embodiments with a multi-phase primarydielectric thermally conductive fluid 106 will absorb heat fromelectronic devices 104 with the result that a portion of saidmulti-phase primary dielectric thermally conductive fluid 106 isconverted to the gaseous phase 108. The portion of the multi-phaseprimary dielectric thermally conductive fluid 106 that remains in theliquid phase 106 and contains a higher heat content will moveconvectively toward the top of the inner volume 150. The portion of themulti-phase primary dielectric thermally conductive fluid 106 that isconverted to the gaseous phase 108 will have a lower density than thesurrounding fluid and will thus rise toward the top of the inner volume150.

A least one channel 1612 directs rising primary dielectric thermallyconductive fluid in the liquid phase 106 and/or primary dielectricthermally conductive fluid in the gaseous phase 108 toward a verticalriser channel 1611. A least one vertical riser channel 1611 directsrising primary dielectric thermally conductive fluid in the liquid phase106 and/or primary dielectric thermally conductive fluid in the gaseousphase 108 toward the upper portion of the inner volume 150. Channels1611, 1612 may be configured as heat exchange mechanisms in order toremove a portion of the heat contained in said rising primary dielectricthermally conductive fluid 106, 108. Channels 1611, 1612 may havevarious configurations that are adapted to specific electronic devices104 within the enclosure. Channels 1611, 1612 may serve to direct theprimary dielectric thermally conductive fluid 106, 108 surroundingindividual electronic devices 104 or an aggregate of electronic devices104. Channels 1611, 1612 are comprised of structures that may be closelyconnected in order to specifically control the fluid flow or looselyassociated in order to generally control the flow of the primarydielectric thermally conductive fluid 106, 108. Channels 1611, 1612 maybe adapted to function within a enclosure that is installed in variousorientations.

FIG. 17 shows a conceptual view of structures for the volumetricdisplacement of primary dielectric thermally conductive fluid within anenclosure. FIG. 17 is comprised of FIG. 17A and FIG. 17B and anyreference to FIG. 17 should be taken as a reference to FIG. 17A and/orFIG. 17B. The enclosure shown in FIG. 17 may be a sealed enclosuretypical of the disclosures described in FIGS. 1, 2, 9 or may be anunsealed enclosure of any dimensionality. An embodiment of a sealedenclosure shown in FIG. 17 is typical of the disclosures described inFIGS. 1, 2, 9 and is illustrated by showing only a portion of suchsealed enclosures as a figure with an enclosure wall 1501, wherein theinner volume 150 contains a primary dielectric thermally conductivefluid 106, 108 that either completely or partially fills the interior ofthe sealed enclosure as shown. The enclosure wall 1501 is the innerenclosure wall 101 in FIGS. 1, 2 and the enclosure wall 901 in FIG. 9.An embodiment of an unsealed enclosure shown in FIG. 17 is illustratedby showing only a portion of such unsealed enclosure as a figure with anenclosure wall 1501, wherein the inner volume 150 contains a primarydielectric thermally conductive fluid 106, 108 that either completely orpartially fills the interior of the unsealed enclosure as shown.

The inner volume 150 contains a single phase or multi-phase primarydielectric thermally conductive fluid 106, 108 in which electronicdevices 104 to be cooled are immersed or surrounded. The single phase ormulti-phase primary dielectric thermally conductive fluid 106, 108 maybe in a predominately liquid phase, gaseous phase, or in a combinationliquid phase and gaseous phase.

Electronic device 104 is typically characterized by circuit boardconstruction that projects an uneven profile perpendicular to a plane ofthe circuit board thereby leaving a volume of space (“Electronic DeviceSpace”) unoccupied by the components of electronic device 104 within avolume defined by the maximum height, width, and length dimensions ofelectronic device 104. The Electronic Device Space does not include thevolumetric space occupied by the components of electronic device 104.Electronic devices 104 may have at least one associated ElectronicDevice Space. The Electronic Device Space may define both a volume and aspecific dimensionality for electronic device 104.

The enclosure may optionally comprise one or more spacers 1701 comprisedof solid or sealed hollow structures that are disposed in the innervolume 150 within the primary dielectric thermally conductive fluid 106,108. Spacers 1701 may be configured to function in any location and anyorientation within the inner volume 150, but are used advantageously inembodiments in which the spacer 1701 is disposed in a) Electronic DeviceSpace, b) volumes outside of Electronic Device Space, and/or c) volumeswithin the inner volume 150 that would otherwise be occupied by theprimary dielectric thermally conductive fluid 106, 108.

Spacers 1701 that are disposed within Electronic Device Space of aparticular electronic device 104 may have a dimensionality that forms areflected image of at least a portion of the surface of said electronicdevice 104 such that a) an appropriate gap exists between said reflectedimage and said surface of said electronic device 104, b) portions ofsaid reflected image are in direct thermal contact with said surface ofsaid electronic device 104, c) portions of said reflected image are inindirect thermal contact with said surface of said electronic device 104having thermal interface materials disposed between said portions ofsaid reflected image and said surface of said electronic device 104,and/or d) portions of said reflected image are in direct mechanicalcontact with said surface of said electronic device 104. A spacer 1701may be disposed within the Electronic Device Space of one or moreelectronic devices 104. One or more spacers 1701 may be disposed withthe Electronic Device Space of a particular electronic device 104.

Spacers 1701 may be thermally connected to electronic devices 104 andconfigured as heat exchange mechanisms to transport heat from saidelectronic device 104 to the primary dielectric thermally conductivefluid 106, 108 or to transport heat directly to heat exchange ortransport mechanisms illustrated in FIGS. 1 to 16 inclusive, 19, 20, 21.Spacers 1701 may be installed in any orientation. Spacers 1701 may bemechanically connected to one or more electronic devices 104 or otherobjects disposed within the inner volume 150. A spacer 1701 may functionas a mounting structure for one or more electronic devices 104. One ormore spacers 1701 may function as a mounting structure for an electronicdevice 104. One or more spacers 1701 may be connected directly orindirectly to form a structural unit of any dimensionality. One or morespacers 1701 may be configured to function as channels 1511, 1512 asdisclosed in FIG. 15 and/or channels 1611, 1612 as disclosed in FIG. 16.In FIG. 17A, spacers 1701 are shown to be oriented in a primarilyvertical position. In FIG. 17B, spacers 1701 are shown to be oriented inprimarily a horizontal position.

Spacers 1701 may be configured such that at least a portion of a spacer1701 comprises a elastic diaphragm, elastic wall materials, or hollowelastic structure that allow at least a portion of the spacer 1701 todeform under pressure. Spacers 1701 may be constructed of materialssuitable to their purpose and may be comprised of a plurality ofdistinct materials and parts.

FIG. 18 shows a conceptual view of mechanisms that provide a means ofrendering a portion of the electronic devices within a sealed enclosureinoperable and optionally rendering any content stored on those devicesto be unusable or unreadable. The sealed enclosure shown in the figureis typical of the disclosures described in FIGS. 1, 2, 9, 19 and isillustrated by showing only a portion of such sealed enclosures as afigure with an enclosure wall 1501, wherein the inner volume 150contains a primary dielectric thermally conductive fluid 106, 108 thateither completely or partially fills the interior of the sealedenclosure as shown. The enclosure wall 1501 is the inner enclosure wall101 in FIGS. 1, 2, and the enclosure wall 901 in FIG. 9, and theenclosure wall 1901 in FIG. 19. The inner volume 150 contains a singlephase or multi-phase primary dielectric thermally conductive fluid 106,108 in which electronic devices 104 to be cooled are immersed orsurrounded. The single phase or multi-phase primary dielectric thermallyconductive fluid 106, 108 may be in a predominately liquid phase,gaseous phase, or in a combination liquid phase and gaseous phase.

The sealed enclosure may optionally comprise one or more mechanisms1801, 1802, 1803 in the inner volume 150 for the purpose of providing anelectrical, magnetic, chemical, and/or mechanical means of rendering theelectronic devices 104 inoperable and optionally further rendering anycontent stored on said electronic devices 104 to be unusable orunreadable (“Poison Pill Device”). Poison Pill Devices 1801, 1802, 1803may be configured to function in any location within the inner volume150.

Poison Pill Device 1801 is an assembly comprising a frangible containerthat contains a material destructive to electronic devices 104 and amotive force actuated striker that will operate on command to strike thefrangible container with kinetic force sufficient to break the frangiblecontainer and release the contents of the frangible container into theinner volume 150 of the sealed enclosure. The striker of Poison PillDevice 1801 may use electrical, pneumatic, mechanical, or inertial meansto supply the motive force necessary to operate the striker. Thefrangible container of Poison Pill Device 1801 holds caustic, corrosive,or conductive materials that when added to the primary dielectricthermally conductive fluid 106, 108 serve to at least partially renderthe electrical devices 104 inoperable, unusable, or unreadable. In atleast one embodiment, a plurality of Poison Pill Devices 1801 aredisposed in various locations within the inner volume 150 so as to havethe greatest effect on electronic devices 104.

A Poison Pill Device 1802 is an assembly comprising a mechanical meansof deforming electronic devices 104 that are disposed between at leastone movable structural member by subjecting said electronic devices 104to compression or tension that results in the physical destruction of aportion of said electronic devices 104. The motive force for themoveable structural member of Poison Pill Device 1802 is comprised of a)a screw and motor assembly configured as moving plate, scissor jack, orjack screw, b) a striker assembly with at least one motive forceactuated striker, or c) a lever or cylinder acting in mechanicaladvantage with electrical, inertial, or fluid pressure motive force.

A Poison Pill Device 1803 is an assembly comprising a magnetic means ofdestroying electronic devices 104 that are disposed in proximity with atleast one electromagnet of sufficient strength to render said electronicdevices 104 inoperable and optionally render any content stored on saidelectronic devices 104 to be unusable or unreadable. In at least oneembodiment, a plurality of Poison Pill Devices 1803 are disposed invarious locations within the inner volume 150 so as to have the greatesteffect on electronic devices 104.

Poison Pill Devices 1801, 1802, 1803 may be commanded to act by at leastone control that includes remote control of a Poison Pill Device 1801,1802, 1803, proximal electrical or mechanical control of a Poison PillDevice 1801, 1802, 1803 by means of a control disposed on the exteriorof the sealed enclosure, or autonomous control of a Poison Pill Device1801, 1802, 1803 with a determination of command to act based onspecific events, environmental conditions, or circumstances detected byelectronic devices 104 and/or the Poison Pill Devices 1801, 1802, 1803.Poison Pill Devices 1801, 1802, 1803 may be commanded to act in sequenceand timing to maximize the destructive effect of the Poison Pill Devices1801, 1802, 1803. Poison Pill Devices 1801, 1802, 1803 may use otherassemblies and mechanisms with the inner volume 150 to increase thedesired effect by using actions comprising mixing, pressure changes,electrical control, and electrical impulse. Poison Pill Devices 1801,1802, 1803 may be simultaneously commanded to act by a plurality ofmeans. Poison Pill Devices 1801, 1802, 1803 may require that a pluralityof means of command are in agreement in order to initiate action.

Not shown, but disclosed is external means of effecting the sealedenclosure for the purpose of providing an electrical, magnetic,chemical, and/or mechanical means of rendering the electronic devices104 inoperable and any content stored on said devices to be unusable orunreadable, said external means comprising a) the introduction ofcaustic, corrosive, or conductive materials into the primary dielectricthermally conductive fluid 106, 108 by means an external pressurebalancing system 304, b) electrical impulse introduced by means ofcontrol wiring 110, c) mechanical or thermal deformation by electrical,mechanical, or chemical means, and d) cessation of effective operationof an external heat exchanger assembly 130, 240.

FIG. 19 shows a conceptual view of an enclosure group comprised of morethan one sealed enclosure 1901. The sealed enclosures 1901 shown in thefigure are typical of the disclosures described in FIGS. 1, 2, 9 and areillustrated by showing FIG. 9 and includes elements from FIG. 13. Ineach case, the numbered elements have the same meaning in this FIG. 19as in the figures in which they originally appear. For purposes of thisFIG. 19, two sealed enclosure embodiments are shown as structurallygrouped together by structural connections 1940, thus forming anenclosure group. The sealed enclosures 1901 are configured such that thesecondary thermally conductive fluid 148 is conducted through more thanone sealed enclosure before the secondary thermally conductive fluid 148is circulated through a heat exchanger assembly 140 where a portion ofthe heat is removed from the thermally conductive fluid 148. The sealedenclosure 1901 that appears at the left of the FIG. 19 is configuredsuch that a portion of the components used for pressure balancing of thesealed enclosure 1901 at the right of FIG. 19 are disposed interior tothe sealed enclosure 1901 that appears at the left of the FIG. 19 andconnects with the sealed enclosure 1901 at the right of FIG. 19 usingfluid-tight connecting lines 1921, 1922.

An optional heat exchanger 1910 comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger removes heatfrom pressurized gaseous fluid storage 604. The pressurized gaseousfluid storage 604 may be comprised of thermally conductive materialsconfigured to effect supplemental heat removal from the fluid 108, 106that is disposed internally to the pressurized gaseous fluid storage604. In the embodiment shown, the pressurized gaseous fluid storage 604is cooled by the secondary thermally conductive fluid 148 that isreturned from the secondary fluid heat exchanger 140 via connecting line144 and flows through the heat exchanger 1910. In embodiments withmulti-phase thermally conductive fluid, the cooled pressurized gaseousfluid storage 604 serves to remove heat from the multi-phase thermallyconductive fluid 108 that is confined in the pressurized gaseous fluidstorage 604 which may further serve to condense multi-phase thermallyconductive fluid from the gaseous phase 108 into the liquid phase 106 ofsaid fluid, thereby functioning as a compressor by reducing the pressureinside the pressurized gaseous fluid storage 604 as an effect of saidphase change of the multi-phase thermally conductive fluid from thegaseous phase 108 to the liquid phase 106. The optional heat exchanger1910 or other heat exchanger comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger may be extendedand further configured to directly or indirectly remove heat fromsources such as electronic devices, batteries, motors, valves, fluidlines, or pumps.

The sealed enclosures in this enclosure group can be configured in anyorientation and grouped together to form a structural unit of anydimensionality. The enclosure group can optionally be further enclosedwithin an enclosure 1930 and may contain a portion of the componentsused for pressure balancing and/or secondary thermally conductive fluidsthat are disposed interior to enclosure 1930 and exterior to sealedenclosures such that said portion of the components used for pressurebalancing and said secondary thermally conductive fluids perform theirindicated functions for one or more sealed enclosures.

FIG. 20 shows a conceptual view of a sealed enclosure 1901 enclosedwithin an enclosure 2030. The sealed enclosure 1901 shown in the figureis typical of the disclosures described in FIGS. 1, 2, 9 and isillustrated by showing FIG. 9 and includes elements from FIG. 13. Ineach case, the numbered elements have the same meaning in this FIG. 20as in the figures in which they originally appear. The embodiment thatappears in FIG. 20 is configured such that the secondary thermallyconductive fluid 148 is conducted through both the sealed enclosure 1901and a portion of a volume that is interior to the enclosure 2030 andexterior to the sealed enclosure 1901. A portion of the components usedfor pressure balancing for the sealed enclosure 1901 are disposedinterior to the enclosure 2030 and exterior to the sealed enclosure 1901and connects to the sealed enclosure 1901 using fluid-tight connectinglines 2021, 2022. The enclosure 2030 has fluid-tight entrances 2010 forpower, networking, and other control and monitoring signals andfunctions which are appropriately connected to one or more electronic orother functional devices disposed in the enclosure 2030.

An optional heat exchanger 1910 comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger removes heatfrom pressurized gaseous fluid storage 604. The pressurized gaseousfluid storage 604 may be comprised of thermally conductive materialsconfigured to effect supplemental heat removal from the fluid 108, 106that is disposed internally to the pressurized gaseous fluid storage604. In the embodiment shown, the pressurized gaseous fluid storage 604is cooled by the secondary thermally conductive fluid 148 that isreturned from the secondary fluid heat exchanger 140 via connecting line144 and flows through the heat exchanger 1910. In embodiments withmulti-phase thermally conductive fluid, the cooled pressurized gaseousfluid storage 604 serves to remove heat from the multi-phase thermallyconductive fluid 108 that is confined in the pressurized gaseous fluidstorage 604 which may further serve to condense multi-phase thermallyconductive fluid from the gaseous phase 108 into the liquid phase 106 ofsaid fluid, thereby functioning as a compressor by reducing the pressureinside the pressurized gaseous fluid storage 604 as an effect of saidphase change of the multi-phase thermally conductive fluid from thegaseous phase 108 to the liquid phase 106. The optional heat exchanger1910 or other heat exchanger comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger may be extendedand further configured to directly or indirectly remove heat fromsources such as electronic devices, batteries, motors, valves, fluidlines, or pumps. More than one sealed enclosure may be grouped togetherwithin the enclosure 2030 to form an enclosure group that is configuredin any orientation and grouped together to form a structural unit of anydimensionality.

FIG. 21 shows a conceptual view of a sealed enclosure 1901 combined withan enclosure 2030. In the embodiment, the sealed enclosure 1901 sharesone or more enclosing surfaces with the enclosure 2030. FIG. 21illustrates the shared enclosing surfaces by the designation 1901/2030indicating that an enclosing surface 1901/2030 is a structure thatperforms the functions of an enclosing surface for both a sealedenclosure 1901 and an enclosure 2030. The sealed enclosure 1901 has atleast one enclosing surface that is not shared with enclosure 2030. Theenclosure 2030 has at least one enclosing surface that is not sharedwith the sealed enclosure 1901. The sealed enclosure 1901 shown in thefigure is typical of the disclosures described in FIGS. 1, 2, 9 and isillustrated by showing FIG. 9 and includes elements from FIG. 13. Ineach case, the numbered elements have the same meaning in this FIG. 21as in the figures in which they originally appear. The embodiment thatappears in FIG. 21 is configured such that the secondary thermallyconductive fluid 148 is conducted through both the sealed enclosure 1901and a portion of a volume that is interior to the enclosure 2030 andexterior to the sealed enclosure 1901. A portion of the components usedfor pressure balancing for the sealed enclosure 1901 are disposedinterior to the enclosure 2030 and exterior to the sealed enclosure 1901and connects to the sealed enclosure 1901 using fluid-tight connectinglines 2021, 2022. The enclosure 2030 has fluid-tight entrances 2010 forpower, networking, and other control and monitoring signals andfunctions which are appropriately connected to one or more electronic orother functional devices disposed in the enclosure 2030.

An optional heat exchanger 1910 comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger removes heatfrom pressurized gaseous fluid storage 604. The pressurized gaseousfluid storage 604 may be comprised of thermally conductive materialsconfigured to effect supplemental heat removal from the fluid 108, 106that is disposed internally to the pressurized gaseous fluid storage604. In the embodiment shown, the pressurized gaseous fluid storage 604is cooled by the secondary thermally conductive fluid 148 that isreturned from the secondary fluid heat exchanger 140 via connecting line144 and flows through the heat exchanger 1910. In embodiments withmulti-phase thermally conductive fluid, the cooled pressurized gaseousfluid storage 604 serves to remove heat from the multi-phase thermallyconductive fluid 108 that is confined in the pressurized gaseous fluidstorage 604 which may further serve to condense multi-phase thermallyconductive fluid from the gaseous phase 108 into the liquid phase 106 ofsaid fluid, thereby functioning as a compressor by reducing the pressureinside the pressurized gaseous fluid storage 604 as an effect of saidphase change of the multi-phase thermally conductive fluid from thegaseous phase 108 to the liquid phase 106. The optional heat exchanger1910 or other heat exchanger comprising a concentric tube, shell andtube, plate, fin, plate-fin, or tube-fin heat exchanger may be extendedand further configured to directly or indirectly remove heat fromsources such as electronic devices, batteries, motors, valves, fluidlines, or pumps. More than one sealed enclosure 1901 may be groupedtogether within the enclosure 2030 to form an enclosure group that isconfigured in any orientation and grouped together to form a structuralunit of any dimensionality.

FIG. 22 shows an embodiment of a spacer 1701 as disclosed in FIG. 17 forthe volumetric displacement of primary dielectric thermally conductivefluid within an enclosure. The embodiment of spacer 1701 illustrated inFIG. 22 is oriented such that surface 2202 represents the top of spacer1701 and surface 2301 represents the bottom of spacer 1701. Spacer 1701may be in any orientation with respect to enclosure wall 1501. Theoperational orientation of enclosure wall 1501, electronic devices 104,spacers 1701, and any other object or feature within enclosure wall 1501will vary with respect to gravity based on orientation, location, andmovement. The surface 2212 of spacer 1701 is oriented towards one ormore electronic devices 104 which are omitted from FIG. 22 for clarity.

Spacer 1701 as embodied in FIG. 22 is comprised of multiple featureswith descriptions that include, but are not limited to, surfaces,channels, planes, walls, cutouts, holes, tubes, cavities, slots, pins,protrusions, and cutouts as exemplified by 2203, 2204, 2205, 2206, 2207,2208, 2209, 2210, 2211, 2213. Features exemplified by 2203, 2204, 2205,2206, 2207, 2208, 2209, 2210, 2211, 2213 allow one or more spacers 1701to a) be configured to occupy a portion of Electronic Device Space, b)occupy or enclose volumes outside of Electronic Device Space, c) form amounting structure for one or more electronic devices 104, d) form amounting structure for one or more other spacers 1701, and/or e) formchannels 1511, 1512 as disclosed in FIG. 15 and/or channels 1611, 1612as disclosed in FIG. 16. Any particular spacer 1701 and any featuresassociated with that spacer 1701 may occupy or enclose volumes bothinside and outside of Electronic Device Space. Spacer 1701 may not serveto direct all of the primary dielectric thermally conductive fluid 106,108 that is heated by any associated electronic device 104. The portionof primary dielectric thermally conductive fluid 106, 108 that isdirected by spacer 1701 will vary based design and operational factorsthat include, but are not limited to, a) the proximity of electronicdevice 104 to spacer 1701, b) the existence and type of physicalconnection of electronic device 104 to spacer 1701, c) the amount andrate of heat to be moved by primary dielectric thermally conductivefluid 106, 108, d) the orientation and movement of the enclosure withrespect to gravity, e) operational status of adjacent spacers 1701 andelectronic devices 104, f) the configuration of spacers 1701 in the samegroup, g) components, wiring, and connectors required by electronicdevices 104, and h) the amount and type of primary dielectric thermallyconductive fluid 106, 108 within the enclosure.

In one example of fluid flow in this embodiment, primary dielectricthermally conductive fluid 106, 108 flows across surface 2212 intofeature 2203, and away from feature 2203 across surface 2212 and/orthrough feature 2213. In another example of fluid flow in thisembodiment, primary dielectric thermally conductive fluid 106, 108 flowsthrough feature 2209 and/or across surface 2212 into feature 2206, andaway from feature 2206 across surface 2212 and/or through feature 2204.In another example of fluid flow in this embodiment, primary dielectricthermally conductive fluid 106, 108 flows across bottom 2201 and/orsurface 2212 into feature 2207 and away from feature 2207 across bottom2201 and/or surface 2212. In another example of fluid flow in thisembodiment, primary dielectric thermally conductive fluid 106, 108 flowsacross surface 2212 into feature 2210, 2211 and away from feature 2210,2211 across surface 2212. In another example of fluid flow in thisembodiment, primary dielectric thermally conductive fluid 106, 108 flowsthrough feature 2209 and/or across surface 2212 into feature 2208, andaway from feature 2208 across surface 2212 and/or through feature 2209.

In this embodiment, primary dielectric thermally conductive fluid 106,108 that flows through feature 2213, 2204 flows into feature 2205,through feature 2205 toward either side 2214 of spacer 1701, and thenaway from feature 2205 on either side 2214 of spacer 1701.

FIG. 23A, FIG. 23B, and FIG. 23C show an embodiment of a spacer 1701 asdisclosed in FIG. 17 for the volumetric displacement of primarydielectric thermally conductive fluid within an enclosure. Any referenceto FIG. 23 should be taken as a reference to FIG. 23A, FIG. 23B, and/orFIG. 23C. The embodiment of spacer 1701 illustrated in FIG. 23 isoriented such that surface 2301 represents the top of spacer 1701 andsurface 2302 represents the bottom of spacer 1701. Spacer 1701 may be inany orientation with respect to enclosure wall 1501. The operationalorientation of enclosure wall 1501, electronic devices 104, spacers1701, and any other object or feature within enclosure wall 1501 willvary with respect to gravity based on orientation, location, andmovement. The surface 2302 of spacer 1701 is oriented towards one ormore electronic devices 104 which are omitted from FIG. 23 for clarity.

Spacer 1701 as embodied in FIG. 23 is comprised of multiple featureswith descriptions that include, but are not limited to, surfaces,channels, planes, walls, cutouts, holes, tubes, cavities, slots, pins,protrusions, and cutouts as exemplified by 2303, 2304, 2305, 2306, 2307,2308, 2309, 2310, 2313, 2315, 2316, 2318, 2319, 2320, 2321, 2323, 2324,2326, 2327, 2328, 2329, 2330, 2331, 2332. Features exemplified by 2303,2304, 2305, 2306, 2307, 2308, 2309, 2310, 2313, 2315, 2316, 2318, 2319,2320, 2321, 2323, 2324, 2326, 2327, 2328, 2329, 2330, 2331, 2332 allowone or more spacers 1701 to a) be configured to occupy a portion ofElectronic Device Space, b) occupy or enclose volumes outside ofElectronic Device Space, c) form a mounting structure for one or moreelectronic devices 104, d) form a mounting structure for one or moreother spacers 1701, and/or e) form channels 1511, 1512 as disclosed inFIG. 15 and/or channels 1611, 1612 as disclosed in FIG. 16. Anyparticular spacer 1701 and any features associated with that spacer 1701may occupy or enclose volumes both inside and outside of ElectronicDevice Space. Spacer 1701 may not serve to direct all of the primarydielectric thermally conductive fluid 106, 108 that is heated by anyassociated electronic device 104. The portion of primary dielectricthermally conductive fluid 106, 108 that is directed by spacer 1701 willvary based design and operational factors that include, but are notlimited to, a) the proximity of electronic device 104 to spacer 1701, b)the existence and type of physical connection of electronic device 104to spacer 1701, c) the amount and rate of heat to be moved by primarydielectric thermally conductive fluid 106, 108, d) the orientation andmovement of the enclosure with respect to gravity, e) operational statusof adjacent spacers 1701 and electronic devices 104, f) theconfiguration of spacers 1701 in the same group, g) components, wiring,and connectors required by electronic devices 104, and h) the amount andtype of primary dielectric thermally conductive fluid 106, 108 withinthe enclosure.

In one example of fluid flow in this embodiment, primary dielectricthermally conductive fluid 106, 108 flows through feature 2308, 2319,2320 and/or across surface 2302 into feature 2306, and away from feature2306 a) across surface 2302, b) through feature 2304 into 2305 andtoward side 2361, 2363 to exit 2305 or flow into optional channel 2353,and/or c) through feature 2315 into 2316 and toward side 2361 to exit2316 or flow into optional channel 2352. In another example of fluidflow in this embodiment, primary dielectric thermally conductive fluid106, 108 flows across surface 2302 into feature 2303, and away fromfeature 2303 a) across surface 2302, and/or b) through feature 2313 into2305 and toward side 2361, 2363 to exit 2305 or flow into optionalchannel 2353. In another example of fluid flow in this embodiment,primary dielectric thermally conductive fluid 106, 108 flows acrosssurface 2302 into feature 2331, and away from feature 2331 a) acrosssurface 2302, and/or b) through feature 2332 into 2305 and toward side2361, 2363 to exit 2305 or flow into optional channel 2353. In anotherexample of fluid flow in this embodiment, primary dielectric thermallyconductive fluid 106, 108 flows into feature 2307 and/or across surface2302, 2362 into feature 2307, and away from feature 2307 a) acrosssurface 2302 and/or b) by moving towards side 2362 to exit side 2362. Inanother example of fluid flow in this embodiment, primary dielectricthermally conductive fluid 106, 108 flows into feature 2328, throughoptional channel 2353 into feature 2328, and/or across surface 2302,2364 into feature 2328, and away from feature 2328 a) across surface2302 and/or b) by moving towards side 2364 to exit side 2364 or flowinginto optional channel 2353. In another example of fluid flow in thisembodiment, primary dielectric thermally conductive fluid 106, 108 flowsacross surface 2302 into feature 2326, and away from feature 2326 a)across surface 2302, and/or b) through feature 2327 into 2324 and towardside 2362 to exit 2324 or flow into optional channel 2351. In anotherexample of fluid flow in this embodiment, primary dielectric thermallyconductive fluid 106, 108 flows through feature 2318, 2310 and/or acrosssurface 2302 into feature 2309, and away from feature 2309 a) acrosssurface 2302, and/or b) through feature 2310 toward side 2361 to exit2310 or flow into optional channel 2352, 2353. In another example offluid flow in this embodiment, primary dielectric thermally conductivefluid 106, 108 flows across surface 2302 into feature 2321, and awayfrom feature 2321 a) across surface 2302, and/or b) into 2323 and towardside 2362 to exit 2323 or flow into optional channel 2351. In anotherexample of fluid flow in this embodiment, primary dielectric thermallyconductive fluid 106, 108 flows across surface 2302 into feature 2329,and away from feature 2329 a) across surface 2302, and/or b) into 2330and toward side 2363 to exit 2330. In another example of fluid flow inthis embodiment, primary dielectric thermally conductive fluid 106, 108flows across surface 2302 and the surface of adjacent electronic device104 where the primary dielectric thermally conductive fluid 106, 108 isheated and rises to contact surface 2302 and is directed to side 2361,2362, 2363, 2364 by surface 2302.

In this embodiment, some of the flows of primary dielectric thermallyconductive fluid 106, 108 describe a flow in which the primarydielectric thermally conductive fluid 106, 108 moves upward withoutdirection by spacer 1701 to first contact 2302, 2307, 2309, 2321, 2328,or 2329 where the primary dielectric thermally conductive fluid 106, 108is first directed towards side 2361, 2362, 2363, 2364 to either exitspacer 1701 or flow into optional channel 2351, 2352, 2353. Oneembodiment of spacer 1701 shown in FIG. 23B, and FIG. 23C comprisesadditional features 2341, 2342, 2343 located outside of ElectronicDevice Space that form channels 2351, 2352, 2353 to direct an upwardflow of primary dielectric thermally conductive fluid 106, 108 thatexits sides 2361, 2362, 2363, 2364. Multiple spacers 1701 may bepositioned adjacently to align features 2341, 2342, 2343 to effectivelyprovide a continuous channel 2351, 2352, 2353 to direct an upward flowof primary dielectric thermally conductive fluid 106, 108 toward the topof the enclosure.

Although example diagrams to implement the elements of the disclosedsubject matter have been provided, one skilled in the art, using thisdisclosure, could develop additional embodiments to practice thedisclosed subject matter and each is intended to be included herein.

In addition to the above described embodiments, those skilled in the artwill appreciate that this disclosure has application in a variety ofarts and situations and this disclosure is intended to include the same.

What is claimed is:
 1. A system for facilitating transfer of thermalenergy from a volume of a containment vessel, said system comprising:said containment vessel enclosing said volume; a primary dielectricthermally conductive fluid at least partially filling said volume ofsaid containment vessel; at least one heat-generating electronic deviceimmersed in the primary dielectric thermally conductive fluid disposedwithin said volume of said containment vessel; at least one solid orsealed hollow structure disposed in said volume of said containmentvessel for a volumetric displacement of said primary dielectricthermally conductive fluid disposed within said containment vessel, saidat least one solid or sealed hollow structure adjacent to one of more ofsaid at least one heat-generating electronic device, said at least onesolid or sealed hollow structure is arranged to form at least onechannel for directing a flow of a portion of said primary dielectricthermally conductive fluid towards at least one side of said at leastone solid or sealed hollow structure, wherein said at least one channelof said at least one solid or sealed hollow structure comprises: atleast one feature configured to receive an upward flow of said portionof said primary dielectric thermally conductive fluid and to direct aflow of said portion of said primary dielectric thermally conductivefluid to exit said at least one feature at said at least one side ofsaid at least one solid or sealed hollow structure, thereby preventingsaid portion of said primary dielectric thermally conductive fluid fromrising directly above said at least one heat-generating electronicdevice, said at least one feature comprising: at least one first end influid communication with said upward flow of said portion of saidprimary dielectric thermally conductive fluid; an opposing at least onesecond end at said at least one side of said at least one solid orsealed hollow structure; and an upper surface preventing said portion ofprimary dielectric thermally conductive fluid from said rising directlyabove said at least one heat-generating electronic device.
 2. The systemof claim 1, wherein said primary dielectric thermally conductive fluidis a multi-phased fluid.
 3. The system of claim 1, wherein at least aportion of said at least one channel is oriented in at least one of avertical or an inclined upwards direction.
 4. The system of claim 1,wherein the at least one feature is configured to direct the receivedflow in a substantially sideways direction.
 5. The system of claim 1,further comprising an electronic device space defined by a maximumheight, a maximum width, and a maximum length dimensions of the at leastone heat-generating electronic device excluding the space occupied bythe at least one heat-generating electronic device, wherein said atleast one solid or sealed hollow structure extends outside of theelectronic device space.
 6. The system of claim 5, further comprising atleast one channel positioned outside of said electrical device spacethat is configured to direct the upward flow of said portion of saidprimary dielectric thermally conductive fluid in a substantially upwarddirection.
 7. The system of claim 1, wherein a portion of the at leastone solid or sealed hollow structure is configured to have adimensionality that forms a reflected image of at least a portion of asurface of the at least one heat-generating electronic device.
 8. Thesystem of claim 7, wherein one or more portions of the reflected imageportion are in direct thermal contact with the at least the portion ofthe surface of the at least one heat-generating electronic device. 9.The system of claim 1, wherein the at least one solid or sealed hollowstructure forms a mounting structure for the at least oneheat-generating electronic device.
 10. The system of claim 1, whereinthe at least one solid or sealed hollow structure comprises a pluralityof at least one solid or sealed hollow structures, a plurality of the atleast one solid or sealed hollow structures are connected to form astructural unit of any dimensionality.
 11. The system of claim 1,wherein the at least one solid or sealed hollow structure is configuredas a heat exchange mechanism.
 12. The system of claim 1, wherein the atleast one solid or sealed hollow structure is oriented in one of asubstantially vertical orientation and a substantially horizontalorientation.
 13. The system of claim 1, wherein said volume is sealed.14. A method for facilitating transfer of thermal energy from a volumeof a containment vessel, said method comprising: providing thecontainment vessel enclosing said volume; filling at least partiallysaid volume of said containment vessel with a primary dielectricthermally conductive fluid; disposing at least one heat-generatingelectronic device immersed in the primary dielectric thermallyconductive fluid within said volume of said containment vessel;disposing solid or sealed hollow structures in said volume of saidcontainment vessel for a volumetric displacement of said primarydielectric thermally conductive fluid disposed within said containmentvessel, said at least one solid or sealed hollow structure adjacent toone of more of said at least one heat-generating electronic device, saidat least one solid or sealed hollow structure is arranged to form atleast one channel for directing a flow of a portion of said primarydielectric thermally conductive fluid towards at least one side of saidat least one solid or sealed hollow structure, wherein said at least onechannel of said at least one solid or sealed hollow structure comprises:at least one feature configured to receive an upward flow of saidportion of said primary dielectric thermally conductive fluid and todirect a flow of said portion of said primary dielectric thermallyconductive fluid to exit said at least one feature at said at least oneside of said at least one solid or sealed hollow structure, therebypreventing said portion of said primary dielectric thermally conductivefluid from rising directly above said at least one heat-generatingelectronic device, said at least one feature comprising: at least onefirst end in fluid communication with said upward flow of said portionof said primary dielectric thermally conductive fluid; an opposing atleast one second end at said at least one side of said at least onesolid or sealed hollow structure; and an upper surface preventing saidportion of primary dielectric thermally conductive fluid from saidrising directly above said at least one heat-generating electronicdevice.
 15. The method of claim 14, wherein said primary dielectricthermally conductive fluid is a multi-phased fluid.
 16. The method ofclaim 14, wherein at least a portion of said at least one channel isoriented in at least one of a vertical or an inclined upwards direction.17. The method of claim 14, wherein the at least one feature configuredto direct the received flow in a substantially sideways direction. 18.The method of claim 14, further comprising providing an electronicdevice space defined by a maximum height, a maximum width, and a maximumlength dimensions of the at least one heat-generating electronic deviceexcluding the space occupied by the at least one heat-generatingelectronic device, wherein said at least one solid or sealed hollowstructure extends outside of the electronic device space.
 19. The methodof claim 18, further comprising at least one channel positioned outsideof said electrical device space that is configured to direct the upwardflow of said portion of said primary dielectric thermally conductivefluid in a substantially upward direction.
 20. The method of claim 14,wherein a portion of the at least one solid or sealed hollow structureis configured to have a dimensionality that forms a reflected image ofat least a portion of a surface of the at least one heat-generatingelectronic device.
 21. The method of claim 20, wherein one or moreportions of the reflected image portion are in direct thermal contactwith the at least the portion of the surface of the at least oneheat-generating electronic device.
 22. The method of claim 14, whereinthe at least one solid or sealed hollow structure forms a mountingstructure for the at least one heat-generating electronic device. 23.The method of claim 14, wherein the at least one solid or sealed hollowstructure comprises a plurality of at least one solid or sealed hollowstructures, a plurality of the at least one solid or sealed hollowstructures are connected to form a structural unit of anydimensionality.
 24. The method of claim 14, wherein the at least onesolid or sealed hollow structure is configured as a heat exchangemechanism.
 25. The method of claim 14, wherein the at least one solid orsealed hollow structure is oriented in one of a substantially verticalorientation and a substantially horizontal orientation.
 26. The methodof claim 14, wherein said volume is sealed.